GB1374595A - Internal construction for plastic semiconductor packages - Google Patents

Internal construction for plastic semiconductor packages

Info

Publication number
GB1374595A
GB1374595A GB5370571A GB5370571A GB1374595A GB 1374595 A GB1374595 A GB 1374595A GB 5370571 A GB5370571 A GB 5370571A GB 5370571 A GB5370571 A GB 5370571A GB 1374595 A GB1374595 A GB 1374595A
Authority
GB
United Kingdom
Prior art keywords
spacer
semi
encapsulant
nov
conductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5370571A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1374595A publication Critical patent/GB1374595A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W76/40—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB5370571A 1970-11-23 1971-11-18 Internal construction for plastic semiconductor packages Expired GB1374595A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9171670A 1970-11-23 1970-11-23

Publications (1)

Publication Number Publication Date
GB1374595A true GB1374595A (en) 1974-11-20

Family

ID=22229305

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5370571A Expired GB1374595A (en) 1970-11-23 1971-11-18 Internal construction for plastic semiconductor packages

Country Status (7)

Country Link
US (1) US3659164A (enExample)
JP (1) JPS5147513B1 (enExample)
BE (1) BE775680A (enExample)
CA (1) CA941521A (enExample)
DE (1) DE2156522A1 (enExample)
FR (1) FR2115257B1 (enExample)
GB (1) GB1374595A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
US4048670A (en) * 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3278813A (en) * 1964-04-22 1966-10-11 Gen Electric Transistor housing containing packed, earthy, nonmetallic, electrically insulating material
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3292050A (en) * 1965-08-19 1966-12-13 Gen Electric Mounting of solid state electronic components
US3496427A (en) * 1966-01-13 1970-02-17 Gen Electric Semiconductor device with composite encapsulation
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3577633A (en) * 1966-12-02 1971-05-04 Hitachi Ltd Method of making a semiconductor device
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3560808A (en) * 1968-04-18 1971-02-02 Motorola Inc Plastic encapsulated semiconductor assemblies

Also Published As

Publication number Publication date
CA941521A (en) 1974-02-05
FR2115257A1 (enExample) 1972-07-07
US3659164A (en) 1972-04-25
DE2156522A1 (de) 1972-07-06
FR2115257B1 (enExample) 1975-08-29
JPS5147513B1 (enExample) 1976-12-15
BE775680A (fr) 1972-03-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee