GB1338370A - Method of fabricating nitrides of gallium and indium - Google Patents
Method of fabricating nitrides of gallium and indiumInfo
- Publication number
- GB1338370A GB1338370A GB4015872A GB4015872A GB1338370A GB 1338370 A GB1338370 A GB 1338370A GB 4015872 A GB4015872 A GB 4015872A GB 4015872 A GB4015872 A GB 4015872A GB 1338370 A GB1338370 A GB 1338370A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- gallium
- indium
- target
- nitrides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
Abstract
1338370 Sputtering gallium and indium nitrides INTERNATIONAL BUSINESS MACHINES CORP 30 Aug 1972 [28 Sept 1971] 40158/72 Heading C7F Gallium or indium nitride is R.F. sputtered on to a substrate 15 by sputtering from a Ga or In target in a nitrogen plasma. The substrate may be given a D.C. or A.C. bias, and an impedance matching circuit 9, 11, 13 is used for an A.C. bias. The target holder may be a Cu disc with a diffusion barrier of Ni, Mo, W or gallium nitride between it and the In or Ga. Coils 31 provide a magnetic field perpendicular to the plane of the substrate. The target has a removable ground shield 33. A movable shutter 47 is used for a presputtering operation. A Ti sublimation pump 53 is used together, e.g. oxygen or compounds thereof. Nitrogen is admitted through a pipe 63. Argon may be used for sputter cleaning the substrate. The substrate may be sapphire silicon, fused quartz, Si C, Mo, W.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18440571A | 1971-09-28 | 1971-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1338370A true GB1338370A (en) | 1973-11-21 |
Family
ID=22676735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4015872A Expired GB1338370A (en) | 1971-09-28 | 1972-08-30 | Method of fabricating nitrides of gallium and indium |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS4840699A (en) |
DE (1) | DE2243153A1 (en) |
FR (1) | FR2154459B1 (en) |
GB (1) | GB1338370A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2180262A (en) * | 1985-09-05 | 1987-03-25 | Plessey Co Plc | Forming substances by reactive sputtering |
GB2181461A (en) * | 1985-10-10 | 1987-04-23 | Canadian Patents Dev | Depositing semiconductor compounds by reactive sputtering |
GB2182350A (en) * | 1985-07-01 | 1987-05-13 | Atomic Energy Authority Uk | Sputter ion plating |
GB2178061B (en) * | 1985-07-01 | 1989-04-26 | Atomic Energy Authority Uk | Coating improvements |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5031028B1 (en) * | 1968-08-15 | 1975-10-06 | ||
US3878085A (en) * | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
DE3316548C2 (en) * | 1983-03-25 | 1985-01-17 | Flachglas AG, 8510 Fürth | Process for coating a transparent substrate |
-
1972
- 1972-08-29 FR FR7231325A patent/FR2154459B1/fr not_active Expired
- 1972-08-30 GB GB4015872A patent/GB1338370A/en not_active Expired
- 1972-09-01 DE DE19722243153 patent/DE2243153A1/en active Pending
- 1972-09-13 JP JP9135872A patent/JPS4840699A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2182350A (en) * | 1985-07-01 | 1987-05-13 | Atomic Energy Authority Uk | Sputter ion plating |
GB2178061B (en) * | 1985-07-01 | 1989-04-26 | Atomic Energy Authority Uk | Coating improvements |
GB2182350B (en) * | 1985-07-01 | 1989-04-26 | Atomic Energy Authority Uk | Coating improvements |
GB2180262A (en) * | 1985-09-05 | 1987-03-25 | Plessey Co Plc | Forming substances by reactive sputtering |
GB2180262B (en) * | 1985-09-05 | 1990-05-09 | Plessey Co Plc | Methods of forming substances on substrates by reactive sputtering |
GB2181461A (en) * | 1985-10-10 | 1987-04-23 | Canadian Patents Dev | Depositing semiconductor compounds by reactive sputtering |
GB2181461B (en) * | 1985-10-10 | 1989-09-27 | Canadian Patents Dev | Doping semiconductor compounds by reactive sputtering |
Also Published As
Publication number | Publication date |
---|---|
FR2154459A1 (en) | 1973-05-11 |
DE2243153A1 (en) | 1973-04-05 |
FR2154459B1 (en) | 1974-08-19 |
JPS4840699A (en) | 1973-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |