GB1337791A - Mounting device for semi-conductor chips - Google Patents

Mounting device for semi-conductor chips

Info

Publication number
GB1337791A
GB1337791A GB15271A GB15271A GB1337791A GB 1337791 A GB1337791 A GB 1337791A GB 15271 A GB15271 A GB 15271A GB 15271 A GB15271 A GB 15271A GB 1337791 A GB1337791 A GB 1337791A
Authority
GB
United Kingdom
Prior art keywords
areas
pad
mounting
semi
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15271A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of GB1337791A publication Critical patent/GB1337791A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
GB15271A 1970-01-02 1971-01-01 Mounting device for semi-conductor chips Expired GB1337791A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35970A 1970-01-02 1970-01-02

Publications (1)

Publication Number Publication Date
GB1337791A true GB1337791A (en) 1973-11-21

Family

ID=21691183

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15271A Expired GB1337791A (en) 1970-01-02 1971-01-01 Mounting device for semi-conductor chips

Country Status (4)

Country Link
JP (1) JPS4919023B1 (fr)
CH (1) CH540567A (fr)
DE (1) DE2064856A1 (fr)
GB (1) GB1337791A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2127217A (en) * 1982-08-10 1984-04-04 Brown David F Semiconductor chip carriers and housings
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005044001B3 (de) * 2005-09-14 2007-04-12 W.C. Heraeus Gmbh Laminiertes Substrat für die Montage von elektronischen Bauteilen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
GB2127217A (en) * 1982-08-10 1984-04-04 Brown David F Semiconductor chip carriers and housings
US4638348A (en) * 1982-08-10 1987-01-20 Brown David F Semiconductor chip carrier
AT398254B (de) * 1982-08-10 1994-11-25 Dowty Electronic Components Chipträger sowie anordnung von solchen chipträgern

Also Published As

Publication number Publication date
DE2064856A1 (de) 1971-07-08
CH540567A (de) 1973-08-15
JPS4919023B1 (fr) 1974-05-14

Similar Documents

Publication Publication Date Title
GB1481015A (en) Bonding of a semiconductor device to an electrical conductor on a supporting substrate
ES464959A1 (es) Perfeccionamientos introducidos en un paquete ceramico meta-lizado para circuitos de alta velocidad.
GB1418520A (en) Semiconductor devices
KR920001701A (ko) 반도체 장치 및 그 제조방법
GB1290194A (fr)
GB1341454A (en) Packaging of semiconductor devices
IE34944L (en) Mounting semiconductor elements
KR910001956A (ko) 반도체장치
KR880011914A (ko) 전기 도전 캐리어 플레이트를 포함하는 집적회로
GB1337791A (en) Mounting device for semi-conductor chips
GB1383297A (en) Electrical integrated circuit package
GB866467A (en) Improvements in or relating to semiconductor devices
GB1234314A (fr)
KR930701908A (ko) 전기 접속 장치
GB1535195A (en) Semiconductors
GB1361400A (en) Method of electrically connecting a semi-conductor chip to a substrate
GB1275343A (en) Improvements relating to lead frames for use with semiconductor devices
GB1188451A (en) Improvements relating to methods of making Connections to Small Components
JPS597393A (ja) 表示装置
GB1290800A (fr)
JPS57202747A (en) Electronic circuit device
GB1401655A (en) Beam lead devices
JPS5448166A (en) Electronic parts
GB1307038A (en) Semiconductor arrangements
GB1258856A (fr)

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees