JPS5147513B1 - - Google Patents

Info

Publication number
JPS5147513B1
JPS5147513B1 JP46092959A JP9295971A JPS5147513B1 JP S5147513 B1 JPS5147513 B1 JP S5147513B1 JP 46092959 A JP46092959 A JP 46092959A JP 9295971 A JP9295971 A JP 9295971A JP S5147513 B1 JPS5147513 B1 JP S5147513B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46092959A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5147513B1 publication Critical patent/JPS5147513B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W74/121
    • H10W76/40

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP46092959A 1970-11-23 1971-11-19 Pending JPS5147513B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9171670A 1970-11-23 1970-11-23

Publications (1)

Publication Number Publication Date
JPS5147513B1 true JPS5147513B1 (enExample) 1976-12-15

Family

ID=22229305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46092959A Pending JPS5147513B1 (enExample) 1970-11-23 1971-11-19

Country Status (7)

Country Link
US (1) US3659164A (enExample)
JP (1) JPS5147513B1 (enExample)
BE (1) BE775680A (enExample)
CA (1) CA941521A (enExample)
DE (1) DE2156522A1 (enExample)
FR (1) FR2115257B1 (enExample)
GB (1) GB1374595A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
US4048670A (en) * 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3278813A (en) * 1964-04-22 1966-10-11 Gen Electric Transistor housing containing packed, earthy, nonmetallic, electrically insulating material
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3292050A (en) * 1965-08-19 1966-12-13 Gen Electric Mounting of solid state electronic components
US3496427A (en) * 1966-01-13 1970-02-17 Gen Electric Semiconductor device with composite encapsulation
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3577633A (en) * 1966-12-02 1971-05-04 Hitachi Ltd Method of making a semiconductor device
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3560808A (en) * 1968-04-18 1971-02-02 Motorola Inc Plastic encapsulated semiconductor assemblies

Also Published As

Publication number Publication date
CA941521A (en) 1974-02-05
FR2115257A1 (enExample) 1972-07-07
US3659164A (en) 1972-04-25
DE2156522A1 (de) 1972-07-06
FR2115257B1 (enExample) 1975-08-29
GB1374595A (en) 1974-11-20
BE775680A (fr) 1972-03-16

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