GB1276034A - Method of and solution for accelerating activation of plastics substrates in electroless metal plating - Google Patents
Method of and solution for accelerating activation of plastics substrates in electroless metal platingInfo
- Publication number
- GB1276034A GB1276034A GB02302/70D GB1230270D GB1276034A GB 1276034 A GB1276034 A GB 1276034A GB 02302/70 D GB02302/70 D GB 02302/70D GB 1230270 D GB1230270 D GB 1230270D GB 1276034 A GB1276034 A GB 1276034A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solution
- accelerating
- plastics
- metal plating
- electroless metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003023 plastic Polymers 0.000 title abstract 3
- 239000004033 plastic Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title abstract 2
- 230000004913 activation Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 150000002500 ions Chemical class 0.000 abstract 3
- 238000007772 electroless plating Methods 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 101150003085 Pdcl gene Proteins 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 abstract 1
- 229910002855 Sn-Pd Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229920002492 poly(sulfone) Polymers 0.000 abstract 1
- -1 polypropylene Polymers 0.000 abstract 1
- 229920001155 polypropylene Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81418069A | 1969-04-07 | 1969-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1276034A true GB1276034A (en) | 1972-06-01 |
Family
ID=25214373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB02302/70D Expired GB1276034A (en) | 1969-04-07 | 1970-03-13 | Method of and solution for accelerating activation of plastics substrates in electroless metal plating |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3622370A (enrdf_load_stackoverflow) |
| JP (1) | JPS502860B1 (enrdf_load_stackoverflow) |
| BE (1) | BE748540A (enrdf_load_stackoverflow) |
| DE (1) | DE2016397A1 (enrdf_load_stackoverflow) |
| ES (1) | ES378720A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2042997A5 (enrdf_load_stackoverflow) |
| GB (1) | GB1276034A (enrdf_load_stackoverflow) |
| NL (1) | NL7004348A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
| US4246320A (en) * | 1979-03-15 | 1981-01-20 | Stauffer Chemical Company | Plated acrylate/styrene/acrylonitrile article |
| US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
| JPH0159038U (enrdf_load_stackoverflow) * | 1987-10-09 | 1989-04-13 | ||
| US5962073A (en) * | 1997-06-02 | 1999-10-05 | Lacks Industries, Inc. | Method for electroplating elastomer-modified polyphthalamide articles |
| CN103009708A (zh) * | 2011-09-21 | 2013-04-03 | 深圳富泰宏精密工业有限公司 | 镀膜件及其制造方法 |
| CN113151812B (zh) * | 2021-04-20 | 2022-10-11 | 广东工业大学 | 一种锡活化液及其制备方法和化学镀镍方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| GB1063092A (en) * | 1964-05-07 | 1967-03-30 | Sperry Gyroscope Co Ltd | Improvements in metal plating processes |
| US3445350A (en) * | 1965-10-11 | 1969-05-20 | Borg Warner | Metal plating of plastic materials |
| US3432338A (en) * | 1967-04-17 | 1969-03-11 | Diamond Shamrock Corp | Electroless nickel,cobalt and nickel-cobalt alloy plating from fluoborates sources |
| US3507681A (en) * | 1967-06-02 | 1970-04-21 | Mine Safety Appliances Co | Metal plating of plastics |
-
1969
- 1969-04-07 US US814180A patent/US3622370A/en not_active Expired - Lifetime
-
1970
- 1970-03-13 GB GB02302/70D patent/GB1276034A/en not_active Expired
- 1970-03-26 NL NL7004348A patent/NL7004348A/xx unknown
- 1970-04-06 BE BE748540D patent/BE748540A/xx unknown
- 1970-04-06 DE DE19702016397 patent/DE2016397A1/de active Pending
- 1970-04-06 JP JP45028672A patent/JPS502860B1/ja active Pending
- 1970-04-06 FR FR7012415A patent/FR2042997A5/fr not_active Expired
- 1970-04-06 ES ES378720A patent/ES378720A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2042997A5 (enrdf_load_stackoverflow) | 1971-02-12 |
| NL7004348A (enrdf_load_stackoverflow) | 1970-10-09 |
| JPS502860B1 (enrdf_load_stackoverflow) | 1975-01-29 |
| DE2016397A1 (de) | 1970-10-08 |
| BE748540A (fr) | 1970-09-16 |
| ES378720A1 (es) | 1972-06-16 |
| US3622370A (en) | 1971-11-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1482708A (en) | Catalytic treatment of non-conductors for chemical platin | |
| ES485223A1 (es) | Un procedimiento para el tratamiento de un substrato plasti-co polimerico | |
| GB1145578A (en) | Electroless deposition of metals | |
| GB1276034A (en) | Method of and solution for accelerating activation of plastics substrates in electroless metal plating | |
| IE41858L (en) | Electrodeposition of noble metal alloys | |
| US4001470A (en) | Process and bath for the metallization of synthetic-resin | |
| ES382866A1 (es) | Un procedimiento de chapado no electrolitico. | |
| GB1426462A (en) | Process and composition for sensitizing articles for metallization | |
| US3556839A (en) | Electroless metal coating | |
| GB1286941A (en) | Chemical reduction copper plating | |
| GB1238039A (enrdf_load_stackoverflow) | ||
| GB1206741A (en) | Process for electroplating polyoxymethylene resins | |
| CA1200952A (en) | Electroless copper plating rate controller | |
| GB1298734A (en) | Improvements in or relating to the deposition of nickel coatings on a synthetic plastics base material | |
| GB1379830A (en) | Process for bonding titanium or tantalum to copper o' iron | |
| GB1346273A (en) | Metal plating of plastics materials | |
| GB1198193A (en) | Prevention of Skip Plating in an Electroless Nickel Bath | |
| GB1529151A (en) | Electroless copper plating | |
| GB1310306A (en) | Process for preparing metal-coated plastics materials | |
| GB1214429A (en) | Surface-pretreatment of articles made from polyethylene or polypropylene or ethylene-propylene copolymers for chemical nickel-plating | |
| GB1214420A (en) | Surface-pretreatment of non-metallic articles for chemical nickel-plating | |
| GB1164459A (en) | A Process for the Metallisation of Non-Conductors | |
| ES383870A1 (es) | Un procedimiento para el recubrimiento no electrolitico de una resina de acrilonitrilo - butadieno - estireno con un metal. | |
| ES8205268A1 (es) | Procedimiento para la precipitacion sin corriente de una ca-pa metalica | |
| GB1463304A (en) | Treatment of the surfaces of synthetic polymeric materials for electroless metal deposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |