GB1352571A - Formation of electrical connections - Google Patents

Formation of electrical connections

Info

Publication number
GB1352571A
GB1352571A GB2547471A GB2547471A GB1352571A GB 1352571 A GB1352571 A GB 1352571A GB 2547471 A GB2547471 A GB 2547471A GB 2547471 A GB2547471 A GB 2547471A GB 1352571 A GB1352571 A GB 1352571A
Authority
GB
United Kingdom
Prior art keywords
conductors
panel
infra
plate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2547471A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OI Glass Inc
Original Assignee
Owens Illinois Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Owens Illinois Inc filed Critical Owens Illinois Inc
Publication of GB1352571A publication Critical patent/GB1352571A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

1352571 Soldering OWENS-ILLINOIS Inc 19 April 1971 [27 March 1970 28 Dec 1970] 25474/71 Heading B3R In making individual connections between conductors on a planar glass plate forming part of a gaseous discharge display panel and conductors on a flexible substrate, solder is provided between the conductors to be connected and heat is generated simultaneously at all the connections to melt the solder. Similar connections are thus made between conductors on another flexible substrate and conductors on the other planar glass plate of the display panel. A gas discharge display panel 10 formed by two glass plates 11, 12 joined in spaced relationship by an endless sealant spacer 17 and having linear electrode conductors 13, 14 respectively thereon has the ends of its conductors soldered to flexible cables 20-23. A gas filling tube 40 is provided in the panel. The conductors 13, 14 may be of gold and are formed by silk screen, photoetching &c. printing or may be wires and alternate conductors extend to one end of a plate and adjacent alternate conductors extend to the other end of a plate. The flexible cables may be formed by printing conductors on an insulating substrate or by providing an insulating coating or layer to conductors. The end of each cable remote from the panel may have a rigidifying strip or the conductors at the end may terminate as printed transformed secondary windings, and solid state circuit clips may be held on the cables. The soldering is effected by coating the ends of either or both conductors on the panel and cable with solder, supporting the panel on a table, placing the conductors on the cable upon the conductors on the panel and applying a transparent weight H, Fig. 2 on the conductors. Infra-red energy from an infra-red laser 50 is focused by lens 51 on the conductors and the solder is melted. Infra-red energy may also be directed from a source 52. Alternatively to or simultaneously with the application of infra-red energy the panel 10 is vibrated by a vibrator 60 to generate heat by friction between the conductors. Both the panel and the cable may be vibrated. In bonding all the connections to one plate at one time the plate is held by vacuum chucks and heated as before. An alternative source of heat is an induction coil and this may be used simultaneously with infra-red and vibrations. Resistance heating may alternatively be used with or without vibration.
GB2547471A 1970-03-27 1971-04-19 Formation of electrical connections Expired GB1352571A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2323670A 1970-03-27 1970-03-27
US10202570A 1970-12-28 1970-12-28

Publications (1)

Publication Number Publication Date
GB1352571A true GB1352571A (en) 1974-05-08

Family

ID=26696886

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2547471A Expired GB1352571A (en) 1970-03-27 1971-04-19 Formation of electrical connections

Country Status (4)

Country Link
JP (1) JPS53166380U (en)
CA (1) CA941875A (en)
FR (1) FR2088990A5 (en)
GB (1) GB1352571A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3001782A4 (en) * 2013-11-15 2017-03-22 Wonder Future Corporation Electrical product manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495879A1 (en) * 1980-12-05 1982-06-11 Tech Electro Cie Indle Printed circuit mfr. including solder application step - by applying solder powder, coating with infrared absorbent followed by infrared heating

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA765233A (en) * 1965-04-21 1967-08-15 Western Electric Company, Incorporated Method of soldering with radiant energy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3001782A4 (en) * 2013-11-15 2017-03-22 Wonder Future Corporation Electrical product manufacturing method
US9949375B2 (en) 2013-11-15 2018-04-17 Wonder Future Corporation Method for manufacturing an electric product

Also Published As

Publication number Publication date
FR2088990A5 (en) 1972-01-07
CA941875A (en) 1974-02-12
JPS53166380U (en) 1978-12-26

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Legal Events

Date Code Title Description
49R Reference inserted (sect. 9/1949)
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee