GB1308359A - Multiple layer metal structure and processing - Google Patents

Multiple layer metal structure and processing

Info

Publication number
GB1308359A
GB1308359A GB4884470A GB4884470A GB1308359A GB 1308359 A GB1308359 A GB 1308359A GB 4884470 A GB4884470 A GB 4884470A GB 4884470 A GB4884470 A GB 4884470A GB 1308359 A GB1308359 A GB 1308359A
Authority
GB
United Kingdom
Prior art keywords
interconnections
concentrated
oct
aluminium
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4884470A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Camera and Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera and Instrument Corp filed Critical Fairchild Camera and Instrument Corp
Publication of GB1308359A publication Critical patent/GB1308359A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/049—Equivalence and options
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB4884470A 1969-10-31 1970-10-14 Multiple layer metal structure and processing Expired GB1308359A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87453569A 1969-10-31 1969-10-31

Publications (1)

Publication Number Publication Date
GB1308359A true GB1308359A (en) 1973-02-21

Family

ID=25364025

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4884470A Expired GB1308359A (en) 1969-10-31 1970-10-14 Multiple layer metal structure and processing

Country Status (9)

Country Link
US (1) US3586922A (https=)
JP (2) JPS55907B1 (https=)
BE (1) BE758160A (https=)
CA (1) CA921616A (https=)
CH (1) CH514236A (https=)
DE (1) DE2047799C3 (https=)
FR (1) FR2065609B1 (https=)
GB (1) GB1308359A (https=)
NL (1) NL158325B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3675319A (en) * 1970-06-29 1972-07-11 Bell Telephone Labor Inc Interconnection of electrical devices
US3774079A (en) * 1971-06-25 1973-11-20 Ibm Monolithically fabricated tranistor circuit with multilayer conductive patterns
US3892606A (en) * 1973-06-28 1975-07-01 Ibm Method for forming silicon conductive layers utilizing differential etching rates
JPS5334484A (en) * 1976-09-10 1978-03-31 Toshiba Corp Forming method for multi layer wiring
NL7701559A (nl) * 1977-02-15 1978-08-17 Philips Nv Het maken van schuine hellingen aan metaal- patronen, alsmede substraat voor een geinte- greerde schakeling voorzien van een dergelijk patroon.
US4178674A (en) * 1978-03-27 1979-12-18 Intel Corporation Process for forming a contact region between layers of polysilicon with an integral polysilicon resistor
JPS57112027A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Manufacture of semiconductor device
FR2525389A1 (fr) * 1982-04-14 1983-10-21 Commissariat Energie Atomique Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
US4703392A (en) * 1982-07-06 1987-10-27 General Electric Company Microstrip line and method for fabrication
US4600663A (en) * 1982-07-06 1986-07-15 General Electric Company Microstrip line
DE3232837A1 (de) * 1982-09-03 1984-03-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer 2-ebenen-metallisierung fuer halbleiterbauelemente, insbesondere fuer leistungshalbleiterbauelemente wie thyristoren
DE3806287A1 (de) * 1988-02-27 1989-09-07 Asea Brown Boveri Aetzverfahren zur strukturierung einer mehrschicht-metallisierung
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
KR101557942B1 (ko) * 2014-01-08 2015-10-12 주식회사 루멘스 발광 소자 패키지 및 발광 소자 패키지의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL121810C (https=) * 1955-11-04
US3382568A (en) * 1965-07-22 1968-05-14 Ibm Method for providing electrical connections to semiconductor devices
US3515607A (en) * 1967-06-21 1970-06-02 Western Electric Co Method of removing polymerised resist material from a substrate
US3510728A (en) * 1967-09-08 1970-05-05 Motorola Inc Isolation of multiple layer metal circuits with low temperature phosphorus silicates

Also Published As

Publication number Publication date
FR2065609A1 (https=) 1971-07-30
NL7015137A (https=) 1971-05-04
BE758160A (fr) 1971-04-01
JPS5543251B1 (https=) 1980-11-05
DE2047799C3 (de) 1981-12-03
NL158325B (nl) 1978-10-16
US3586922A (en) 1971-06-22
DE2047799A1 (de) 1971-05-06
CA921616A (en) 1973-02-20
CH514236A (de) 1971-10-15
FR2065609B1 (https=) 1976-05-28
DE2047799B2 (de) 1980-06-19
JPS55907B1 (https=) 1980-01-10

Similar Documents

Publication Publication Date Title
GB1308359A (en) Multiple layer metal structure and processing
JPS5378789A (en) Manufacture of semiconductor integrated circuit
JPS5491087A (en) Manufacture of thin-film solar cell
JPS5750451A (en) Semiconductor
GB1232126A (https=)
JPS5289468A (en) Semiconductor device
JPS52106675A (en) Manufacturing method of semiconductor device
JPS5380183A (en) Semiconductor device
JPS5240061A (en) Semiconductor device and process for production of same
JPS57176747A (en) Manufacture of semiconductor device
JPS5355992A (en) Semiconductor device
JPS54152984A (en) Manufacture of semiconductor device
JPS5368970A (en) Solder electrode structure
JPS5324291A (en) Production of semiconductor devi ce
JPS55124245A (en) Method of forming aluminum wiring layer
GB1299837A (en) Method of producing electrical interconnection patterns
JPS5258490A (en) Semiconductor device
JPS55113381A (en) Semiconductor displacement transducer
JPS5392679A (en) Semiconductor device
JPS57170551A (en) Manufacture of semiconductor device
JPS5283065A (en) Production of semiconductor device
JPS52120781A (en) Semiconductor device
JPS5331966A (en) Production of semiconductor device
JPS52103981A (en) Semiconductor device
GB1425953A (en) Methods of producing patterns by etching

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee