GB1287110A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB1287110A GB1287110A GB61515/69A GB6151569A GB1287110A GB 1287110 A GB1287110 A GB 1287110A GB 61515/69 A GB61515/69 A GB 61515/69A GB 6151569 A GB6151569 A GB 6151569A GB 1287110 A GB1287110 A GB 1287110A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plate
- metal layer
- dielectric
- capacitor
- dec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 239000003990 capacitor Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/66—Conductor-insulator-semiconductor capacitors, e.g. MOS capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19681816023 DE1816023A1 (de) | 1968-12-20 | 1968-12-20 | Baustein mit elektronischer Schaltung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1287110A true GB1287110A (en) | 1972-08-31 |
Family
ID=5716910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB61515/69A Expired GB1287110A (en) | 1968-12-20 | 1969-12-17 | Semiconductor devices |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS49393B1 (enrdf_load_stackoverflow) |
| CA (1) | CA938030A (enrdf_load_stackoverflow) |
| DE (1) | DE1816023A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2026673A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1287110A (enrdf_load_stackoverflow) |
| NL (1) | NL6918811A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2258943A (en) * | 1991-08-19 | 1993-02-24 | Samsung Electronics Co Ltd | Noise suppression in integrated circuit device |
| WO1997012398A1 (en) * | 1995-09-29 | 1997-04-03 | Analog Devices, Inc. | Integrated circuit and supply decoupling capacitor therefor |
| CN101506965B (zh) * | 2006-09-21 | 2012-05-09 | 松下电器产业株式会社 | 半导体芯片、半导体安装模块、移动装置通信设备、半导体芯片的制造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62171286U (enrdf_load_stackoverflow) * | 1986-04-21 | 1987-10-30 | ||
| JPH01146354A (ja) * | 1987-12-02 | 1989-06-08 | Mitsubishi Electric Corp | 半導体記憶装置 |
| KR102470653B1 (ko) | 2020-09-28 | 2022-11-24 | 고려대학교 산학협력단 | 특정 단백질의 메티오닌 잔기의 산화정도를 정량적으로 측정할 수 있는 형광단백질 센서 및 이의 용도 |
-
1968
- 1968-12-20 DE DE19681816023 patent/DE1816023A1/de active Pending
-
1969
- 1969-12-16 NL NL6918811A patent/NL6918811A/xx unknown
- 1969-12-17 JP JP44101002A patent/JPS49393B1/ja active Pending
- 1969-12-17 GB GB61515/69A patent/GB1287110A/en not_active Expired
- 1969-12-18 CA CA070244A patent/CA938030A/en not_active Expired
- 1969-12-18 FR FR6943883A patent/FR2026673A1/fr not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2258943A (en) * | 1991-08-19 | 1993-02-24 | Samsung Electronics Co Ltd | Noise suppression in integrated circuit device |
| WO1997012398A1 (en) * | 1995-09-29 | 1997-04-03 | Analog Devices, Inc. | Integrated circuit and supply decoupling capacitor therefor |
| US5895966A (en) * | 1995-09-29 | 1999-04-20 | Analog Devices, Inc. | Integrated circuit and supply decoupling capacitor therefor |
| CN101506965B (zh) * | 2006-09-21 | 2012-05-09 | 松下电器产业株式会社 | 半导体芯片、半导体安装模块、移动装置通信设备、半导体芯片的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2026673A1 (enrdf_load_stackoverflow) | 1970-09-18 |
| DE1816023A1 (de) | 1970-06-25 |
| NL6918811A (enrdf_load_stackoverflow) | 1970-06-23 |
| CA938030A (en) | 1973-12-04 |
| JPS49393B1 (enrdf_load_stackoverflow) | 1974-01-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |