GB1352571A - Formation of electrical connections - Google Patents
Formation of electrical connectionsInfo
- Publication number
- GB1352571A GB1352571A GB2547471A GB2547471A GB1352571A GB 1352571 A GB1352571 A GB 1352571A GB 2547471 A GB2547471 A GB 2547471A GB 2547471 A GB2547471 A GB 2547471A GB 1352571 A GB1352571 A GB 1352571A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- panel
- infra
- plate
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 19
- 229910000679 solder Inorganic materials 0.000 abstract 4
- 239000011521 glass Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2323670A | 1970-03-27 | 1970-03-27 | |
US10202570A | 1970-12-28 | 1970-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1352571A true GB1352571A (en) | 1974-05-08 |
Family
ID=26696886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2547471A Expired GB1352571A (en) | 1970-03-27 | 1971-04-19 | Formation of electrical connections |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS53166380U (enrdf_load_stackoverflow) |
CA (1) | CA941875A (enrdf_load_stackoverflow) |
FR (1) | FR2088990A5 (enrdf_load_stackoverflow) |
GB (1) | GB1352571A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3001782A4 (en) * | 2013-11-15 | 2017-03-22 | Wonder Future Corporation | Electrical product manufacturing method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495879A1 (fr) * | 1980-12-05 | 1982-06-11 | Tech Electro Cie Indle | Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL134969C (enrdf_load_stackoverflow) * | 1965-04-21 |
-
1971
- 1971-03-24 FR FR7110422A patent/FR2088990A5/fr not_active Expired
- 1971-03-26 CA CA108,816A patent/CA941875A/en not_active Expired
- 1971-04-19 GB GB2547471A patent/GB1352571A/en not_active Expired
-
1978
- 1978-05-10 JP JP6168878U patent/JPS53166380U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3001782A4 (en) * | 2013-11-15 | 2017-03-22 | Wonder Future Corporation | Electrical product manufacturing method |
US9949375B2 (en) | 2013-11-15 | 2018-04-17 | Wonder Future Corporation | Method for manufacturing an electric product |
Also Published As
Publication number | Publication date |
---|---|
FR2088990A5 (enrdf_load_stackoverflow) | 1972-01-07 |
CA941875A (en) | 1974-02-12 |
JPS53166380U (enrdf_load_stackoverflow) | 1978-12-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
49R | Reference inserted (sect. 9/1949) | ||
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |