GB1325319A - Semiconductors - Google Patents

Semiconductors

Info

Publication number
GB1325319A
GB1325319A GB4336570A GB4336570A GB1325319A GB 1325319 A GB1325319 A GB 1325319A GB 4336570 A GB4336570 A GB 4336570A GB 4336570 A GB4336570 A GB 4336570A GB 1325319 A GB1325319 A GB 1325319A
Authority
GB
United Kingdom
Prior art keywords
iodine
imide
sept
cleaned
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4336570A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1325319A publication Critical patent/GB1325319A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Formation Of Insulating Films (AREA)
GB4336570A 1969-09-30 1970-09-10 Semiconductors Expired GB1325319A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86241869A 1969-09-30 1969-09-30

Publications (1)

Publication Number Publication Date
GB1325319A true GB1325319A (en) 1973-08-01

Family

ID=25338453

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4336570A Expired GB1325319A (en) 1969-09-30 1970-09-10 Semiconductors

Country Status (3)

Country Link
US (1) US3597269A (enExample)
JP (1) JPS4918587B1 (enExample)
GB (1) GB1325319A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2455357A1 (de) * 1974-04-15 1975-10-23 Hitachi Ltd Halbleiterbauelement und verfahren zu seiner herstellung
DE2656963A1 (de) * 1975-12-18 1977-06-30 Gen Electric Halbleiterelement mit schutzueberzug
DE2702921A1 (de) * 1976-01-26 1977-09-01 Gen Electric Halbleiterelement mit schutzschicht sowie loesung zur herstellung der schutzschicht
CN108410169A (zh) * 2018-03-22 2018-08-17 广东纳路纳米科技有限公司 复合聚酰亚胺材料及其制备方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
US3911475A (en) * 1972-04-19 1975-10-07 Westinghouse Electric Corp Encapsulated solid state electronic devices having a sealed lead-encapsulant interface
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
SE375881B (enExample) * 1972-11-17 1975-04-28 Asea Ab
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
US4096521A (en) * 1976-07-08 1978-06-20 Motorola Inc. Protective coating for high voltage devices
US4059708A (en) * 1976-07-30 1977-11-22 Bell Telephone Laboratories, Incorporated Method for selective encapsulation
US4140572A (en) * 1976-09-07 1979-02-20 General Electric Company Process for selective etching of polymeric materials embodying silicones therein
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
US5391915A (en) * 1978-11-20 1995-02-21 Hatachi, Ltd. Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate
US6747339B1 (en) 1978-11-20 2004-06-08 Hitachi, Ltd. Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate
US4620986A (en) * 1984-11-09 1986-11-04 Intel Corporation MOS rear end processing
JPH07118534B2 (ja) * 1990-02-22 1995-12-18 三菱電機株式会社 半導体装置の製造方法
EP0560617A3 (en) * 1992-03-13 1993-11-24 Kawasaki Steel Co Method of manufacturing insulating film on semiconductor device and apparatus for carrying out the same
DE102008035235B4 (de) * 2008-07-29 2014-05-22 Ivoclar Vivadent Ag Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2455357A1 (de) * 1974-04-15 1975-10-23 Hitachi Ltd Halbleiterbauelement und verfahren zu seiner herstellung
DE2656963A1 (de) * 1975-12-18 1977-06-30 Gen Electric Halbleiterelement mit schutzueberzug
DE2702921A1 (de) * 1976-01-26 1977-09-01 Gen Electric Halbleiterelement mit schutzschicht sowie loesung zur herstellung der schutzschicht
CN108410169A (zh) * 2018-03-22 2018-08-17 广东纳路纳米科技有限公司 复合聚酰亚胺材料及其制备方法

Also Published As

Publication number Publication date
US3597269A (en) 1971-08-03
JPS4918587B1 (enExample) 1974-05-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees