GB1288278A - - Google Patents
Info
- Publication number
- GB1288278A GB1288278A GB5686169A GB5686169A GB1288278A GB 1288278 A GB1288278 A GB 1288278A GB 5686169 A GB5686169 A GB 5686169A GB 5686169 A GB5686169 A GB 5686169A GB 1288278 A GB1288278 A GB 1288278A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- oxide layer
- semi
- conductor
- isolated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 abstract 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 2
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78817768A | 1968-12-31 | 1968-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1288278A true GB1288278A (fr) | 1972-09-06 |
Family
ID=25143680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5686169A Expired GB1288278A (fr) | 1968-12-31 | 1969-11-20 |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1965408C3 (fr) |
FR (1) | FR2027429B1 (fr) |
GB (1) | GB1288278A (fr) |
NL (1) | NL6918388A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4983538A (en) * | 1987-11-20 | 1991-01-08 | Fujitsu Limited | Method for fabricating a silicon carbide substrate |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579057A (en) * | 1969-08-18 | 1971-05-18 | Rca Corp | Method of making a semiconductor article and the article produced thereby |
GB1439351A (en) * | 1972-06-02 | 1976-06-16 | Texas Instruments Inc | Capacitor |
US4238275A (en) * | 1978-12-29 | 1980-12-09 | International Business Machines Corporation | Pyrocatechol-amine-water solution for the determination of defects |
JPH0775245B2 (ja) * | 1990-11-16 | 1995-08-09 | 信越半導体株式会社 | 誘電体分離基板及びその製造方法 |
JPH0775244B2 (ja) * | 1990-11-16 | 1995-08-09 | 信越半導体株式会社 | 誘電体分離基板及びその製造方法 |
RU2220449C1 (ru) | 2002-12-19 | 2003-12-27 | Акционерное общество закрытого типа "ЛИТЭКС" | Способ маркирования изделий с помощью набора меток и метка для маркирования |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3425879A (en) * | 1965-10-24 | 1969-02-04 | Texas Instruments Inc | Method of making shaped epitaxial deposits |
NL144778B (nl) * | 1966-12-20 | 1975-01-15 | Western Electric Co | Werkwijze voor het vervaardigen van een halfgeleiderinrichting door anisotroop etsen alsmede aldus vervaardigde inrichting. |
-
1969
- 1969-11-20 GB GB5686169A patent/GB1288278A/en not_active Expired
- 1969-12-08 NL NL6918388A patent/NL6918388A/xx unknown
- 1969-12-19 FR FR6944145A patent/FR2027429B1/fr not_active Expired
- 1969-12-30 DE DE19691965408 patent/DE1965408C3/de not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4983538A (en) * | 1987-11-20 | 1991-01-08 | Fujitsu Limited | Method for fabricating a silicon carbide substrate |
Also Published As
Publication number | Publication date |
---|---|
DE1965408C3 (de) | 1979-01-25 |
FR2027429B1 (fr) | 1973-08-10 |
NL6918388A (fr) | 1970-07-02 |
FR2027429A1 (fr) | 1970-09-25 |
DE1965408A1 (de) | 1970-07-16 |
DE1965408B2 (de) | 1978-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |