GB1289075A - - Google Patents

Info

Publication number
GB1289075A
GB1289075A GB1289075DA GB1289075A GB 1289075 A GB1289075 A GB 1289075A GB 1289075D A GB1289075D A GB 1289075DA GB 1289075 A GB1289075 A GB 1289075A
Authority
GB
United Kingdom
Prior art keywords
resist
substrate
photo resist
baked
april
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1289075A publication Critical patent/GB1289075A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1289075 Printed circuits WESTINGHOUSE ELECTRIC CORP 19 April 1971 [30 April 1970] 26746/71 Heading H1R In a method of forming a printed circuit (e.g. for a multi-chip integrated circuit) photo resist step is performed by exposing a resist deposited by a spin technique and baked at 120‹ C. for 10 minutes by collimated U.V. light 28 through a mask 26 positioned clear of the resist. An aluminium oxide substrate 10, coated with a molybdenum-manganese mix circuit pattern 24, 16 by a silk screen process is sintered and an aluminium oxide frame 22 having its top surface metallized by the mix is secured to the substrate by high temperature glass. The metallized areas exposed are coated with gold and the photo resist step performed. The resist is developed rinsed and baked as before. The substrate and mask is etched using 2 part iodine, 2 parts potassium iodide, 3 part water (all part by weight) plus sodium acetate added to adjust the pH to 6.5. The etchant is at 50-55‹ C. and removes the unexposed areas of gold. The photo resist is now removed. The other metals exposed are removed by a suitable method.
GB1289075D 1970-04-30 1971-04-19 Expired GB1289075A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3343170A 1970-04-30 1970-04-30

Publications (1)

Publication Number Publication Date
GB1289075A true GB1289075A (en) 1972-09-13

Family

ID=21870351

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1289075D Expired GB1289075A (en) 1970-04-30 1971-04-19

Country Status (1)

Country Link
GB (1) GB1289075A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498410A1 (en) * 1981-01-16 1982-07-23 Grace W R Ltd METHOD FOR PREPARING PRINTED CIRCUIT BOARDS, METHOD FOR SELECTIVELY DEPOSITING WELDING ON CERTAIN PARTS OF A PRINTED CIRCUIT BOARD, DEVICE FOR PRODUCING PRINTED CIRCUIT BOARDS, AND MULTI-VACUUM CHAMBER TRAY ASSEMBLY
EP0067840A1 (en) * 1980-12-22 1982-12-29 Eastman Kodak Co Method of fabricating a solid state electrooptical device having a transparent metal oxide electrode.
US4422914A (en) 1981-01-16 1983-12-27 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4436806A (en) 1981-01-16 1984-03-13 W. R. Grace & Co. Method and apparatus for making printed circuit boards
US4442198A (en) * 1981-01-16 1984-04-10 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4451636A (en) * 1981-01-16 1984-05-29 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4481281A (en) * 1981-01-16 1984-11-06 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
GB2247784A (en) * 1990-07-18 1992-03-11 Nippon Cmk Kk P.C.B. Manufacture with electrodeposited resist

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067840A1 (en) * 1980-12-22 1982-12-29 Eastman Kodak Co Method of fabricating a solid state electrooptical device having a transparent metal oxide electrode.
EP0067840A4 (en) * 1980-12-22 1985-02-28 Eastman Kodak Co Method of fabricating a solid state electrooptical device having a transparent metal oxide electrode.
FR2498410A1 (en) * 1981-01-16 1982-07-23 Grace W R Ltd METHOD FOR PREPARING PRINTED CIRCUIT BOARDS, METHOD FOR SELECTIVELY DEPOSITING WELDING ON CERTAIN PARTS OF A PRINTED CIRCUIT BOARD, DEVICE FOR PRODUCING PRINTED CIRCUIT BOARDS, AND MULTI-VACUUM CHAMBER TRAY ASSEMBLY
US4422914A (en) 1981-01-16 1983-12-27 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4436806A (en) 1981-01-16 1984-03-13 W. R. Grace & Co. Method and apparatus for making printed circuit boards
US4442198A (en) * 1981-01-16 1984-04-10 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4451636A (en) * 1981-01-16 1984-05-29 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4481281A (en) * 1981-01-16 1984-11-06 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
GB2247784A (en) * 1990-07-18 1992-03-11 Nippon Cmk Kk P.C.B. Manufacture with electrodeposited resist

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees