GB1334345A - Etching - Google Patents
EtchingInfo
- Publication number
- GB1334345A GB1334345A GB2581072A GB2581072A GB1334345A GB 1334345 A GB1334345 A GB 1334345A GB 2581072 A GB2581072 A GB 2581072A GB 2581072 A GB2581072 A GB 2581072A GB 1334345 A GB1334345 A GB 1334345A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- predetermined depth
- etched
- june
- hydrofluoric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/00—
-
- H10W74/40—
Landscapes
- Weting (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15410271A | 1971-06-17 | 1971-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1334345A true GB1334345A (en) | 1973-10-17 |
Family
ID=22550006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2581072A Expired GB1334345A (en) | 1971-06-17 | 1972-06-02 | Etching |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3767493A (enExample) |
| JP (1) | JPS5235514B1 (enExample) |
| DE (1) | DE2226264C2 (enExample) |
| FR (1) | FR2141936B1 (enExample) |
| GB (1) | GB1334345A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742644A (zh) * | 2017-10-30 | 2018-02-27 | 中山大学 | 一种高性能常关型的GaN场效应晶体管及其制备方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4279690A (en) * | 1975-10-28 | 1981-07-21 | Texas Instruments Incorporated | High-radiance emitters with integral microlens |
| US4472240A (en) * | 1981-08-21 | 1984-09-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing semiconductor device |
| US4353778A (en) * | 1981-09-04 | 1982-10-12 | International Business Machines Corporation | Method of etching polyimide |
| US7078160B2 (en) * | 2003-06-26 | 2006-07-18 | Intel Corporation | Selective surface exposure, cleans, and conditioning of the germanium film in a Ge photodetector |
| US9698121B2 (en) * | 2014-01-27 | 2017-07-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and structures for packaging semiconductor dies |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
| US3576630A (en) * | 1966-10-29 | 1971-04-27 | Nippon Electric Co | Photo-etching process |
| US3432920A (en) * | 1966-12-01 | 1969-03-18 | Rca Corp | Semiconductor devices and methods of making them |
| US3542551A (en) * | 1968-07-01 | 1970-11-24 | Trw Semiconductors Inc | Method of etching patterns into solid state devices |
-
1971
- 1971-06-17 US US00154102A patent/US3767493A/en not_active Expired - Lifetime
-
1972
- 1972-05-29 JP JP47052575A patent/JPS5235514B1/ja active Pending
- 1972-05-30 DE DE2226264A patent/DE2226264C2/de not_active Expired
- 1972-06-02 GB GB2581072A patent/GB1334345A/en not_active Expired
- 1972-06-05 FR FR7221475A patent/FR2141936B1/fr not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742644A (zh) * | 2017-10-30 | 2018-02-27 | 中山大学 | 一种高性能常关型的GaN场效应晶体管及其制备方法 |
| CN107742644B (zh) * | 2017-10-30 | 2024-05-28 | 中山大学 | 一种高性能常关型的GaN场效应晶体管及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5235514B1 (enExample) | 1977-09-09 |
| DE2226264A1 (de) | 1972-12-21 |
| DE2226264C2 (de) | 1985-10-10 |
| FR2141936B1 (enExample) | 1978-03-03 |
| FR2141936A1 (enExample) | 1973-01-26 |
| US3767493A (en) | 1973-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1285778A (en) | Improvements in and relating to methods of etching | |
| GB1314648A (en) | Method for manufacturing a semiconductor photosensitive device | |
| GB1445659A (en) | Method of etching silicon oxide to produce a tapered edge thereon | |
| GB1231644A (enExample) | ||
| JPS5244173A (en) | Method of flat etching of silicon substrate | |
| GB1194730A (en) | Improvements in or relating to Etching Processes for Semiconductor Devices | |
| GB1190893A (en) | A Method of Manufacturing a Semiconductor Device and a Semiconductor Device Obtained Thereby | |
| GB1319079A (en) | Method of making a semiconductor article and the article produced thereby | |
| GB1096484A (en) | Improvements in or relating to semiconductor circuits | |
| GB1334345A (en) | Etching | |
| GB1273150A (en) | Improvements in and relating to methods of etching semiconductor body surfaces | |
| GB1487201A (en) | Method of manufacturing semi-conductor devices | |
| GB1527106A (en) | Method of etching multilayered articles | |
| GB1451160A (en) | Semiconductor devices | |
| JPS5530826A (en) | Method of manufacturing semiconductor device | |
| GB1206371A (en) | The etching of silicon semiconductor wafers and semiconductor devices incorporating such wafers | |
| JPS5685857A (en) | Manufacture of semiconductor device | |
| GB1224562A (en) | An etching process | |
| JPS5763842A (en) | Preparation of semiconductor integrated circuit | |
| GB1276451A (en) | Semiconductor structure and method for lowering the collector resistance | |
| GB1420155A (en) | Etching silicon nitride patterns | |
| GB1526425A (en) | Method of etching aluminium oxide | |
| JPS5317068A (en) | Semiconductor device and its production | |
| JPS5285489A (en) | Semiconductor reactance element | |
| GB1187611A (en) | Method of manufacturing Semiconductors Device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |