GB1258061A - - Google Patents
Info
- Publication number
- GB1258061A GB1258061A GB896868A GB1258061DA GB1258061A GB 1258061 A GB1258061 A GB 1258061A GB 896868 A GB896868 A GB 896868A GB 1258061D A GB1258061D A GB 1258061DA GB 1258061 A GB1258061 A GB 1258061A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bore
- gms
- litre
- deposit
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
- F28F1/405—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element and being formed of wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemically Coating (AREA)
Abstract
1,258,061. Soldering. ENGLISH ELECTRIC CO. Ltd. 21 Feb., 1969 [23 Feb., 1968], No. 8968/68. Heading B3R. [Also in Division C7] In making a heat exchanger a metallic compound is passed through the bore of an aluminium or light alloy body to produce an immersion deposit of metal on the bore by displacement, followed by a mixture of a chemically reducible metallic salt and a reducing agent to chemically deposit a layer of solderable metal over the immersion deposit, a component is inserted into the bore in contact with the solderable metal and the bore is flushed with molten solder to wet the mating surfaces of the component and bore. The heat exchanger may provide a heat sink for diodes, thyristors &c. and may also form a busbar, being cooled by water or oil passed through the bore. An aluminium tube 1 is cleaned, arranged vertically or inclined and connected in circuit with a pump which supplies aqueous solutions of sodium hydroxide, sulphuric acid and nitric acid to etch the bore. The bore is then coated with zinc by pumping an aqueous solution of sodium hydroxide, e.g. 400 gms-litre and zinc oxide, e.g. 80 gms-litre through the bore. After washing with de-mineralized water the bore is electroless plated with nickel by pumping through a solution of nickel chloride (30 gms/litre), trisodium citrate (100 gms/litre) sodium chloride, (5 gms/litre) ammonium chloride (50 gms/litre) and sodium hypophosphite (10 gms/litre) the solution being pumped for 5 minutes at 88-90‹ C. with pH 8-10. After washing, the bore is coated with flux and a fluxed turbulator formed by a coil 3 held by a wire 4 on a spindle 2, all of copper, is inserted into the bore. The assembly is immersed in 60/40 tin/lead solder and agitated to wet the mating surfaces. After cooling a soldered joint is formed between the coil and bore.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB896868 | 1968-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1258061A true GB1258061A (en) | 1971-12-22 |
Family
ID=9862777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB896868A Expired GB1258061A (en) | 1968-02-23 | 1968-02-23 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1258061A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4948031A (en) * | 1986-11-10 | 1990-08-14 | Hazeltine Corporation | Process for bonding aluminum with cadmium and product thereof |
US5044546A (en) * | 1986-11-10 | 1991-09-03 | Hazeltine Corporation | Process for bonding aluminum sheets with cadmium and product thereof |
US5151332A (en) * | 1986-11-10 | 1992-09-29 | Hazeltine Corporation | Aluminum sheets bonded with cadmium |
EP1271089A2 (en) * | 2001-06-25 | 2003-01-02 | Delphi Technologies, Inc. | Laminar flow optional liquid cooler |
-
1968
- 1968-02-23 GB GB896868A patent/GB1258061A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4948031A (en) * | 1986-11-10 | 1990-08-14 | Hazeltine Corporation | Process for bonding aluminum with cadmium and product thereof |
US5044546A (en) * | 1986-11-10 | 1991-09-03 | Hazeltine Corporation | Process for bonding aluminum sheets with cadmium and product thereof |
US5151332A (en) * | 1986-11-10 | 1992-09-29 | Hazeltine Corporation | Aluminum sheets bonded with cadmium |
EP1271089A2 (en) * | 2001-06-25 | 2003-01-02 | Delphi Technologies, Inc. | Laminar flow optional liquid cooler |
EP1271089A3 (en) * | 2001-06-25 | 2004-03-31 | Delphi Technologies, Inc. | Laminar flow optional liquid cooler |
US6997246B2 (en) | 2001-06-25 | 2006-02-14 | Delphi Technologies, Inc. | Laminar flow optional liquid cooler |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |