GB1349666A - Sensitizing compositions for electroless plating and methods for the manufacture and use of same - Google Patents
Sensitizing compositions for electroless plating and methods for the manufacture and use of sameInfo
- Publication number
- GB1349666A GB1349666A GB2987471A GB2987471A GB1349666A GB 1349666 A GB1349666 A GB 1349666A GB 2987471 A GB2987471 A GB 2987471A GB 2987471 A GB2987471 A GB 2987471A GB 1349666 A GB1349666 A GB 1349666A
- Authority
- GB
- United Kingdom
- Prior art keywords
- composition
- metal
- electroless plating
- group
- sensitizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Abstract
1349666 Sensitizing solutions for electroless plating KOLLMORGEN CORP 25 June 1971 [29 June 1970] 29874/71 Heading C7F A composition for sensitizing a substrate prior to electroless plating with e.g., Cu, Ni, Co, Pd, Au or Ag comprises (a) a metal complex consisting of a precious metal of the fifth and sixth periods of Groups VIII and IB, (b) a Group IV metal which is capable of two valence states and (c) an anion capable of forming a stable moietz with both valence states of the Group IV metal, the molar ratio of (a) : (b) : (c) being from 1:1:3 to 1:6:24, and these being an excess of component (b) to provide 3 to 100 moles of (b) per mole of component (a). The composition may be incorporated in a plastic substrate. The precious metal may be Pd, Pt, Au, Rh, Os, Ir and salts e.g. chlorides, bromides, fluorides, fluoborates, iodides, nitrates, sulphates, and acetates may be used. The Group IV metal may be stannous tin, Ge, Ti, and may also be in the form of the above salts. The composition may be diluted with an acid, e.g. hydrochloric, hydrofluoric, sulphuric, citric or acetic. The composition may contain a stabilizer e.g. open chain aliphatic mono-ols, diols or polyols and a fluorimated hydrocarbon wetting agent. The composition may be prepared by heating the mixture at 80C. to boiling point.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5091870A | 1970-06-29 | 1970-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1349666A true GB1349666A (en) | 1974-04-10 |
Family
ID=21968302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2987471A Expired GB1349666A (en) | 1970-06-29 | 1971-06-25 | Sensitizing compositions for electroless plating and methods for the manufacture and use of same |
Country Status (12)
Country | Link |
---|---|
US (1) | US3672923A (en) |
JP (1) | JPS5515544B1 (en) |
AT (2) | AT314306B (en) |
CA (1) | CA934902A (en) |
CH (1) | CH571577A5 (en) |
DK (1) | DK148919C (en) |
ES (1) | ES392729A1 (en) |
FR (1) | FR2100042A5 (en) |
GB (1) | GB1349666A (en) |
IT (1) | IT954171B (en) |
NL (1) | NL169757C (en) |
SE (1) | SE427190B (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3874882A (en) * | 1972-02-09 | 1975-04-01 | Shipley Co | Catalyst solution for electroless deposition of metal on substrate |
US4187198A (en) * | 1972-08-07 | 1980-02-05 | Kollmorgen Technologies Corp. | Novel precious metal sensitizing solutions |
US3960573A (en) * | 1972-08-07 | 1976-06-01 | Photocircuits Division Of Kollmorgan Corporation | Novel precious metal sensitizing solutions |
US3841881A (en) * | 1972-09-13 | 1974-10-15 | Rca Corp | Method for electroless deposition of metal using improved colloidal catalyzing solution |
US3917486A (en) * | 1973-07-24 | 1975-11-04 | Kollmorgen Photocircuits | Immersion tin bath composition and process for using same |
US4027055A (en) * | 1973-07-24 | 1977-05-31 | Photocircuits Division Of Kollmorgan Corporation | Process of tin plating by immersion |
CA1021761A (en) * | 1973-08-01 | 1977-11-29 | Kollmorgen Corporation | Sensitizers for electroless metal deposition |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
US4321285A (en) * | 1974-10-04 | 1982-03-23 | Surface Technology, Inc. | Electroless plating |
US3993848A (en) * | 1975-02-18 | 1976-11-23 | Surface Technology, Inc. | Catalytic primer |
US4212768A (en) * | 1975-05-05 | 1980-07-15 | Jameson Melvin N | Electroless plating of nonconductive substrates |
US4020009A (en) * | 1975-09-30 | 1977-04-26 | Shipley Company, Inc. | Catalyst composition and method of preparation |
US4061588A (en) * | 1975-09-30 | 1977-12-06 | Shipley Company Inc. | Catalyst composition and method of preparation |
ZA764709B (en) * | 1976-01-26 | 1978-02-22 | Borg Warner | Catalytically active composition for electroless plating |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4082899A (en) * | 1976-09-07 | 1978-04-04 | Nathan Feldstein | Method of applying catalysts for electroless deposition and article |
ZA774561B (en) * | 1976-09-20 | 1978-06-28 | Kollmorgen Tech Corp | Preparation of solid precious metal sensitizing compositions |
JPS58189365A (en) * | 1982-04-28 | 1983-11-05 | Okuno Seiyaku Kogyo Kk | Composition for chemical plating |
US4762560A (en) * | 1982-09-27 | 1988-08-09 | Learonal, Inc. | Copper colloid and method of activating insulating surfaces for subsequent electroplating |
US4681630A (en) * | 1982-09-27 | 1987-07-21 | Learonal, Inc. | Method of making copper colloid for activating insulating surfaces |
SE454250B (en) * | 1984-09-24 | 1988-04-18 | Asea Ab | INDUSTRIAL ROBOT WITH LINEAR DRIVE DEVICES |
US4717421A (en) * | 1986-04-28 | 1988-01-05 | Mcgean-Rohco, Inc. | Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids |
DE19524601C1 (en) * | 1995-07-06 | 1996-03-21 | Deutsche Automobilgesellsch | Activating porous plastic surfaces for chemical metallisation |
JP3689096B2 (en) * | 2002-10-02 | 2005-08-31 | 学校法人神奈川大学 | Thin film formation method |
US9765251B2 (en) | 2012-12-18 | 2017-09-19 | University Of South Florida | Encapsulation of thermal energy storage media |
-
1970
- 1970-06-29 US US50918A patent/US3672923A/en not_active Expired - Lifetime
-
1971
- 1971-04-20 CA CA110846A patent/CA934902A/en not_active Expired
- 1971-06-24 AT AT549171A patent/AT314306B/en not_active IP Right Cessation
- 1971-06-25 GB GB2987471A patent/GB1349666A/en not_active Expired
- 1971-06-25 CH CH937671A patent/CH571577A5/xx not_active IP Right Cessation
- 1971-06-28 ES ES392729A patent/ES392729A1/en not_active Expired
- 1971-06-28 DK DK316171A patent/DK148919C/en not_active IP Right Cessation
- 1971-06-29 FR FR7123698A patent/FR2100042A5/fr not_active Expired
- 1971-06-29 JP JP4757771A patent/JPS5515544B1/ja active Pending
- 1971-06-29 SE SE7108398A patent/SE427190B/en unknown
- 1971-06-29 NL NLAANVRAGE7109004,A patent/NL169757C/en not_active IP Right Cessation
- 1971-06-30 IT IT51295/71A patent/IT954171B/en active
-
1973
- 1973-07-20 AT AT643273*1A patent/AT326443B/en active
Also Published As
Publication number | Publication date |
---|---|
DK148919C (en) | 1986-07-14 |
DK148919B (en) | 1985-11-18 |
CH571577A5 (en) | 1976-01-15 |
JPS5515544B1 (en) | 1980-04-24 |
AT314306B (en) | 1974-03-25 |
SE427190B (en) | 1983-03-14 |
US3672923A (en) | 1972-06-27 |
NL169757C (en) | 1982-08-16 |
NL7109004A (en) | 1971-12-31 |
IT954171B (en) | 1973-08-30 |
NL169757B (en) | 1982-03-16 |
ATA643273A (en) | 1975-02-15 |
DE2132863A1 (en) | 1972-01-05 |
FR2100042A5 (en) | 1972-03-17 |
ES392729A1 (en) | 1973-07-16 |
DE2132863B2 (en) | 1974-02-28 |
CA934902A (en) | 1973-10-09 |
AT326443B (en) | 1975-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PE20 | Patent expired after termination of 20 years |