JPS62185892A - Formation of stereoscopic pattern by electroplating - Google Patents
Formation of stereoscopic pattern by electroplatingInfo
- Publication number
- JPS62185892A JPS62185892A JP2749086A JP2749086A JPS62185892A JP S62185892 A JPS62185892 A JP S62185892A JP 2749086 A JP2749086 A JP 2749086A JP 2749086 A JP2749086 A JP 2749086A JP S62185892 A JPS62185892 A JP S62185892A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- pattern
- resist layer
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 15
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 238000007747 plating Methods 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000002659 electrodeposit Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 abstract description 10
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 4
- 238000011282 treatment Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 210000003462 vein Anatomy 0.000 description 4
- 229930014626 natural product Natural products 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は写植技術を利用して微細な模様を正確に金属表
、面上に再現でき、しかも電着によるパターンの肉盛シ
効果により視覚的立体感に優れた全縞模様層を形成でき
る電気メッキによる立体的模様形成方法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention uses phototypesetting technology to accurately reproduce minute patterns on metal surfaces, and furthermore, the overlay effect of the pattern by electrodeposition makes it visually appealing. The present invention relates to a method for forming a three-dimensional pattern by electroplating, which can form a full striped pattern layer with excellent three-dimensional effect.
（従来の技術）
エツチング処理によシ金属表面に模様を形成する方法は
従来から知られている。この従来法によれば、金属表面
に感光性樹脂層を形成し、これにパターン模様焼付用フ
ィルムを介して紫外線を照射する工程及び現像工程を経
てパターン樹脂層を形成し、エツチング液に浸漬してパ
ターン樹脂層非形成部の露出金属を溶解して凹部を形成
し９次いでパターン樹脂層を溶解除去するととｋより。(Prior Art) A method of forming a pattern on a metal surface by an etching process is conventionally known. According to this conventional method, a photosensitive resin layer is formed on the metal surface, a patterned resin layer is formed through a process of irradiating ultraviolet rays on the metal surface through a pattern printing film, and a developing process, and then immersed in an etching solution. Then, the exposed metal in the part where the patterned resin layer is not formed is dissolved to form a recessed part, and then the patterned resin layer is dissolved and removed.
凹状のパターン模様を金属表面に形成するものである（
以下、これを第１の従来法という）。It forms a concave pattern on the metal surface (
Hereinafter, this will be referred to as the first conventional method).
また金属表面にスクリーン印刷でレジスト層を所定パタ
ーン状く形成し、金属露出部に電気メッキを施した後、
レジスト層を溶解除去し、電着金属による凸状金属模様
層を形成する方法も知られている（以下、これを第２の
従来法という）。In addition, after forming a resist layer in a predetermined pattern on the metal surface by screen printing and electroplating the exposed metal parts,
A method is also known in which a resist layer is dissolved and removed to form a convex metal pattern layer made of electrodeposited metal (hereinafter, this method will be referred to as the second conventional method).
（発明が解決しようとする問題点）
第１の従来法においては、エツチング処理を行なうため
金属下地が荒れ、その結果、電解メッキを施しても鏡面
光沢が得られないという欠点がある。またエツチング処
理の際、金属下地は下方末広がシ状に（即ち断面アリ溝
状Ｋ）侵蝕溶解されるので鋭角な角隅部が生じ、触覚的
に違和感があり、直接手で触れると手に切傷を生じる虞
れがあシ、取扱い上不便であった。(Problems to be Solved by the Invention) The first conventional method has the drawback that the etching process roughens the metal base, and as a result, mirror gloss cannot be obtained even if electrolytic plating is performed. Furthermore, during the etching process, the metal base is eroded and dissolved in a downward-spreading square shape (that is, a dovetail-shaped cross section), resulting in sharp corners that give a tactile sensation, and if you touch it directly, it will touch your hand. There was a risk of causing cuts and it was inconvenient to handle.
また第２の従来法においては微細なパターン模様を形成
できないという欠点があった。Furthermore, the second conventional method has the disadvantage that a fine pattern cannot be formed.
（問題点を解決するための手段）
本発明者等は鋭意研究した結果、フォトレジスト層の形
成によって微細な模様形成が可能となることを見出し本
発明を完成するに至った。(Means for Solving the Problems) As a result of intensive research, the present inventors discovered that formation of a fine pattern becomes possible by forming a photoresist layer, and completed the present invention.
即ち１本発明は金属表面に感光性樹脂からなるレジスト
層を形成し、これに、所望の模様が画像形成されている
焼付用フィルムを介して紫外線を照射して感光処理を行
ない９次いで現像して硬化レジスト層をパターン形成し
、電気メッキを施して金属露出部分にのみ選択的に金属
を電着させ。Namely, in the present invention, a resist layer made of a photosensitive resin is formed on a metal surface, and this is exposed to ultraviolet light through a printing film on which a desired pattern is formed, and then developed. The cured resist layer is then patterned and electroplated to selectively electrodeposit metal only on exposed metal areas.
しかる後硬化レジスト層を除去して電着金属による凸状
金属模様層を形成することを特徴とする電気メッキによ
る立体的模様形成方法である。This method of forming a three-dimensional pattern by electroplating is characterized in that the hardened resist layer is then removed to form a convex metal pattern layer made of electrodeposited metal.
（実施例） 以下９本発明の実施例を図面を参照して説明する。(Example) Hereinafter, nine embodiments of the present invention will be described with reference to the drawings.
金属製品１の表面に感光性樹脂からなるフォトレジスト
を塗布してレジスト層２ｔ−形成し、第１図に示すよう
にこのレジスト層２上に、所望の模様が陰画として形成
されている焼付用フィルム３を設置し、その上方よシ紫
外線４を照射して感光処理を行なう。５は紫外線ランプ
である。A photoresist made of a photosensitive resin is applied to the surface of the metal product 1 to form a resist layer 2t, and a desired pattern is formed as a negative image on this resist layer 2 as shown in FIG. A film 3 is placed, and ultraviolet rays 4 are irradiated above it for photosensitive treatment. 5 is an ultraviolet lamp.
金属製品１の材質としては金、銀、銅、銅合金。The materials of the metal product 1 include gold, silver, copper, and copper alloy.
鉄、鉛合金、亜鉛合金等が挙けられる。またこれらの金
属製品は下地メッキとして、銅、ニッケル。Examples include iron, lead alloy, zinc alloy, etc. These metal products also use copper and nickel as the base plating.
銀等のメッキを５〜２０μ程度、電着したものを使用す
る。Use electrodeposited silver or the like to a thickness of about 5 to 20 μm.
レジスト層２を形成する感光性樹脂としては。As a photosensitive resin forming the resist layer 2.
市販のものを用いることができる。レジスト層２の厚み
は通常、５〜１５μである。Commercially available products can be used. The thickness of the resist layer 2 is usually 5 to 15 microns.
焼付用フィルム３を通して紫外線４を照射するととくよ
シワレジスト層２には硬化部と未硬化部が生じる。第２
図中、６は硬化レジスト層、７は未硬化レジスト層であ
る。When ultraviolet rays 4 are irradiated through the baking film 3, hardened portions and uncured portions are generated in the wrinkle resist layer 2. Second
In the figure, 6 is a hardened resist layer, and 7 is an unhardened resist layer.
このように硬化レジスト層６と未硬化レジスト層７とが
形成された被処理材８を現像液の中に浸漬し、未硬化レ
ジスト層７ｔ−現像液に溶解する。The material to be treated 8 on which the hardened resist layer 6 and the unhardened resist layer 7 are formed is immersed in a developer, and the unhardened resist layer 7t is dissolved in the developer.
その結果、第３図に示すように、硬化レジスト層相互間
が凹状となったパターン樹脂層９が形成される。As a result, as shown in FIG. 3, a patterned resin layer 9 is formed in which the cured resist layers are concave.
現像液は未硬化レジスト層を溶解するものであればよく
、感光性樹脂用として用いられている市販の現像液を使
用できる。Any developer can be used as long as it dissolves the uncured resist layer, and commercially available developers used for photosensitive resins can be used.
次に被処理材８に電気メッキを施し、金属露出部分にの
み選択的に金属を電着させる（第４図）。Next, the material 8 to be treated is electroplated, and metal is selectively electrodeposited only on exposed metal parts (FIG. 4).
電着金属１０としては鋼、ニッケル、銀、金等が挙げら
れるが銅が一般的である。Examples of the electrodeposited metal 10 include steel, nickel, silver, and gold, but copper is commonly used.
電気メツキ処理終了後、電着金属１０の表面に第５図に
示す如く、装飾メッキを施し、装飾メッキ層寥１を形成
する。この装飾メッキは電解メッキでも或いは無電解メ
ッキでもよい。メッキ層１１の厚みは、０．５〜１０μ
であり、ｔた装飾メッキの金属としては金、銀、クロム
、黒クロム。After the electroplating process is completed, decorative plating is applied to the surface of the electrodeposited metal 10, as shown in FIG. 5, to form a decorative plating layer 1. This decorative plating may be electrolytic plating or electroless plating. The thickness of the plating layer 11 is 0.5 to 10μ
The decorative plating metals include gold, silver, chrome, and black chrome.
ロジウム、白金、黒ニッケル等が挙げられ９通常。Examples include rhodium, platinum, black nickel, etc. 9 Usually.
金、銀が用いられる。Gold and silver are used.
電着金属及び装飾メッキ層を形成してなる被処理材は次
に剥離液中に浸漬される。剥離液によシ硬化レジスト層
６が溶解除去され、それによシ。The treated material on which the electrodeposited metal and decorative plating layer have been formed is then immersed in a stripping solution. The hardened resist layer 6 is dissolved and removed by the stripping solution, and then removed.
電着金属１０による凸状金属模様層１２が形成される。A convex metal pattern layer 12 of electrodeposited metal 10 is formed.
上記剥離液は電着金属及び装飾メッキ層を溶解せず、硬
化レジスト層を溶解するものであればよく、この剥離液
としては、感光性樹脂用として用いられている市販の剥
離液を使用できる。The above-mentioned stripping solution may be one that does not dissolve the electrodeposited metal and the decorative plating layer but dissolves the cured resist layer. As this stripping solution, a commercially available stripping solution used for photosensitive resins can be used. .
本発明における模様層１２は天然物の例えば葉効
脈模様等の精密な絵柄模様である場合にその曹来が大き
いが１本発明は天然物模様に限定されず。In the present invention, the pattern layer 12 has a large spacing when it is a precise pattern of natural products, such as a leaf vein pattern, but the present invention is not limited to patterns of natural products.
種々の模様の形成が可能である。Various patterns can be formed.
本発明方法により立体的金属模様を形成された製品は表
札、絵画、装飾工芸品等として広汎な用途に用いること
ができる。Products with three-dimensional metal patterns formed by the method of the present invention can be used in a wide range of applications such as nameplates, paintings, decorative crafts, etc.
次に９本発明の具体的な実施例を挙げて本発明を更に＃
細に説明する。Next, the present invention will be further explained by giving 9 specific examples of the present invention.
Explain in detail.
実施例
厚さ１．０顛の黄銅板の表面に下地メッキとして銀メッ
キを１０μ電着し、その上に市販の感光性樹脂（東京応
化工業■製、ＥＰＰＲネガを油性フォトレジスト）を厚
さ８μに塗布し、乾燥してレジスト層を形成した。この
レジスト層の上に葉脈模様が画像形成されているネガフ
ィルムを当て、上方よシ紫外線を照射した。光源として
は高圧水銀灯（２ｋｌ）を使用し、波長４ＱＱｍ、距Ｉ
１１１ ｍ ＋照射時間１分の条件で行逢った。Example: 10 μm of silver plating was electrodeposited as a base plating on the surface of a brass plate with a thickness of 1.0 mm, and a commercially available photosensitive resin (manufactured by Tokyo Ohka Kogyo ■, EPPR negative oil-based photoresist) was applied on top of it to a thickness of 1.0 μm. It was applied to a thickness of 8μ and dried to form a resist layer. A negative film on which a leaf vein pattern was imaged was placed on top of this resist layer, and ultraviolet rays were irradiated upward. A high-pressure mercury lamp (2kl) was used as the light source, with a wavelength of 4QQm and a distance of I.
The experiment was carried out under the conditions of 111 m + irradiation time of 1 minute.
次いで、被処理材を現像液（東京応化工業■製。Next, the material to be treated is mixed with a developer (manufactured by Tokyo Ohka Kogyo ■).
ＥＰＰＲ現像液現像液中に浸漬して現像処理を行なった
。Development processing was performed by immersing it in an EPPR developer.
現像液中よシ被処理材を引き出し、充分に水洗し、乾燥
した後、下記条件にて電気メッキ（パターンメッキ）を
行ない、銅をレジスト間凹所に電着させな。After pulling out the material to be processed from the developer, washing it thoroughly with water and drying it, perform electroplating (pattern plating) under the following conditions so that copper is electrodeposited in the recesses between the resists.
電気メツキ条件
ｌ）メッキ沿組成
硫酸鋼 １５０１／１
硫 酸 １００１／１
添加剤 少量
２）電流密度５ Ａ ／ ｄｍＪ 、メッキ沿温度２５
℃。Electroplating conditions 1) Plating temperature creeping sulfuric acid steel 1501/1 Sulfuric acid 1001/1 Additive small amount 2) Current density 5 A / dmJ, plating temperature creeping 25
℃.
空気攪拌（カソードロッカー）、処理時間２０分
電気メツキ処理後、電流密度ＩＡ／ｄｉ、処理時間ｌＯ
分の条件にて装飾メッキを行ない、パターンメッキによ
る電着金属の表面に金メッキ層を形成した。Air stirring (cathode rocker), processing time 20 minutes after electroplating, current density IA/di, processing time 1O
Decorative plating was performed under the following conditions to form a gold plating layer on the surface of the electrodeposited metal by pattern plating.
次に、剥離液（東京応化工業■製、ＥＰＰＲ剥離液Ａ）
中に被処理材を浸漬して残シのレジストを溶解除去した
。Next, a stripping solution (manufactured by Tokyo Ohka Kogyo ■, EPPR stripping solution A)
The material to be treated was immersed in the solution to dissolve and remove the remaining resist.
而して葉脈模様が凸状に形成された金属板が得られたが
、このものを観察したところ、鏡面光沢に優れ、しかも
ネガフィルムにおける葉脈画像が微細に再現されている
ことが認められた。As a result, a metal plate with a convex pattern of leaf veins was obtained, and when it was observed, it was found that it had excellent specular gloss and that the leaf vein image in the negative film was minutely reproduced. .
（発明の効果）
本発明は、従来のようにエツチング処理を行なわないた
め金属下地が荒れるという問題点を解消でき、その結果
、メッキ処理を施した際に鏡面光沢が得られ、外観上優
れ九模様を形成できる効果がある。(Effects of the Invention) The present invention solves the problem of roughening of the metal base due to no etching treatment as in the past, and as a result, when plating is applied, a specular gloss is obtained, resulting in an excellent appearance. It has the effect of forming a pattern.
また本発明は電気メッキによシ凸状金属模様層を形成す
るため模様層の角隅部には丸味が生じ。Further, in the present invention, since the convex metal pattern layer is formed by electroplating, the corners of the pattern layer are rounded.
その結果、従来のように鋭角状の角隅部による触覚的な
違和感や手の切傷の虞れが解消するばかシか、外観上も
ソフト感が出て外観向上に寄与できるものである。As a result, the tactile discomfort caused by the sharp corners and the risk of cuts to the hands, which are conventional, are eliminated, and the appearance is also softer, contributing to an improved appearance.
更に本発明によれば、電気メッキにより凸状金属模様層
を形成するので肉盛シ感が出て、視覚的立体感に優れた
金属模様層を形成できる効果がある。Further, according to the present invention, since the convex metal pattern layer is formed by electroplating, it is possible to form a metal pattern layer with a built-up feel and excellent visual three-dimensional effect.
また本発明は金属模様層を形成するに当シ、・感光性樹
脂からなるレジスト層を形成し、感光、現像工程を経る
ため微細な模様形成が可能となシ。Further, in the present invention, when forming a metal pattern layer, a resist layer made of a photosensitive resin is formed, and a fine pattern can be formed through exposure and development steps.
例えば天然物等の緻密な模様を金属模様として正確に且
つ高精度に再現でき、従って本発明方法により模様形成
を行なえば、商品価値の高い製品を得ることができる利
点がある。For example, dense patterns such as those of natural products can be reproduced accurately and with high precision as metal patterns. Therefore, if patterns are formed by the method of the present invention, products with high commercial value can be obtained.
第１図〜第６図は本発明における金属模様形成工程を示
す説明図である。
２＝＝−レジスト層 ３−＝−焼付用フイルム６−ｍ
−硬化レジスト層 １Ｇ＝−電着金属１２−一一凸状
金属模様層FIGS. 1 to 6 are explanatory diagrams showing the metal pattern forming process in the present invention. 2==-Resist layer 3-=-Baking film 6-m
-Hardened resist layer 1G=-electrodeposited metal 12-11 convex metal pattern layer
Claims (1)
れに、所望の模様が画像形成されている焼付用フィルム
を介して紫外線を照射して感光処理を行ない、次いで現
像して硬化レジスト層をパターン形成し、電気メッキを
施して金属露出部分にのみ選択的に金属を電着させ、し
かる後硬化レジスト層を除去して電着金属による凸状金
属模様層を形成することを特徴とする電気メッキによる
立体的模様形成方法。A resist layer made of a photosensitive resin is formed on the metal surface, and then exposed to ultraviolet light through a baking film on which a desired pattern has been formed, and then developed to form a hardened resist layer. An electroplating method comprising forming a pattern, applying electroplating to selectively electrodeposit metal only on exposed metal parts, and then removing the hardened resist layer to form a convex metal pattern layer of electrodeposited metal. A method of forming three-dimensional patterns by plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2749086A JPS62185892A (en) | 1986-02-10 | 1986-02-10 | Formation of stereoscopic pattern by electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2749086A JPS62185892A (en) | 1986-02-10 | 1986-02-10 | Formation of stereoscopic pattern by electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62185892A true JPS62185892A (en) | 1987-08-14 |
Family
ID=12222574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2749086A Pending JPS62185892A (en) | 1986-02-10 | 1986-02-10 | Formation of stereoscopic pattern by electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62185892A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4990640A (en) * | 1972-12-20 | 1974-08-29 | ||
| JPS5970755A (en) * | 1982-09-30 | 1984-04-21 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Automatic electrochemical treating device using energy beam |
-
1986
- 1986-02-10 JP JP2749086A patent/JPS62185892A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4990640A (en) * | 1972-12-20 | 1974-08-29 | ||
| JPS5970755A (en) * | 1982-09-30 | 1984-04-21 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Automatic electrochemical treating device using energy beam |
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