GB1323331A - Automatic bonding machine - Google Patents

Automatic bonding machine

Info

Publication number
GB1323331A
GB1323331A GB2812470A GB2812470A GB1323331A GB 1323331 A GB1323331 A GB 1323331A GB 2812470 A GB2812470 A GB 2812470A GB 2812470 A GB2812470 A GB 2812470A GB 1323331 A GB1323331 A GB 1323331A
Authority
GB
United Kingdom
Prior art keywords
june
bonding machine
automatic bonding
wire
comptroller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2812470A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1323331A publication Critical patent/GB1323331A/en
Expired legal-status Critical Current

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Classifications

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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49838—Assembling or joining by stringing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

1323331 Pneumatic conveyers TEXAS INSTRUMENTS Inc 10 June 1970 [30 June 1969] 28124/70 Heading B8A [Also in Divisions B3 D1 F1 F2 G1 G3 H1 and H2] In thermal compression bonding a 0À001 inch dia. gold wire to an expanded contact on a transistor and to a lead (Division B3), feeding of the wire through a hypodermic-sized needle 28 is assisted by an annular jet of air issuing from between offset nested 250a, 252a, air pressure being introduced to the annular space between the tubes via a solenoid valve. Reference has been directed by the Comptroller to Specification 995,853.
GB2812470A 1969-06-30 1970-06-10 Automatic bonding machine Expired GB1323331A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83748569A 1969-06-30 1969-06-30

Publications (1)

Publication Number Publication Date
GB1323331A true GB1323331A (en) 1973-07-11

Family

ID=25274582

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2812470A Expired GB1323331A (en) 1969-06-30 1970-06-10 Automatic bonding machine

Country Status (7)

Country Link
US (1) US3641660A (en)
JP (1) JPS565062B1 (en)
KR (1) KR780000596B1 (en)
DE (2) DE2032302A1 (en)
FR (1) FR2048054B1 (en)
GB (1) GB1323331A (en)
NL (1) NL172806C (en)

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JPS5080763A (en) * 1973-11-14 1975-07-01
GB1592368A (en) * 1976-10-18 1981-07-08 Texas Instruments Inc Automated manipulative operation system
US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
DE19617470B4 (en) * 1995-11-07 2006-02-02 Hesse & Knipps Gmbh thread feed
US5813590A (en) 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
DE19831550B4 (en) * 1998-07-14 2013-08-14 Robert Bosch Gmbh bonding process
US6520026B1 (en) * 1999-11-03 2003-02-18 International Business Machines Corporation Method for making and testing thermocompression bonds
US6651866B2 (en) 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US20050051600A1 (en) * 2003-09-10 2005-03-10 Texas Instruments Incorporated Method and system for stud bumping
DE102004056702B3 (en) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Method for mounting electronic components on a substrate
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding

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US3006068A (en) * 1957-03-22 1961-10-31 Bell Telephone Labor Inc Twist-compression bonding of metallic and metallized surfaces
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3029348A (en) * 1959-10-02 1962-04-10 Western Electric Co Electro-optical servo system for coarse and fine positioning of transistors
NL269297A (en) * 1960-10-06 1900-01-01
US3207904A (en) * 1962-04-09 1965-09-21 Western Electric Co Electro-optical article positioning system
US3235945A (en) * 1962-10-09 1966-02-22 Philco Corp Connection of semiconductor elements to thin film circuits using foil ribbon
US3250452A (en) * 1963-01-29 1966-05-10 Kulicke And Soffa Mfg Company Nail head bonding apparatus for thermocompressively securing lead wire to semi-conductor devices
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
DE1439262B2 (en) * 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München METHOD OF CONTACTING SEMICONDUCTOR COMPONENTS BY THERMOCOMPRESSION
US3313464A (en) * 1963-11-07 1967-04-11 Western Electric Co Thermocompression bonding apparatus
US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3363818A (en) * 1965-03-04 1968-01-16 Basic Products Corp Spool mount for wire feed device
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US3430835A (en) * 1966-06-07 1969-03-04 Westinghouse Electric Corp Wire bonding apparatus for microelectronic components
US3442432A (en) 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate

Also Published As

Publication number Publication date
NL172806C (en) 1983-10-17
JPS565062B1 (en) 1981-02-03
NL7009641A (en) 1971-01-04
DE2032302C2 (en) 1987-01-29
FR2048054B1 (en) 1975-09-26
FR2048054A1 (en) 1971-03-19
NL172806B (en) 1983-05-16
DE2032302A1 (en) 1971-02-25
KR780000596B1 (en) 1978-11-23
DE2066210A1 (en) 1986-03-20
US3641660A (en) 1972-02-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years