GB1414511A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1414511A
GB1414511A GB5285372A GB5285372A GB1414511A GB 1414511 A GB1414511 A GB 1414511A GB 5285372 A GB5285372 A GB 5285372A GB 5285372 A GB5285372 A GB 5285372A GB 1414511 A GB1414511 A GB 1414511A
Authority
GB
United Kingdom
Prior art keywords
film
oxide
aluminium
electrodes
electrolysis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5285372A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of GB1414511A publication Critical patent/GB1414511A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6324—Formation by anodic treatments, e.g. anodic oxidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
    • H10P14/69391—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing aluminium, e.g. Al2O3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
    • H10P14/69393—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing tantalum, e.g. Ta2O5
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
GB5285372A 1971-11-15 1972-11-15 Semiconductor devices Expired GB1414511A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9140571A JPS557020B2 (enExample) 1971-11-15 1971-11-15

Publications (1)

Publication Number Publication Date
GB1414511A true GB1414511A (en) 1975-11-19

Family

ID=14025458

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5285372A Expired GB1414511A (en) 1971-11-15 1972-11-15 Semiconductor devices

Country Status (5)

Country Link
US (1) US3848260A (enExample)
JP (1) JPS557020B2 (enExample)
DE (1) DE2252832C2 (enExample)
GB (1) GB1414511A (enExample)
NL (1) NL177263C (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255443A (en) * 1991-04-30 1992-11-04 Samsung Electronics Co Ltd Method of planarising a semiconductor device
GB2284710A (en) * 1991-04-30 1995-06-14 Samsung Electronics Co Ltd Fabricating a metal electrode of a semiconductor device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3987217A (en) * 1974-01-03 1976-10-19 Motorola, Inc. Metallization system for semiconductor devices, devices utilizing such metallization system and method for making devices and metallization system
US4215156A (en) * 1977-08-26 1980-07-29 International Business Machines Corporation Method for fabricating tantalum semiconductor contacts
US4206472A (en) * 1977-12-27 1980-06-03 International Business Machines Corporation Thin film structures and method for fabricating same
DE3232837A1 (de) * 1982-09-03 1984-03-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer 2-ebenen-metallisierung fuer halbleiterbauelemente, insbesondere fuer leistungshalbleiterbauelemente wie thyristoren
US5783483A (en) * 1993-02-24 1998-07-21 Intel Corporation Method of fabricating a barrier against metal diffusion
US5684331A (en) * 1995-06-07 1997-11-04 Lg Semicon Co., Ltd. Multilayered interconnection of semiconductor device
KR20000064615A (ko) * 1997-01-16 2000-11-06 롤페스 요하네스 게라투스 알베르투스 반도체 디바이스 및 반도체 디바이스 제조 방법
US9653296B2 (en) 2014-05-22 2017-05-16 Infineon Technologies Ag Method for processing a semiconductor device and semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3442701A (en) * 1965-05-19 1969-05-06 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3409809A (en) * 1966-04-06 1968-11-05 Irc Inc Semiconductor or write tri-layered metal contact
US3442012A (en) * 1967-08-03 1969-05-06 Teledyne Inc Method of forming a flip-chip integrated circuit
US3465211A (en) * 1968-02-01 1969-09-02 Friden Inc Multilayer contact system for semiconductors
DE1764434A1 (de) * 1968-06-05 1971-07-22 Telefunken Patent Verfahren zum Kontaktieren eines Halbleiterbauelementes
US3672984A (en) * 1969-03-12 1972-06-27 Hitachi Ltd Method of forming the electrode of a semiconductor device
US3663279A (en) * 1969-11-19 1972-05-16 Bell Telephone Labor Inc Passivated semiconductor devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255443A (en) * 1991-04-30 1992-11-04 Samsung Electronics Co Ltd Method of planarising a semiconductor device
GB2284710A (en) * 1991-04-30 1995-06-14 Samsung Electronics Co Ltd Fabricating a metal electrode of a semiconductor device
GB2284710B (en) * 1991-04-30 1995-09-13 Samsung Electronics Co Ltd Fabricating a metal electrode of a semiconductor device
GB2255443B (en) * 1991-04-30 1995-09-13 Samsung Electronics Co Ltd Fabricating a metal electrode of a semiconductor device

Also Published As

Publication number Publication date
NL7215288A (enExample) 1973-05-17
JPS4856076A (enExample) 1973-08-07
DE2252832C2 (de) 1984-08-02
JPS557020B2 (enExample) 1980-02-21
DE2252832A1 (de) 1973-05-24
NL177263C (nl) 1985-08-16
NL177263B (nl) 1985-03-18
US3848260A (en) 1974-11-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years