GB1299138A - Semiconductor processing apparatus - Google Patents

Semiconductor processing apparatus

Info

Publication number
GB1299138A
GB1299138A GB45502/71A GB4550271A GB1299138A GB 1299138 A GB1299138 A GB 1299138A GB 45502/71 A GB45502/71 A GB 45502/71A GB 4550271 A GB4550271 A GB 4550271A GB 1299138 A GB1299138 A GB 1299138A
Authority
GB
United Kingdom
Prior art keywords
wafer
coating
wafers
palet
cup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB45502/71A
Other languages
English (en)
Inventor
Forrest Robert Grundon
Frank Harrison Masterson
Robert John Wagler
Fred Ernest Wustrau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1299138A publication Critical patent/GB1299138A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
GB45502/71A 1970-10-23 1971-09-30 Semiconductor processing apparatus Expired GB1299138A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8340170A 1970-10-23 1970-10-23

Publications (1)

Publication Number Publication Date
GB1299138A true GB1299138A (en) 1972-12-06

Family

ID=22178060

Family Applications (1)

Application Number Title Priority Date Filing Date
GB45502/71A Expired GB1299138A (en) 1970-10-23 1971-09-30 Semiconductor processing apparatus

Country Status (5)

Country Link
US (1) US3707944A (https=)
JP (1) JPS5128466B1 (https=)
DE (1) DE2151037C3 (https=)
FR (1) FR2109716A5 (https=)
GB (1) GB1299138A (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6076652A (en) 1971-04-16 2000-06-20 Texas Instruments Incorporated Assembly line system and apparatus controlling transfer of a workpiece
US3896762A (en) * 1973-12-07 1975-07-29 Purdue Research Foundation Coating apparatus
DE2944180A1 (de) * 1979-11-02 1981-05-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer einen halbleiterkoerper einseitig bedeckenden isolierschicht
DE3041238C2 (de) * 1980-11-03 1982-09-30 Erich Bockhacker, Emaillierungen, 4401 Saerbeck Vorrichtung zum Beschichten der Innenseite von Hohlkörpern
NL8300649A (nl) * 1983-02-21 1984-09-17 Integrated Automation Methode en inrichting voor het aanbrengen van een coating op een substraat of tape.
NL8200753A (nl) * 1982-02-24 1983-09-16 Integrated Automation Methode en inrichting voor het aanbrengen van een coating op een substraat of tape.
JPS60210840A (ja) * 1984-03-06 1985-10-23 Fujitsu Ltd スピン処理装置
WO1987006057A1 (fr) * 1986-04-03 1987-10-08 Semax Prozess-Technik Gmbh INSTALLATION ET PROCEDE POUR TRAITER DES TRANCHES DE SEMICONDUCTEURS (TRANCHES DE Si OU GaAs) POUR CIRCUITS INTEGRES
DE3720525A1 (de) * 1987-06-20 1988-12-29 Pav Praezisions Apparatebau Ag Belackungsanlage fuer compact-discs
DE3732113C1 (de) * 1987-09-24 1988-10-20 Convac Gmbh Einrichtung zur Inline-Belackung von Compact-Discs
KR970006206B1 (ko) * 1988-02-10 1997-04-24 도오교오 에레구토론 가부시끼가이샤 자동 도포 시스템
JPH0828565B2 (ja) * 1990-09-06 1996-03-21 ティーディーケイ株式会社 電子部品のプリント基板への搭載方法
US5622747A (en) * 1991-09-18 1997-04-22 National Semiconductor Corporation Method for dispensing a layer of photoresist on a wafer without spinning the wafer
DE19718471A1 (de) * 1997-04-30 1998-11-05 Steag Hamatech Gmbh Machines Verfahren und Vorrichtung zum Verkleben von zwei Substraten
EP1626840A4 (en) * 2003-04-21 2008-09-03 Inopla Inc DEVICE AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS USING ONE OR MORE POLISHING SURFACES

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2185089A (en) * 1937-06-11 1939-12-26 Continental Can Co Machine for coating can ends
GB510141A (en) * 1938-02-04 1939-07-27 Philips Nv Improved method of constructing stratified electrode-systems
US2516908A (en) * 1945-09-24 1950-08-01 American Can Co Apparatus for lining can ends
US3357856A (en) * 1964-02-13 1967-12-12 Electra Mfg Company Method for metallizing openings in miniature printed circuit wafers
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
US3494326A (en) * 1968-02-01 1970-02-10 American Optical Corp Spin-coating machine

Also Published As

Publication number Publication date
JPS5128466B1 (https=) 1976-08-19
US3707944A (en) 1973-01-02
DE2151037A1 (de) 1972-05-04
DE2151037C3 (de) 1979-11-15
DE2151037B2 (de) 1979-03-15
FR2109716A5 (https=) 1972-05-26

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee