GB1371258A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB1371258A
GB1371258A GB5544072A GB5544072A GB1371258A GB 1371258 A GB1371258 A GB 1371258A GB 5544072 A GB5544072 A GB 5544072A GB 5544072 A GB5544072 A GB 5544072A GB 1371258 A GB1371258 A GB 1371258A
Authority
GB
United Kingdom
Prior art keywords
yoke
washers
bolt
screw
spring washers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5544072A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Original Assignee
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH1759271A external-priority patent/CH526857A/de
Application filed by BBC BROWN BOVERI and CIE, BBC Brown Boveri AG Switzerland filed Critical BBC BROWN BOVERI and CIE
Publication of GB1371258A publication Critical patent/GB1371258A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connection Of Plates (AREA)
GB5544072A 1971-12-03 1972-11-30 Semiconductor device Expired GB1371258A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1759271A CH526857A (de) 1970-09-29 1971-12-03 Halbleitereinheit und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
GB1371258A true GB1371258A (en) 1974-10-23

Family

ID=4426572

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5544072A Expired GB1371258A (en) 1971-12-03 1972-11-30 Semiconductor device

Country Status (6)

Country Link
US (1) US3805122A (cg-RX-API-DMAC7.html)
DE (2) DE7148146U (cg-RX-API-DMAC7.html)
FR (1) FR2162147B2 (cg-RX-API-DMAC7.html)
GB (1) GB1371258A (cg-RX-API-DMAC7.html)
IT (1) IT1044944B (cg-RX-API-DMAC7.html)
SE (1) SE380675B (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH593560A5 (cg-RX-API-DMAC7.html) * 1976-01-22 1977-12-15 Bbc Brown Boveri & Cie
DE3607276A1 (de) * 1985-03-08 1986-09-11 Philips Patentverwaltung Gmbh, 2000 Hamburg Einrichtung zur befestigung von halbleiterbauelementen
US20070097648A1 (en) * 2005-11-01 2007-05-03 Kevin Xu Method and apparatus for establishing optimal thermal contact between opposing surfaces
US8134835B2 (en) * 2007-01-26 2012-03-13 Inductotherm Corp. Compression clamping of semiconductor components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60097C (de) * F. G. M. STONEY in Ipswich, Suffolk, England Schleuse mit hebbaren und um Schildzapfen waagrecht verstellbaren Schützen
SE316534B (cg-RX-API-DMAC7.html) * 1965-07-09 1969-10-27 Asea Ab
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink

Also Published As

Publication number Publication date
SE380675B (sv) 1975-11-10
FR2162147B2 (cg-RX-API-DMAC7.html) 1978-02-10
DE7148146U (de) 1973-11-29
US3805122A (en) 1974-04-16
DE2163683A1 (de) 1973-06-07
IT1044944B (it) 1980-04-21
FR2162147A2 (cg-RX-API-DMAC7.html) 1973-07-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee