GB1295762A - - Google Patents

Info

Publication number
GB1295762A
GB1295762A GB1295762DA GB1295762A GB 1295762 A GB1295762 A GB 1295762A GB 1295762D A GB1295762D A GB 1295762DA GB 1295762 A GB1295762 A GB 1295762A
Authority
GB
United Kingdom
Prior art keywords
welding
welding block
block
march
effected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1295762A publication Critical patent/GB1295762A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Wire Bonding (AREA)
GB1295762D 1969-03-11 1970-03-06 Expired GB1295762A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6903784A NL6903784A (cg-RX-API-DMAC10.html) 1969-03-11 1969-03-11

Publications (1)

Publication Number Publication Date
GB1295762A true GB1295762A (cg-RX-API-DMAC10.html) 1972-11-08

Family

ID=19806386

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1295762D Expired GB1295762A (cg-RX-API-DMAC10.html) 1969-03-11 1970-03-06

Country Status (6)

Country Link
JP (1) JPS4830186B1 (cg-RX-API-DMAC10.html)
BE (1) BE747089A (cg-RX-API-DMAC10.html)
DE (1) DE2008779A1 (cg-RX-API-DMAC10.html)
FR (1) FR2037867A5 (cg-RX-API-DMAC10.html)
GB (1) GB1295762A (cg-RX-API-DMAC10.html)
NL (1) NL6903784A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112475582A (zh) * 2020-11-23 2021-03-12 东方电气集团东方汽轮机有限公司 一种获取大厚度钛合金电子束焊接平行型焊缝的工艺方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3118897A1 (de) * 1981-05-13 1982-12-02 Compur-Electronic GmbH, 8000 München Ultraschallschweiss-verfahren und -vorrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112475582A (zh) * 2020-11-23 2021-03-12 东方电气集团东方汽轮机有限公司 一种获取大厚度钛合金电子束焊接平行型焊缝的工艺方法

Also Published As

Publication number Publication date
DE2008779A1 (cg-RX-API-DMAC10.html) 1970-09-17
NL6903784A (cg-RX-API-DMAC10.html) 1970-09-15
BE747089A (fr) 1970-09-09
JPS4830186B1 (cg-RX-API-DMAC10.html) 1973-09-18
FR2037867A5 (cg-RX-API-DMAC10.html) 1970-12-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees