Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
  • B23K20/106—Features related to sonotrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07178—Means for aligning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
  • H10W72/07231—Techniques
  • H10W72/07236—Soldering or alloying

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Pressure Welding/Diffusion-Bonding (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Welding Or Cutting Using Electron Beams (AREA)
• Wire Bonding (AREA)

Priority Applications (6)

Applications Claiming Priority (1)

Publications (1)

Family

ID=19806386

Family Applications (1)

Country Status (6)

Families Citing this family (2)

• 1969
  • 1969-03-11 NL NL6903784A patent/NL6903784A/xx unknown
• 1970
  • 1970-02-25 DE DE19702008779 patent/DE2008779A1/de active Pending
  • 1970-03-06 GB GB1295762D patent/GB1295762A/en not_active Expired
  • 1970-03-09 BE BE747089D patent/BE747089A/xx unknown
  • 1970-03-09 JP JP45019661A patent/JPS4830186B1/ja active Pending
  • 1970-03-10 FR FR7008473A patent/FR2037867A5/fr not_active Expired

Also Published As

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