JPS5147513B1 - - Google Patents
Info
- Publication number
- JPS5147513B1 JPS5147513B1 JP46092959A JP9295971A JPS5147513B1 JP S5147513 B1 JPS5147513 B1 JP S5147513B1 JP 46092959 A JP46092959 A JP 46092959A JP 9295971 A JP9295971 A JP 9295971A JP S5147513 B1 JPS5147513 B1 JP S5147513B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9171670A | 1970-11-23 | 1970-11-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5147513B1 true JPS5147513B1 (ja) | 1976-12-15 |
Family
ID=22229305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46092959A Pending JPS5147513B1 (ja) | 1970-11-23 | 1971-11-19 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3659164A (ja) |
| JP (1) | JPS5147513B1 (ja) |
| BE (1) | BE775680A (ja) |
| CA (1) | CA941521A (ja) |
| DE (1) | DE2156522A1 (ja) |
| FR (1) | FR2115257B1 (ja) |
| GB (1) | GB1374595A (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4106052A (en) * | 1975-04-19 | 1978-08-08 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position |
| US4048670A (en) * | 1975-06-30 | 1977-09-13 | Sprague Electric Company | Stress-free hall-cell package |
| DE3604882A1 (de) * | 1986-02-15 | 1987-08-20 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
| US5157478A (en) * | 1989-04-19 | 1992-10-20 | Mitsubishi Denki Kabushiki Kaisha | Tape automated bonding packaged semiconductor device incorporating a heat sink |
| US6432752B1 (en) * | 2000-08-17 | 2002-08-13 | Micron Technology, Inc. | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3278813A (en) * | 1964-04-22 | 1966-10-11 | Gen Electric | Transistor housing containing packed, earthy, nonmetallic, electrically insulating material |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| US3292050A (en) * | 1965-08-19 | 1966-12-13 | Gen Electric | Mounting of solid state electronic components |
| US3496427A (en) * | 1966-01-13 | 1970-02-17 | Gen Electric | Semiconductor device with composite encapsulation |
| DE1614364C3 (de) * | 1966-06-01 | 1979-04-05 | Rca Corp., New York, N.Y. (V.St.A.) | Verfahren zur Montage eines Halbleiter-Kristallelementes |
| US3577633A (en) * | 1966-12-02 | 1971-05-04 | Hitachi Ltd | Method of making a semiconductor device |
| US3469148A (en) * | 1967-11-08 | 1969-09-23 | Gen Motors Corp | Protectively covered hybrid microcircuits |
| US3560808A (en) * | 1968-04-18 | 1971-02-02 | Motorola Inc | Plastic encapsulated semiconductor assemblies |
-
1970
- 1970-11-23 US US91716A patent/US3659164A/en not_active Expired - Lifetime
-
1971
- 1971-10-21 CA CA125,810A patent/CA941521A/en not_active Expired
- 1971-11-13 DE DE19712156522 patent/DE2156522A1/de active Pending
- 1971-11-18 GB GB5370571A patent/GB1374595A/en not_active Expired
- 1971-11-19 FR FR7141425A patent/FR2115257B1/fr not_active Expired
- 1971-11-19 JP JP46092959A patent/JPS5147513B1/ja active Pending
- 1971-11-22 BE BE775680A patent/BE775680A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1374595A (en) | 1974-11-20 |
| FR2115257A1 (ja) | 1972-07-07 |
| BE775680A (fr) | 1972-03-16 |
| US3659164A (en) | 1972-04-25 |
| FR2115257B1 (ja) | 1975-08-29 |
| CA941521A (en) | 1974-02-05 |
| DE2156522A1 (de) | 1972-07-06 |