GB1366000A - Electrical circuit module - Google Patents

Electrical circuit module

Info

Publication number
GB1366000A
GB1366000A GB2659272A GB2659272A GB1366000A GB 1366000 A GB1366000 A GB 1366000A GB 2659272 A GB2659272 A GB 2659272A GB 2659272 A GB2659272 A GB 2659272A GB 1366000 A GB1366000 A GB 1366000A
Authority
GB
United Kingdom
Prior art keywords
contacts
connectors
slab
mating
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2659272A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singer Co
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singer Co filed Critical Singer Co
Publication of GB1366000A publication Critical patent/GB1366000A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2659272A 1971-08-20 1972-06-07 Electrical circuit module Expired GB1366000A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17336771A 1971-08-20 1971-08-20

Publications (1)

Publication Number Publication Date
GB1366000A true GB1366000A (en) 1974-09-04

Family

ID=22631689

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2659272A Expired GB1366000A (en) 1971-08-20 1972-06-07 Electrical circuit module

Country Status (9)

Country Link
US (1) US3706010A (https=)
JP (2) JPS4831456A (https=)
CA (1) CA951024A (https=)
DE (1) DE2240822A1 (https=)
FR (1) FR2150303B1 (https=)
GB (1) GB1366000A (https=)
IL (1) IL39630A (https=)
IT (1) IT963694B (https=)
SE (1) SE384427B (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
JPS5276946U (https=) * 1975-12-05 1977-06-08
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4254446A (en) * 1979-08-30 1981-03-03 Peoples Ric L Modular, hybrid integrated circuit assembly
US4484215A (en) * 1981-05-18 1984-11-20 Burroughs Corporation Flexible mounting support for wafer scale integrated circuits
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS58158705U (ja) * 1983-03-12 1983-10-22 株式会社神崎高級工機製作所 農用トラクタにおける前輪位置変更装置
US4499523A (en) * 1983-03-30 1985-02-12 International Business Machines Corporation Electronic component assembly with a printed circuit board unit and cover
US4549407A (en) * 1984-04-06 1985-10-29 International Business Machines Corporation Evaporative cooling
ATE40022T1 (de) * 1984-08-08 1989-01-15 Siemens Ag Gemeinsames gehaeuse fuer zwei halbleiterkoerper.
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
DE3818428C2 (de) * 1987-11-27 1993-11-04 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
DE4217289C2 (de) * 1992-05-25 1996-08-29 Mannesmann Ag Fluidgekühlte Leistungstransistoranordnung
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US6188575B1 (en) * 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495132A (en) * 1967-08-03 1970-02-10 Itt Packaging and actuating system for printed circuit boards and electrical connector assemblies

Also Published As

Publication number Publication date
DE2240822A1 (de) 1973-03-15
IL39630A0 (en) 1972-08-30
JPS544361U (https=) 1979-01-12
CA951024A (en) 1974-07-09
FR2150303A1 (https=) 1973-04-06
IT963694B (it) 1974-01-21
US3706010A (en) 1972-12-12
IL39630A (en) 1975-08-31
JPS4831456A (https=) 1973-04-25
FR2150303B1 (https=) 1976-08-13
SE384427B (sv) 1976-05-03

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee