GB1302920A - - Google Patents

Info

Publication number
GB1302920A
GB1302920A GB5784170A GB5784170A GB1302920A GB 1302920 A GB1302920 A GB 1302920A GB 5784170 A GB5784170 A GB 5784170A GB 5784170 A GB5784170 A GB 5784170A GB 1302920 A GB1302920 A GB 1302920A
Authority
GB
United Kingdom
Prior art keywords
housing
housings
passages
dec
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5784170A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1302920A publication Critical patent/GB1302920A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB5784170A 1969-12-11 1970-12-04 Expired GB1302920A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88425869A 1969-12-11 1969-12-11

Publications (1)

Publication Number Publication Date
GB1302920A true GB1302920A (https=) 1973-01-10

Family

ID=25384280

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5784170A Expired GB1302920A (https=) 1969-12-11 1970-12-04

Country Status (6)

Country Link
US (1) US3586917A (https=)
JP (1) JPS504554B1 (https=)
BE (1) BE760031A (https=)
DE (1) DE2061179A1 (https=)
FR (1) FR2069787A5 (https=)
GB (1) GB1302920A (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2062666A1 (de) * 1970-12-19 1972-07-06 Bbc Brown Boveri & Cie Aus Bausteinen aufgebaute Stromrichteranlage
US3793603A (en) * 1972-07-17 1974-02-19 Ferraz & Cie Lucien Fuse cartridges
US4001711A (en) * 1974-08-05 1977-01-04 Motorola, Inc. Radio frequency power amplifier constructed as hybrid microelectronic unit
US4266089A (en) * 1978-09-14 1981-05-05 Isotronics, Incorporated All metal flat package having excellent heat transfer characteristics
US4266090A (en) * 1978-09-14 1981-05-05 Isotronics, Incorporated All metal flat package
FR2470445A1 (fr) * 1979-11-21 1981-05-29 Thomson Csf Dispositif de mise en parallele de transistors bipolaires de puissance en tres haute frequence et amplificateur utilisant ce dispositif
JPS5874399U (ja) * 1981-11-13 1983-05-19 アルプス電気株式会社 電気部品の取付構造
FR2522203A1 (fr) * 1982-02-24 1983-08-26 Sintra Alcatel Sa Traversee electrique de boitier de circuit hybride et connecteurs complementaires
FR2564243B1 (fr) * 1984-05-11 1987-02-20 Europ Composants Electron Boitier a dissipation thermique d'encapsulation de circuits electriques
US4562512A (en) * 1984-07-23 1985-12-31 Sundstrand Corporation Multiple semiconductor containing package having a heat sink core
DE3506172A1 (de) * 1985-02-22 1986-09-04 Telefunken electronic GmbH, 7100 Heilbronn Bauelementgehaeuse
US4781244A (en) * 1986-02-25 1988-11-01 Nec Corporation Liquid cooling system for integrated circuit chips
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
US5008492A (en) * 1989-10-20 1991-04-16 Hughes Aircraft Company High current feedthrough package
US5131272A (en) * 1990-03-15 1992-07-21 Harris Corporation Portable deployable automatic test system
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5059129A (en) * 1991-03-25 1991-10-22 International Business Machines Corporation Connector assembly including bilayered elastomeric member
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
USD356995S (en) 1994-04-12 1995-04-04 Vlt Corporation Configurable, modular power supply
JPH08136105A (ja) * 1994-11-11 1996-05-31 Fanuc Ltd インバータ用筐体
DE19511755C1 (de) * 1995-03-30 1996-08-22 Framatome Connectors Int Multiplex-Steuerung von Komponenten bzw. Untersystemen in Kraftfahrzeugen
US5736787A (en) * 1996-07-11 1998-04-07 Larimer; William R. Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices
US6270262B1 (en) 1999-11-10 2001-08-07 Harris Corporation Optical interconnect module
US6404628B1 (en) * 2000-07-21 2002-06-11 General Motors Corporation Integrated power electronics cooling housing
DE102008007346A1 (de) * 2008-02-04 2009-08-06 Robert Bosch Gmbh Metallisches Gehäuseteil und Verfahren zur Herstellung des Gehäuseteiles
US20150252666A1 (en) 2014-03-05 2015-09-10 Baker Hughes Incorporated Packaging for electronics in downhole assemblies
JP6450612B2 (ja) * 2015-03-11 2019-01-09 日本特殊陶業株式会社 電子部品装置およびその製造方法
FR3087617B1 (fr) 2018-10-17 2023-10-27 Valeo Systemes De Controle Moteur Equipement electronique pour vehicule
WO2022226942A1 (en) 2021-04-29 2022-11-03 Huawei Technologies Co., Ltd. Converter for power conversion, three-phase converter arrangement and method for packaging a converter

Also Published As

Publication number Publication date
US3586917A (en) 1971-06-22
JPS504554B1 (https=) 1975-02-20
DE2061179A1 (de) 1971-06-16
BE760031A (fr) 1971-05-17
FR2069787A5 (https=) 1971-09-03

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee