GB1302674A - - Google Patents
Info
- Publication number
- GB1302674A GB1302674A GB4095271A GB4095271A GB1302674A GB 1302674 A GB1302674 A GB 1302674A GB 4095271 A GB4095271 A GB 4095271A GB 4095271 A GB4095271 A GB 4095271A GB 1302674 A GB1302674 A GB 1302674A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solution
- acid
- electroless plating
- contain
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 abstract 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000007772 electroless plating Methods 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 abstract 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 150000004686 pentahydrates Chemical class 0.000 abstract 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 abstract 1
- 239000006017 silicate glass-ceramic Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910001961 silver nitrate Inorganic materials 0.000 abstract 1
- 229910000029 sodium carbonate Inorganic materials 0.000 abstract 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 abstract 1
- 239000001119 stannous chloride Substances 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 abstract 1
- 229910052845 zircon Inorganic materials 0.000 abstract 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9594070A | 1970-12-07 | 1970-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1302674A true GB1302674A (en, 2012) | 1973-01-10 |
Family
ID=22254283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4095271A Expired GB1302674A (en, 2012) | 1970-12-07 | 1971-09-02 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3690921A (en, 2012) |
| DE (1) | DE2159612A1 (en, 2012) |
| FR (1) | FR2116376B1 (en, 2012) |
| GB (1) | GB1302674A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2141741A (en) * | 1983-06-09 | 1985-01-03 | Kollmorgen Tech Corp | Metallization of ceramics |
| GB2141740A (en) * | 1983-06-09 | 1985-01-03 | Kollmorgen Tech Corp | Metallization of ceramics |
| GB2169005A (en) * | 1984-12-10 | 1986-07-02 | Kollmorgen Tech Corp | Pretreating ceramic substrates for electroless deposition |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS507792A (en, 2012) * | 1973-05-24 | 1975-01-27 | ||
| JPS5330056Y2 (en, 2012) * | 1975-05-23 | 1978-07-27 | ||
| US4135012A (en) * | 1977-04-25 | 1979-01-16 | Corning Glass Works | Surface treatment of zirconia ceramic |
| US4196058A (en) * | 1977-11-23 | 1980-04-01 | Stettner & Co. | Electrical galvanic bath contact element |
| DE3150399A1 (de) * | 1981-12-15 | 1983-07-21 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur haftfesten metallisierung von keramischen materialien |
| US4428986A (en) | 1982-11-18 | 1984-01-31 | Eaton Corporation | Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon |
| DE3345353A1 (de) * | 1983-12-15 | 1985-08-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren und metallisierung einer keramikoberflaeche |
| US4701352A (en) * | 1984-05-10 | 1987-10-20 | Kollmorgen Corporation | Surface preparation of ceramic substrates for metallization |
| US4666744A (en) * | 1984-05-10 | 1987-05-19 | Kollmorgen Technologies Corporation | Process for avoiding blister formation in electroless metallization of ceramic substrates |
| US4647477A (en) * | 1984-12-07 | 1987-03-03 | Kollmorgen Technologies Corporation | Surface preparation of ceramic substrates for metallization |
| US4871108A (en) * | 1985-01-17 | 1989-10-03 | Stemcor Corporation | Silicon carbide-to-metal joint and method of making same |
| DE3523958A1 (de) * | 1985-07-04 | 1987-01-08 | Licentia Gmbh | Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung |
| DE3523960A1 (de) * | 1985-07-04 | 1987-01-08 | Licentia Gmbh | Verfahren zur metallisierung eines elektrisch schlecht leitenden substrates aus einem anorganischen material |
| DE3523961A1 (de) * | 1985-07-04 | 1987-01-15 | Licentia Gmbh | Vorrichtung zum behandeln mindestens eines keramikgegenstandes in einer alkalihydroxidschmelze |
| JPS62205615A (ja) * | 1986-03-05 | 1987-09-10 | 株式会社村田製作所 | セラミツクスの金属化方法 |
| US5058799A (en) * | 1986-07-24 | 1991-10-22 | Zsamboky Kalman F | Metallized ceramic substrate and method therefor |
| US4888208A (en) * | 1986-10-16 | 1989-12-19 | Toyo Boseki Kabushiki Kaisha | Ceramic substrate for printed circuits and production thereof |
| IT1215202B (it) * | 1986-12-03 | 1990-01-31 | G E V I P I A G | Organo di tenuta in materiale duro sinterizzato da un semilavorato formato con un legante organico |
| DE3827893A1 (de) * | 1988-08-17 | 1990-03-01 | Hoechst Ceram Tec Ag | Verfahren zur stromlosen abscheidung von nickel |
| DE3833441A1 (de) * | 1988-10-01 | 1990-04-05 | Hoechst Ag | Verfahren zum metallisieren von aluminiumoxid-substraten |
| US5849170A (en) * | 1995-06-19 | 1998-12-15 | Djokic; Stojan | Electroless/electrolytic methods for the preparation of metallized ceramic substrates |
| DE19541299C1 (de) * | 1995-11-06 | 1997-03-13 | Siemens Ag | Verfahren zum Auflösen eines ausgehärteten Glaslotes |
| US6953146B2 (en) * | 2002-10-24 | 2005-10-11 | Leonard Nanis | Low-temperature flux for soldering nickel-titanium alloys and other metals |
| US11084761B2 (en) | 2018-09-14 | 2021-08-10 | Honeywell International Inc. | Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate |
| US11827574B2 (en) | 2018-09-14 | 2023-11-28 | Honeywell International Inc. | Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate |
| CN112229273A (zh) * | 2020-09-09 | 2021-01-15 | 沈阳中钛装备制造有限公司 | 防弹插板的制备方法、电子设备及存储介质 |
-
1970
- 1970-12-07 US US3690921D patent/US3690921A/en not_active Expired - Lifetime
-
1971
- 1971-09-02 GB GB4095271A patent/GB1302674A/en not_active Expired
- 1971-10-12 FR FR7137577A patent/FR2116376B1/fr not_active Expired
- 1971-12-01 DE DE19712159612 patent/DE2159612A1/de active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2141741A (en) * | 1983-06-09 | 1985-01-03 | Kollmorgen Tech Corp | Metallization of ceramics |
| GB2141740A (en) * | 1983-06-09 | 1985-01-03 | Kollmorgen Tech Corp | Metallization of ceramics |
| AU567169B2 (en) * | 1983-06-09 | 1987-11-12 | Kollmorgen Corporation | Metallizing ceramics |
| GB2169005A (en) * | 1984-12-10 | 1986-07-02 | Kollmorgen Tech Corp | Pretreating ceramic substrates for electroless deposition |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2116376A1 (en, 2012) | 1972-07-13 |
| US3690921A (en) | 1972-09-12 |
| FR2116376B1 (en, 2012) | 1974-09-27 |
| DE2159612A1 (de) | 1972-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |