GB1330100A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- GB1330100A GB1330100A GB2305672A GB2305672A GB1330100A GB 1330100 A GB1330100 A GB 1330100A GB 2305672 A GB2305672 A GB 2305672A GB 2305672 A GB2305672 A GB 2305672A GB 1330100 A GB1330100 A GB 1330100A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- iii
- resin composition
- halogenated
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
1330100 Epoxy resin composition INTERNATIONAL BUSINESS MACHINES CORP 17 May 1972 [28 June 1971] 23056/72 Heading C3B [Also in Division G2] An epoxy resin composition comprises: (I) an epoxy resin having an epoxide equivalent weight of 800-2000; (II) an amine curing agent, (III) a halogenated polycarboxylic anhydride; and (IV) a halogenated hydrocarbon solvent. I may be a diglycidyl ether of bisphenol A or resorcinol or an epoxy novolac resin. II may be methylenedianiline, phenylenediamine, diaminodiphenylsulphone, diethylenetriamine or triethylenetetramine. III may be chlorendic, dichloromaleic, tetrabromo- or tetrachlorophthalic, dichlorocitraconic or a halogenated derivative or tri- or pyro-mellitic anhydrides. I may comprise 5-30% by wt., II may comprise 2-12% by wt. and III 1-5% by wt, each of the total composition. Uses.-In preparing positive photoresist images.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15762571A | 1971-06-28 | 1971-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1330100A true GB1330100A (en) | 1973-09-12 |
Family
ID=22564554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2305672A Expired GB1330100A (en) | 1971-06-28 | 1972-05-17 | Epoxy resin composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5037531B1 (en) |
DE (1) | DE2231297A1 (en) |
FR (1) | FR2143706B1 (en) |
GB (1) | GB1330100A (en) |
IT (1) | IT951496B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0085024A2 (en) * | 1982-01-21 | 1983-08-03 | Ciba-Geigy Ag | Method for producing images in photoresist layers |
US4663269A (en) * | 1985-08-07 | 1987-05-05 | Polytechnic Institute Of New York | Method of forming highly sensitive photoresist film in the absence of water |
US6378201B1 (en) | 1990-09-27 | 2002-04-30 | International Business Machines Corporation | Method for making a printed circuit board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5137216A (en) * | 1974-09-26 | 1976-03-29 | Asahi Chemical Ind | |
US5650261A (en) * | 1989-10-27 | 1997-07-22 | Rohm And Haas Company | Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system |
US6168898B1 (en) * | 1998-02-17 | 2001-01-02 | Isola Laminate Systems Corp. | Positive acting photodielectric composition |
-
1972
- 1972-04-18 IT IT23244/72A patent/IT951496B/en active
- 1972-05-17 GB GB2305672A patent/GB1330100A/en not_active Expired
- 1972-06-05 FR FR7221486A patent/FR2143706B1/fr not_active Expired
- 1972-06-06 JP JP47055695A patent/JPS5037531B1/ja active Pending
- 1972-06-26 DE DE2231297A patent/DE2231297A1/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0085024A2 (en) * | 1982-01-21 | 1983-08-03 | Ciba-Geigy Ag | Method for producing images in photoresist layers |
US4439517A (en) * | 1982-01-21 | 1984-03-27 | Ciba-Geigy Corporation | Process for the formation of images with epoxide resin |
EP0085024A3 (en) * | 1982-01-21 | 1984-09-26 | Ciba-Geigy Ag | Method for producing images in photoresist layers |
US4663269A (en) * | 1985-08-07 | 1987-05-05 | Polytechnic Institute Of New York | Method of forming highly sensitive photoresist film in the absence of water |
US6378201B1 (en) | 1990-09-27 | 2002-04-30 | International Business Machines Corporation | Method for making a printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
FR2143706A1 (en) | 1973-02-09 |
JPS5037531B1 (en) | 1975-12-03 |
DE2231297A1 (en) | 1973-01-11 |
IT951496B (en) | 1973-06-30 |
FR2143706B1 (en) | 1976-06-11 |
JPS4815059A (en) | 1973-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1116740A (en) | Process for reacting a phenol with an epoxy compound and resulting products | |
GB1401889A (en) | Polymerizable epoxy compositions | |
GB1408935A (en) | Imide-containing blends and polymeric compositions prepared there from | |
GB875866A (en) | Improvements in and relating to epoxide compositions | |
GB1496596A (en) | Homogeneous polyepoxide-polyanhydride compositions | |
GB1000403A (en) | Improvements in or relating to epoxy ether resin-lactone compositions | |
GB1330100A (en) | Epoxy resin composition | |
GB976956A (en) | Self-extinguishing epoxy resins | |
GB1406722A (en) | Curing agents for epoxy-compounds | |
GB855205A (en) | Improvements in curing of polyepoxides | |
GB1481764A (en) | Resin composition | |
GB1009806A (en) | Improvements in or relating to curing agents for epoxy resins | |
ES461677A1 (en) | Cathodic electrocoating resin system | |
GB1158938A (en) | Curing process and Epoxy Resin Composition | |
GB1301771A (en) | ||
GB1407620A (en) | Epoxy resin compositions and their use in glass-epoxy laminates for high temperature use | |
GB1383357A (en) | Heat-curable mixtures based on epoxide resins | |
ES410025A1 (en) | Process for the preparation of glycidyl ethers of bisphenols | |
GB1356188A (en) | Crosslinked polymers of amine salts and polyepoxides | |
GB1462538A (en) | Epoxy resin compositions | |
GB1219069A (en) | Process for curing polyepoxides and resulting products | |
GB939210A (en) | Epoxy resin hardener compositions | |
ES248113A1 (en) | Hardenable compositions comprising epoxide compounds and boron trifluorides | |
GB1244858A (en) | Liquid amine curing agents for polyepoxides | |
US3654191A (en) | Curable epoxide compositions comprising a polyepoxide an n-glycidyl- or n-beta-methylglycidyl-oxazolidin - 2-one and and epoxide curing agent |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |