GB1352571A - Formation of electrical connections - Google Patents

Formation of electrical connections

Info

Publication number
GB1352571A
GB1352571A GB2547471A GB2547471A GB1352571A GB 1352571 A GB1352571 A GB 1352571A GB 2547471 A GB2547471 A GB 2547471A GB 2547471 A GB2547471 A GB 2547471A GB 1352571 A GB1352571 A GB 1352571A
Authority
GB
United Kingdom
Prior art keywords
conductors
panel
infra
plate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2547471A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OI Glass Inc
Original Assignee
Owens Illinois Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Owens Illinois Inc filed Critical Owens Illinois Inc
Publication of GB1352571A publication Critical patent/GB1352571A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • B23K1/0053Soldering by means of radiant energy soldering by means of I.R.
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • H05K2201/10136Liquid Crystal display [LCD]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101Using electrical induction, e.g. for heating during soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1581Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
GB2547471A 1970-03-27 1971-04-19 Formation of electrical connections Expired GB1352571A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2323670A 1970-03-27 1970-03-27
US10202570A 1970-12-28 1970-12-28

Publications (1)

Publication Number Publication Date
GB1352571A true GB1352571A (en) 1974-05-08

Family

ID=26696886

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2547471A Expired GB1352571A (en) 1970-03-27 1971-04-19 Formation of electrical connections

Country Status (4)

Country Link
JP (1) JPS53166380U (enrdf_load_stackoverflow)
CA (1) CA941875A (enrdf_load_stackoverflow)
FR (1) FR2088990A5 (enrdf_load_stackoverflow)
GB (1) GB1352571A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3001782A4 (en) * 2013-11-15 2017-03-22 Wonder Future Corporation Electrical product manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495879A1 (fr) * 1980-12-05 1982-06-11 Tech Electro Cie Indle Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134969C (enrdf_load_stackoverflow) * 1965-04-21

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3001782A4 (en) * 2013-11-15 2017-03-22 Wonder Future Corporation Electrical product manufacturing method
US9949375B2 (en) 2013-11-15 2018-04-17 Wonder Future Corporation Method for manufacturing an electric product

Also Published As

Publication number Publication date
FR2088990A5 (enrdf_load_stackoverflow) 1972-01-07
CA941875A (en) 1974-02-12
JPS53166380U (enrdf_load_stackoverflow) 1978-12-26

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Legal Events

Date Code Title Description
49R Reference inserted (sect. 9/1949)
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee