GB1330100A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- GB1330100A GB1330100A GB2305672A GB2305672A GB1330100A GB 1330100 A GB1330100 A GB 1330100A GB 2305672 A GB2305672 A GB 2305672A GB 2305672 A GB2305672 A GB 2305672A GB 1330100 A GB1330100 A GB 1330100A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- iii
- resin composition
- halogenated
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 150000008064 anhydrides Chemical class 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 abstract 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 abstract 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 abstract 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 abstract 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 150000008282 halocarbons Chemical class 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15762571A | 1971-06-28 | 1971-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1330100A true GB1330100A (en) | 1973-09-12 |
Family
ID=22564554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2305672A Expired GB1330100A (en) | 1971-06-28 | 1972-05-17 | Epoxy resin composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5037531B1 (enrdf_load_stackoverflow) |
| DE (1) | DE2231297A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2143706B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1330100A (enrdf_load_stackoverflow) |
| IT (1) | IT951496B (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4368253A (en) | 1981-01-28 | 1983-01-11 | Ciba-Geigy Corporation | Image formation process |
| US4439517A (en) * | 1982-01-21 | 1984-03-27 | Ciba-Geigy Corporation | Process for the formation of images with epoxide resin |
| US4663269A (en) * | 1985-08-07 | 1987-05-05 | Polytechnic Institute Of New York | Method of forming highly sensitive photoresist film in the absence of water |
| US6378201B1 (en) | 1990-09-27 | 2002-04-30 | International Business Machines Corporation | Method for making a printed circuit board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137216A (enrdf_load_stackoverflow) * | 1974-09-26 | 1976-03-29 | Asahi Chemical Ind | |
| US5650261A (en) * | 1989-10-27 | 1997-07-22 | Rohm And Haas Company | Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system |
| US6168898B1 (en) * | 1998-02-17 | 2001-01-02 | Isola Laminate Systems Corp. | Positive acting photodielectric composition |
-
1972
- 1972-04-18 IT IT23244/72A patent/IT951496B/it active
- 1972-05-17 GB GB2305672A patent/GB1330100A/en not_active Expired
- 1972-06-05 FR FR7221486A patent/FR2143706B1/fr not_active Expired
- 1972-06-06 JP JP47055695A patent/JPS5037531B1/ja active Pending
- 1972-06-26 DE DE2231297A patent/DE2231297A1/de active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4368253A (en) | 1981-01-28 | 1983-01-11 | Ciba-Geigy Corporation | Image formation process |
| US4439517A (en) * | 1982-01-21 | 1984-03-27 | Ciba-Geigy Corporation | Process for the formation of images with epoxide resin |
| EP0085024A3 (en) * | 1982-01-21 | 1984-09-26 | Ciba-Geigy Ag | Method for producing images in photoresist layers |
| US4663269A (en) * | 1985-08-07 | 1987-05-05 | Polytechnic Institute Of New York | Method of forming highly sensitive photoresist film in the absence of water |
| US6378201B1 (en) | 1990-09-27 | 2002-04-30 | International Business Machines Corporation | Method for making a printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2143706B1 (enrdf_load_stackoverflow) | 1976-06-11 |
| JPS5037531B1 (enrdf_load_stackoverflow) | 1975-12-03 |
| JPS4815059A (enrdf_load_stackoverflow) | 1973-02-26 |
| FR2143706A1 (enrdf_load_stackoverflow) | 1973-02-09 |
| IT951496B (it) | 1973-06-30 |
| DE2231297A1 (de) | 1973-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1116740A (en) | Process for reacting a phenol with an epoxy compound and resulting products | |
| GB1401889A (en) | Polymerizable epoxy compositions | |
| GB806661A (en) | Improvements in or relating to selenium rectifiers | |
| GB1374008A (en) | Method of soldering | |
| GB875866A (en) | Improvements in and relating to epoxide compositions | |
| GB1496596A (en) | Homogeneous polyepoxide-polyanhydride compositions | |
| GB1000403A (en) | Improvements in or relating to epoxy ether resin-lactone compositions | |
| GB1330100A (en) | Epoxy resin composition | |
| GB1406722A (en) | Curing agents for epoxy-compounds | |
| GB855205A (en) | Improvements in curing of polyepoxides | |
| GB1009806A (en) | Improvements in or relating to curing agents for epoxy resins | |
| GB1481764A (en) | Resin composition | |
| ES461677A1 (es) | Un procedimiento para preparar una composicion resinosa. | |
| GB1158938A (en) | Curing process and Epoxy Resin Composition | |
| GB1301771A (enrdf_load_stackoverflow) | ||
| GB1022063A (en) | Process for curing polyepoxides | |
| GB1407620A (en) | Epoxy resin compositions and their use in glass-epoxy laminates for high temperature use | |
| GB1383357A (en) | Heat-curable mixtures based on epoxide resins | |
| GB915704A (en) | Improvements relating to epoxy resins | |
| GB1356188A (en) | Crosslinked polymers of amine salts and polyepoxides | |
| GB1462538A (en) | Epoxy resin compositions | |
| GB1219069A (en) | Process for curing polyepoxides and resulting products | |
| GB939210A (en) | Epoxy resin hardener compositions | |
| GB1361909A (en) | Storage-stable quick-curing epoxide resin moulding materials | |
| GB887529A (en) | Hardenable compositions comprising epoxide compounds and boron trifluoride |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |