CA986772A - Selective metallization of nonconductors - Google Patents
Selective metallization of nonconductorsInfo
- Publication number
- CA986772A CA986772A CA178,467A CA178467A CA986772A CA 986772 A CA986772 A CA 986772A CA 178467 A CA178467 A CA 178467A CA 986772 A CA986772 A CA 986772A
- Authority
- CA
- Canada
- Prior art keywords
- nonconductors
- selective metallization
- metallization
- selective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0565—Resist used only for applying catalyst, not for plating itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31689272A | 1972-12-20 | 1972-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA986772A true CA986772A (en) | 1976-04-06 |
Family
ID=23231157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA178,467A Expired CA986772A (en) | 1972-12-20 | 1973-08-09 | Selective metallization of nonconductors |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS4990640A (en) |
BE (1) | BE804148A (en) |
CA (1) | CA986772A (en) |
DE (1) | DE2363099A1 (en) |
FR (1) | FR2211545B1 (en) |
GB (1) | GB1429705A (en) |
IT (1) | IT993485B (en) |
NL (1) | NL7311039A (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59147430A (en) * | 1983-02-10 | 1984-08-23 | Oki Electric Ind Co Ltd | Formation of fine pattern |
US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
JPS62185895A (en) * | 1986-02-10 | 1987-08-14 | Mitsubishi Motors Corp | Partial plating method |
JPS62185896A (en) * | 1986-02-10 | 1987-08-14 | Mitsubishi Motors Corp | Partial plating method |
JPS62185892A (en) * | 1986-02-10 | 1987-08-14 | Kurihara Tokin Kojo:Kk | Formation of stereoscopic pattern by electroplating |
US4782007A (en) * | 1987-04-28 | 1988-11-01 | Macdermid, Incorporated | Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists |
US4971715A (en) * | 1988-11-18 | 1990-11-20 | International Business Machines Corporation | Phenolic-free stripping composition and use thereof |
US6524645B1 (en) * | 1994-10-18 | 2003-02-25 | Agere Systems Inc. | Process for the electroless deposition of metal on a substrate |
GB2384493A (en) * | 2002-01-23 | 2003-07-30 | Oxley Dev Co Ltd | Selective electroless plating of ceramic substrates for use in capacitors |
JP5046495B2 (en) * | 2005-04-18 | 2012-10-10 | セーレン株式会社 | Transparent conductive film and method for producing the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI3A (en) * | 1843-11-08 | Press members |
-
1973
- 1973-08-09 CA CA178,467A patent/CA986772A/en not_active Expired
- 1973-08-09 NL NL7311039A patent/NL7311039A/xx not_active Application Discontinuation
- 1973-08-29 BE BE135047A patent/BE804148A/en unknown
- 1973-09-28 IT IT2952573A patent/IT993485B/en active
- 1973-09-28 JP JP10859273A patent/JPS4990640A/ja active Pending
- 1973-10-09 FR FR7335975A patent/FR2211545B1/fr not_active Expired
- 1973-11-29 GB GB5535273A patent/GB1429705A/en not_active Expired
- 1973-12-19 DE DE19732363099 patent/DE2363099A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2211545A1 (en) | 1974-07-19 |
DE2363099A1 (en) | 1974-07-04 |
JPS4990640A (en) | 1974-08-29 |
IT993485B (en) | 1975-09-30 |
BE804148A (en) | 1973-12-17 |
NL7311039A (en) | 1974-06-24 |
FR2211545B1 (en) | 1977-08-12 |
GB1429705A (en) | 1976-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA951946A (en) | Self-straining bolts | |
AU462348B2 (en) | Saf-t-jet | |
CA986489A (en) | Plumbing structure | |
AU454372B2 (en) | Childsafe actuator-overcap | |
AU469300B2 (en) | Complex of 7-dimethylamino-6-demethyl-6-deoxytetracycline hydrochloride | |
CA986772A (en) | Selective metallization of nonconductors | |
AU471800B2 (en) | Novel imidazolidine derivatives | |
CA969681A (en) | Seat construction | |
AU464733B2 (en) | Muffler | |
CA976437A (en) | Silencer | |
AU4575372A (en) | 2-acyl-5-nitrothiazoles | |
CA980675A (en) | Readjustable chair | |
CA899001A (en) | Girdle | |
CA915577A (en) | Selective interval packer | |
CA910809A (en) | Selective interval packer | |
CA893700A (en) | Urea derivative | |
AU482124B2 (en) | Metallisation process | |
CA904332A (en) | Urea derivatives | |
CA916164A (en) | N-cyanacetyl o-phenylenediamines | |
CA917022A (en) | Silencer | |
CA892376A (en) | Well-stimulation technique | |
CA889841A (en) | 5-nitro-furfural piperazinealkanoyl hydrazones | |
CA979200A (en) | Deburring devices | |
AU462330B2 (en) | Seat | |
CA895104A (en) | Glass-packed mufflers |