|
DE2062666A1
(de)
*
|
1970-12-19 |
1972-07-06 |
Bbc Brown Boveri & Cie |
Aus Bausteinen aufgebaute Stromrichteranlage
|
|
US3793603A
(en)
*
|
1972-07-17 |
1974-02-19 |
Ferraz & Cie Lucien |
Fuse cartridges
|
|
US4001711A
(en)
*
|
1974-08-05 |
1977-01-04 |
Motorola, Inc. |
Radio frequency power amplifier constructed as hybrid microelectronic unit
|
|
US4266089A
(en)
*
|
1978-09-14 |
1981-05-05 |
Isotronics, Incorporated |
All metal flat package having excellent heat transfer characteristics
|
|
US4266090A
(en)
*
|
1978-09-14 |
1981-05-05 |
Isotronics, Incorporated |
All metal flat package
|
|
FR2470445A1
(fr)
*
|
1979-11-21 |
1981-05-29 |
Thomson Csf |
Dispositif de mise en parallele de transistors bipolaires de puissance en tres haute frequence et amplificateur utilisant ce dispositif
|
|
JPS5874399U
(ja)
*
|
1981-11-13 |
1983-05-19 |
アルプス電気株式会社 |
電気部品の取付構造
|
|
FR2522203A1
(fr)
*
|
1982-02-24 |
1983-08-26 |
Sintra Alcatel Sa |
Traversee electrique de boitier de circuit hybride et connecteurs complementaires
|
|
FR2564243B1
(fr)
*
|
1984-05-11 |
1987-02-20 |
Europ Composants Electron |
Boitier a dissipation thermique d'encapsulation de circuits electriques
|
|
US4562512A
(en)
*
|
1984-07-23 |
1985-12-31 |
Sundstrand Corporation |
Multiple semiconductor containing package having a heat sink core
|
|
DE3506172A1
(de)
*
|
1985-02-22 |
1986-09-04 |
Telefunken electronic GmbH, 7100 Heilbronn |
Bauelementgehaeuse
|
|
EP0236065B1
(en)
*
|
1986-02-25 |
1990-11-28 |
Nec Corporation |
Liquid cooling system for integrated circuit chips
|
|
US4805420A
(en)
*
|
1987-06-22 |
1989-02-21 |
Ncr Corporation |
Cryogenic vessel for cooling electronic components
|
|
US5008492A
(en)
*
|
1989-10-20 |
1991-04-16 |
Hughes Aircraft Company |
High current feedthrough package
|
|
US5131272A
(en)
*
|
1990-03-15 |
1992-07-21 |
Harris Corporation |
Portable deployable automatic test system
|
|
US5059129A
(en)
*
|
1991-03-25 |
1991-10-22 |
International Business Machines Corporation |
Connector assembly including bilayered elastomeric member
|
|
US5099393A
(en)
*
|
1991-03-25 |
1992-03-24 |
International Business Machines Corporation |
Electronic package for high density applications
|
|
US5521427A
(en)
*
|
1992-12-18 |
1996-05-28 |
Lsi Logic Corporation |
Printed wiring board mounted semiconductor device having leadframe with alignment feature
|
|
US5465481A
(en)
*
|
1993-10-04 |
1995-11-14 |
Motorola, Inc. |
Method for fabricating a semiconductor package
|
|
USD356995S
(en)
|
1994-04-12 |
1995-04-04 |
Vlt Corporation |
Configurable, modular power supply
|
|
JPH08136105A
(ja)
*
|
1994-11-11 |
1996-05-31 |
Fanuc Ltd |
インバータ用筐体
|
|
DE19511755C1
(de)
*
|
1995-03-30 |
1996-08-22 |
Framatome Connectors Int |
Multiplex-Steuerung von Komponenten bzw. Untersystemen in Kraftfahrzeugen
|
|
US5736787A
(en)
*
|
1996-07-11 |
1998-04-07 |
Larimer; William R. |
Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices
|
|
US6270262B1
(en)
|
1999-11-10 |
2001-08-07 |
Harris Corporation |
Optical interconnect module
|
|
US6404628B1
(en)
*
|
2000-07-21 |
2002-06-11 |
General Motors Corporation |
Integrated power electronics cooling housing
|
|
DE102008007346A1
(de)
|
2008-02-04 |
2009-08-06 |
Robert Bosch Gmbh |
Metallisches Gehäuseteil und Verfahren zur Herstellung des Gehäuseteiles
|
|
US20150252666A1
(en)
|
2014-03-05 |
2015-09-10 |
Baker Hughes Incorporated |
Packaging for electronics in downhole assemblies
|
|
JP6450612B2
(ja)
*
|
2015-03-11 |
2019-01-09 |
日本特殊陶業株式会社 |
電子部品装置およびその製造方法
|
|
FR3087617B1
(fr)
|
2018-10-17 |
2023-10-27 |
Valeo Systemes De Controle Moteur |
Equipement electronique pour vehicule
|