GB1377515A - Process for the depostion of metal laywers on shaped articles of polyesters - Google Patents

Process for the depostion of metal laywers on shaped articles of polyesters

Info

Publication number
GB1377515A
GB1377515A GB5824571A GB5824571A GB1377515A GB 1377515 A GB1377515 A GB 1377515A GB 5824571 A GB5824571 A GB 5824571A GB 5824571 A GB5824571 A GB 5824571A GB 1377515 A GB1377515 A GB 1377515A
Authority
GB
United Kingdom
Prior art keywords
thickened
treated
give
coated
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5824571A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kalle GmbH and Co KG
Original Assignee
Kalle GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kalle GmbH and Co KG filed Critical Kalle GmbH and Co KG
Publication of GB1377515A publication Critical patent/GB1377515A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
GB5824571A 1970-12-17 1971-12-15 Process for the depostion of metal laywers on shaped articles of polyesters Expired GB1377515A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2062215A DE2062215C3 (de) 1970-12-17 1970-12-17 Verfahren zur Abscheidung von Metallschichten auf Formkörpern aus Polyestern

Publications (1)

Publication Number Publication Date
GB1377515A true GB1377515A (en) 1974-12-18

Family

ID=5791316

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5824571A Expired GB1377515A (en) 1970-12-17 1971-12-15 Process for the depostion of metal laywers on shaped articles of polyesters

Country Status (14)

Country Link
JP (1) JPS5426494B1 (enrdf_load_stackoverflow)
AT (1) AT320371B (enrdf_load_stackoverflow)
AU (1) AU464464B2 (enrdf_load_stackoverflow)
BE (1) BE776681A (enrdf_load_stackoverflow)
CA (1) CA962146A (enrdf_load_stackoverflow)
CH (1) CH574505A5 (enrdf_load_stackoverflow)
DE (1) DE2062215C3 (enrdf_load_stackoverflow)
ES (1) ES397976A1 (enrdf_load_stackoverflow)
FR (1) FR2118150B1 (enrdf_load_stackoverflow)
GB (1) GB1377515A (enrdf_load_stackoverflow)
IT (1) IT945452B (enrdf_load_stackoverflow)
NL (1) NL7116792A (enrdf_load_stackoverflow)
SE (1) SE377945B (enrdf_load_stackoverflow)
ZA (1) ZA718403B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating
JPS5832489A (ja) * 1981-08-20 1983-02-25 日東電工株式会社 印刷回路用ポリエステルフイルム
DE3243190A1 (de) * 1982-11-23 1984-05-24 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung metallisierter textiler flaechengebilde

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
FR1481700A (fr) * 1965-06-01 1967-05-19 Photocircuits Corp Perfectionnements apportés aux procédés de dépôt non galvanique de métaux
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article

Also Published As

Publication number Publication date
DE2062215B2 (de) 1977-09-15
IT945452B (it) 1973-05-10
ES397976A1 (es) 1974-07-01
SE377945B (enrdf_load_stackoverflow) 1975-08-04
DE2062215C3 (de) 1978-05-18
JPS5426494B1 (enrdf_load_stackoverflow) 1979-09-04
FR2118150B1 (enrdf_load_stackoverflow) 1975-10-03
ZA718403B (en) 1972-09-27
CA962146A (en) 1975-02-04
AU3684171A (en) 1973-06-21
CH574505A5 (enrdf_load_stackoverflow) 1976-04-15
AU464464B2 (en) 1975-08-28
DE2062215A1 (de) 1972-07-06
BE776681A (fr) 1972-06-14
FR2118150A1 (enrdf_load_stackoverflow) 1972-07-28
NL7116792A (enrdf_load_stackoverflow) 1972-06-20
AT320371B (de) 1975-02-10

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee