GB1329506A - Metallizing surfaces of non-conducting articles - Google Patents

Metallizing surfaces of non-conducting articles

Info

Publication number
GB1329506A
GB1329506A GB2002371A GB2002371A GB1329506A GB 1329506 A GB1329506 A GB 1329506A GB 2002371 A GB2002371 A GB 2002371A GB 2002371 A GB2002371 A GB 2002371A GB 1329506 A GB1329506 A GB 1329506A
Authority
GB
United Kingdom
Prior art keywords
plated
copper
electroless
conducting articles
sulphuric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2002371A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Badische Anilin and Sodafabrik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE, Badische Anilin and Sodafabrik AG filed Critical BASF SE
Publication of GB1329506A publication Critical patent/GB1329506A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)

Abstract

1329506 Electroless deposition of copper BADISCHE ANILIN & SODA FABRIK A G 19 April 1971 [21 Jan 1970] 20023/71 Heading C7F A non-conducting substrate of e.g. foamed polystyrene is electroless plated with Cu, by first applying a coating of particulate Zn having an average size of less than 4 microns. The Zn is dispersed in water or alcohol containing a binder of polymeric material, and a dispersing agent. The copper plating solution is acidic (pH 0À5 to 2À0) and may contain glycine or glutamic, citric, tartaric, oxalic, sulphuric or amino sulphonic acids. The Cu may be subsequently plated with Cu, Ni, Cr, Co or Au.
GB2002371A 1970-01-21 1971-04-19 Metallizing surfaces of non-conducting articles Expired GB1329506A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702002458 DE2002458A1 (en) 1970-01-21 1970-01-21 Process for the metallization of the surface of non-conductive objects

Publications (1)

Publication Number Publication Date
GB1329506A true GB1329506A (en) 1973-09-12

Family

ID=5760098

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2002371A Expired GB1329506A (en) 1970-01-21 1971-04-19 Metallizing surfaces of non-conducting articles

Country Status (4)

Country Link
BE (1) BE761763A (en)
DE (1) DE2002458A1 (en)
FR (1) FR2077257B1 (en)
GB (1) GB1329506A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2169925A (en) * 1985-01-16 1986-07-23 Canning W Materials Ltd Process for providing a metal coating on a polymer surface
GB2254340A (en) * 1991-03-01 1992-10-07 Nikko Kogyo Kk Metal coated porous resin membrane.
EP1484433A1 (en) * 2003-06-07 2004-12-08 Galvano Röhrig GmbH Zinc coating of electrically non conducting surfaces
CN104561944A (en) * 2015-02-11 2015-04-29 广德宏霞科技发展有限公司 Electroless copper plating method for glass or ceramic substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847486A1 (en) * 1978-11-02 1980-05-14 Bayer Ag USE OF METALIZED TEXTILES AS A RADIATION PROTECTION AGAINST MICROWAVES

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2169925A (en) * 1985-01-16 1986-07-23 Canning W Materials Ltd Process for providing a metal coating on a polymer surface
GB2254340A (en) * 1991-03-01 1992-10-07 Nikko Kogyo Kk Metal coated porous resin membrane.
GB2254340B (en) * 1991-03-01 1995-08-23 Nikko Kogyo Kk Resin membrane having metallic layer and method of producing the same
US5510195A (en) * 1991-03-01 1996-04-23 Nikko Kogyo Kabushiki Kaisha Resin membrane having metallic layer and method of producing the same
EP1484433A1 (en) * 2003-06-07 2004-12-08 Galvano Röhrig GmbH Zinc coating of electrically non conducting surfaces
CN104561944A (en) * 2015-02-11 2015-04-29 广德宏霞科技发展有限公司 Electroless copper plating method for glass or ceramic substrate
CN104561944B (en) * 2015-02-11 2017-05-31 广德宏霞科技发展有限公司 A kind of electroless copper plating method of glass, ceramic substrate

Also Published As

Publication number Publication date
FR2077257A1 (en) 1971-10-22
FR2077257B1 (en) 1974-12-20
DE2002458A1 (en) 1971-07-29
BE761763A (en) 1971-07-19

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees