GB1263703A - Method of making connections to semi-conductor devices - Google Patents

Method of making connections to semi-conductor devices

Info

Publication number
GB1263703A
GB1263703A GB38065/68A GB3806568A GB1263703A GB 1263703 A GB1263703 A GB 1263703A GB 38065/68 A GB38065/68 A GB 38065/68A GB 3806568 A GB3806568 A GB 3806568A GB 1263703 A GB1263703 A GB 1263703A
Authority
GB
United Kingdom
Prior art keywords
terminal
wafer
semi
making connections
conductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB38065/68A
Inventor
Raymond Patrick Siddell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB38065/68A priority Critical patent/GB1263703A/en
Priority to FR6925377A priority patent/FR2015334A1/fr
Priority to ES1969175148U priority patent/ES175148Y/en
Priority to DE19691940450 priority patent/DE1940450A1/en
Publication of GB1263703A publication Critical patent/GB1263703A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Abstract

1,263,703. Direct connections. JOSEPH LUCAS (INDUSTRIES) Ltd. 18 July 1969, [9 Aug., 1968], No. 38065/68. Heading H2E. [Also in Division H1] A wafer 11 containing a PN junction is soldered to a conductive support (not shown) acting as one terminal of the device and a second terminal 13 is soldered to the other face of the wafer. The second terminal 13 has a convex (for example, part-spherical) surface 16 in point contact with the wafer so that the solder can flow between the parts to form a good bond. The solder also flows over the concave neck 15 of the terminal to further anchor the parts when it has solidified.
GB38065/68A 1968-08-09 1968-08-09 Method of making connections to semi-conductor devices Expired GB1263703A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB38065/68A GB1263703A (en) 1968-08-09 1968-08-09 Method of making connections to semi-conductor devices
FR6925377A FR2015334A1 (en) 1968-08-09 1969-07-25
ES1969175148U ES175148Y (en) 1968-08-09 1969-08-06 CONNECTOR FOR SEMICONDUCTOR DEVICES.
DE19691940450 DE1940450A1 (en) 1968-08-09 1969-08-08 Method of making an electrical connection on a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB38065/68A GB1263703A (en) 1968-08-09 1968-08-09 Method of making connections to semi-conductor devices

Publications (1)

Publication Number Publication Date
GB1263703A true GB1263703A (en) 1972-02-16

Family

ID=10400918

Family Applications (1)

Application Number Title Priority Date Filing Date
GB38065/68A Expired GB1263703A (en) 1968-08-09 1968-08-09 Method of making connections to semi-conductor devices

Country Status (4)

Country Link
DE (1) DE1940450A1 (en)
ES (1) ES175148Y (en)
FR (1) FR2015334A1 (en)
GB (1) GB1263703A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2209253A (en) * 1987-08-28 1989-05-04 Polyhitech Electrical connection pin

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2122104C3 (en) * 1971-05-05 1979-08-23 Robert Bosch Gmbh, 7000 Stuttgart Method for soldering a metallic connecting conductor to a semiconductor body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2209253A (en) * 1987-08-28 1989-05-04 Polyhitech Electrical connection pin

Also Published As

Publication number Publication date
DE1940450A1 (en) 1970-02-19
ES175148U (en) 1972-06-01
FR2015334A1 (en) 1970-04-24
ES175148Y (en) 1973-02-16

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