JPS4918587B1 - - Google Patents
Info
- Publication number
- JPS4918587B1 JPS4918587B1 JP45084714A JP8471470A JPS4918587B1 JP S4918587 B1 JPS4918587 B1 JP S4918587B1 JP 45084714 A JP45084714 A JP 45084714A JP 8471470 A JP8471470 A JP 8471470A JP S4918587 B1 JPS4918587 B1 JP S4918587B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86241869A | 1969-09-30 | 1969-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4918587B1 true JPS4918587B1 (enExample) | 1974-05-11 |
Family
ID=25338453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45084714A Pending JPS4918587B1 (enExample) | 1969-09-30 | 1970-09-29 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3597269A (enExample) |
| JP (1) | JPS4918587B1 (enExample) |
| GB (1) | GB1325319A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3849187A (en) * | 1970-03-08 | 1974-11-19 | Dexter Corp | Encapsulant compositions for semiconductors |
| US3911475A (en) * | 1972-04-19 | 1975-10-07 | Westinghouse Electric Corp | Encapsulated solid state electronic devices having a sealed lead-encapsulant interface |
| US4001870A (en) * | 1972-08-18 | 1977-01-04 | Hitachi, Ltd. | Isolating protective film for semiconductor devices and method for making the same |
| SE375881B (enExample) * | 1972-11-17 | 1975-04-28 | Asea Ab | |
| JPS5421073B2 (enExample) * | 1974-04-15 | 1979-07-27 | ||
| GB1553243A (en) * | 1975-08-04 | 1979-09-26 | Gen Electric | Semiconductor |
| GB1563421A (en) * | 1975-12-18 | 1980-03-26 | Gen Electric | Polyimide-siloxane copolymer protective coating for semiconductor devices |
| GB1585477A (en) * | 1976-01-26 | 1981-03-04 | Gen Electric | Semiconductors |
| US4096521A (en) * | 1976-07-08 | 1978-06-20 | Motorola Inc. | Protective coating for high voltage devices |
| US4059708A (en) * | 1976-07-30 | 1977-11-22 | Bell Telephone Laboratories, Incorporated | Method for selective encapsulation |
| US4140572A (en) * | 1976-09-07 | 1979-02-20 | General Electric Company | Process for selective etching of polymeric materials embodying silicones therein |
| US4238528A (en) * | 1978-06-26 | 1980-12-09 | International Business Machines Corporation | Polyimide coating process and material |
| US5391915A (en) * | 1978-11-20 | 1995-02-21 | Hatachi, Ltd. | Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate |
| US6747339B1 (en) | 1978-11-20 | 2004-06-08 | Hitachi, Ltd. | Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate |
| US4620986A (en) * | 1984-11-09 | 1986-11-04 | Intel Corporation | MOS rear end processing |
| JPH07118534B2 (ja) * | 1990-02-22 | 1995-12-18 | 三菱電機株式会社 | 半導体装置の製造方法 |
| EP0560617A3 (en) * | 1992-03-13 | 1993-11-24 | Kawasaki Steel Co | Method of manufacturing insulating film on semiconductor device and apparatus for carrying out the same |
| DE102008035235B4 (de) * | 2008-07-29 | 2014-05-22 | Ivoclar Vivadent Ag | Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen |
| CN108410169A (zh) * | 2018-03-22 | 2018-08-17 | 广东纳路纳米科技有限公司 | 复合聚酰亚胺材料及其制备方法 |
-
1969
- 1969-09-30 US US862418A patent/US3597269A/en not_active Expired - Lifetime
-
1970
- 1970-09-10 GB GB4336570A patent/GB1325319A/en not_active Expired
- 1970-09-29 JP JP45084714A patent/JPS4918587B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3597269A (en) | 1971-08-03 |
| GB1325319A (en) | 1973-08-01 |