GB1418519A - Pressure sensitive semiconductor device and method of manufacture thereof - Google Patents

Pressure sensitive semiconductor device and method of manufacture thereof

Info

Publication number
GB1418519A
GB1418519A GB1359073A GB1359073A GB1418519A GB 1418519 A GB1418519 A GB 1418519A GB 1359073 A GB1359073 A GB 1359073A GB 1359073 A GB1359073 A GB 1359073A GB 1418519 A GB1418519 A GB 1418519A
Authority
GB
United Kingdom
Prior art keywords
film
sio
layer
sno
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1359073A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of GB1418519A publication Critical patent/GB1418519A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50Devices controlled by mechanical forces, e.g. pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82Heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
GB1359073A 1972-03-21 1973-03-21 Pressure sensitive semiconductor device and method of manufacture thereof Expired GB1418519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2878872A JPS5317031B2 (enrdf_load_stackoverflow) 1972-03-21 1972-03-21

Publications (1)

Publication Number Publication Date
GB1418519A true GB1418519A (en) 1975-12-24

Family

ID=12258155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1359073A Expired GB1418519A (en) 1972-03-21 1973-03-21 Pressure sensitive semiconductor device and method of manufacture thereof

Country Status (6)

Country Link
JP (1) JPS5317031B2 (enrdf_load_stackoverflow)
CA (1) CA959975A (enrdf_load_stackoverflow)
DE (1) DE2313604C3 (enrdf_load_stackoverflow)
FR (1) FR2180687B1 (enrdf_load_stackoverflow)
GB (1) GB1418519A (enrdf_load_stackoverflow)
IT (1) IT981527B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114982254A (zh) * 2019-12-05 2022-08-30 阿汤姆H2O有限责任公司 单壁碳纳米管膜及其制造方法和设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114982254A (zh) * 2019-12-05 2022-08-30 阿汤姆H2O有限责任公司 单壁碳纳米管膜及其制造方法和设备

Also Published As

Publication number Publication date
FR2180687B1 (enrdf_load_stackoverflow) 1977-07-29
CA959975A (en) 1974-12-24
DE2313604B2 (enrdf_load_stackoverflow) 1979-01-04
DE2313604C3 (de) 1979-09-06
FR2180687A1 (enrdf_load_stackoverflow) 1973-11-30
JPS5317031B2 (enrdf_load_stackoverflow) 1978-06-05
JPS4896088A (enrdf_load_stackoverflow) 1973-12-08
IT981527B (it) 1974-10-10
DE2313604A1 (de) 1973-12-06

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee