GB1330100A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
GB1330100A
GB1330100A GB2305672A GB2305672A GB1330100A GB 1330100 A GB1330100 A GB 1330100A GB 2305672 A GB2305672 A GB 2305672A GB 2305672 A GB2305672 A GB 2305672A GB 1330100 A GB1330100 A GB 1330100A
Authority
GB
United Kingdom
Prior art keywords
epoxy resin
iii
resin composition
halogenated
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2305672A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1330100A publication Critical patent/GB1330100A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

1330100 Epoxy resin composition INTERNATIONAL BUSINESS MACHINES CORP 17 May 1972 [28 June 1971] 23056/72 Heading C3B [Also in Division G2] An epoxy resin composition comprises: (I) an epoxy resin having an epoxide equivalent weight of 800-2000; (II) an amine curing agent, (III) a halogenated polycarboxylic anhydride; and (IV) a halogenated hydrocarbon solvent. I may be a diglycidyl ether of bisphenol A or resorcinol or an epoxy novolac resin. II may be methylenedianiline, phenylenediamine, diaminodiphenylsulphone, diethylenetriamine or triethylenetetramine. III may be chlorendic, dichloromaleic, tetrabromo- or tetrachlorophthalic, dichlorocitraconic or a halogenated derivative or tri- or pyro-mellitic anhydrides. I may comprise 5-30% by wt., II may comprise 2-12% by wt. and III 1-5% by wt, each of the total composition. Uses.-In preparing positive photoresist images.
GB2305672A 1971-06-28 1972-05-17 Epoxy resin composition Expired GB1330100A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15762571A 1971-06-28 1971-06-28

Publications (1)

Publication Number Publication Date
GB1330100A true GB1330100A (en) 1973-09-12

Family

ID=22564554

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2305672A Expired GB1330100A (en) 1971-06-28 1972-05-17 Epoxy resin composition

Country Status (5)

Country Link
JP (1) JPS5037531B1 (en)
DE (1) DE2231297A1 (en)
FR (1) FR2143706B1 (en)
GB (1) GB1330100A (en)
IT (1) IT951496B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0085024A2 (en) * 1982-01-21 1983-08-03 Ciba-Geigy Ag Method for producing images in photoresist layers
US4663269A (en) * 1985-08-07 1987-05-05 Polytechnic Institute Of New York Method of forming highly sensitive photoresist film in the absence of water
US6378201B1 (en) 1990-09-27 2002-04-30 International Business Machines Corporation Method for making a printed circuit board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5137216A (en) * 1974-09-26 1976-03-29 Asahi Chemical Ind
US5650261A (en) * 1989-10-27 1997-07-22 Rohm And Haas Company Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
US6168898B1 (en) * 1998-02-17 2001-01-02 Isola Laminate Systems Corp. Positive acting photodielectric composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0085024A2 (en) * 1982-01-21 1983-08-03 Ciba-Geigy Ag Method for producing images in photoresist layers
US4439517A (en) * 1982-01-21 1984-03-27 Ciba-Geigy Corporation Process for the formation of images with epoxide resin
EP0085024A3 (en) * 1982-01-21 1984-09-26 Ciba-Geigy Ag Method for producing images in photoresist layers
US4663269A (en) * 1985-08-07 1987-05-05 Polytechnic Institute Of New York Method of forming highly sensitive photoresist film in the absence of water
US6378201B1 (en) 1990-09-27 2002-04-30 International Business Machines Corporation Method for making a printed circuit board

Also Published As

Publication number Publication date
FR2143706A1 (en) 1973-02-09
JPS5037531B1 (en) 1975-12-03
DE2231297A1 (en) 1973-01-11
IT951496B (en) 1973-06-30
FR2143706B1 (en) 1976-06-11
JPS4815059A (en) 1973-02-26

Similar Documents

Publication Publication Date Title
GB1116740A (en) Process for reacting a phenol with an epoxy compound and resulting products
GB1401889A (en) Polymerizable epoxy compositions
GB1408935A (en) Imide-containing blends and polymeric compositions prepared there from
GB875866A (en) Improvements in and relating to epoxide compositions
GB1496596A (en) Homogeneous polyepoxide-polyanhydride compositions
GB1000403A (en) Improvements in or relating to epoxy ether resin-lactone compositions
GB1330100A (en) Epoxy resin composition
GB976956A (en) Self-extinguishing epoxy resins
GB1406722A (en) Curing agents for epoxy-compounds
GB855205A (en) Improvements in curing of polyepoxides
GB1481764A (en) Resin composition
GB1009806A (en) Improvements in or relating to curing agents for epoxy resins
ES461677A1 (en) Cathodic electrocoating resin system
GB1158938A (en) Curing process and Epoxy Resin Composition
GB1301771A (en)
GB1407620A (en) Epoxy resin compositions and their use in glass-epoxy laminates for high temperature use
GB1383357A (en) Heat-curable mixtures based on epoxide resins
ES410025A1 (en) Process for the preparation of glycidyl ethers of bisphenols
GB1356188A (en) Crosslinked polymers of amine salts and polyepoxides
GB1462538A (en) Epoxy resin compositions
GB1219069A (en) Process for curing polyepoxides and resulting products
GB939210A (en) Epoxy resin hardener compositions
ES248113A1 (en) Hardenable compositions comprising epoxide compounds and boron trifluorides
GB1244858A (en) Liquid amine curing agents for polyepoxides
US3654191A (en) Curable epoxide compositions comprising a polyepoxide an n-glycidyl- or n-beta-methylglycidyl-oxazolidin - 2-one and and epoxide curing agent

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees