JPS62204557A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS62204557A JPS62204557A JP4779486A JP4779486A JPS62204557A JP S62204557 A JPS62204557 A JP S62204557A JP 4779486 A JP4779486 A JP 4779486A JP 4779486 A JP4779486 A JP 4779486A JP S62204557 A JPS62204557 A JP S62204557A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- cobalt
- plating
- lead
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000010941 cobalt Substances 0.000 claims abstract description 23
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 22
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052737 gold Inorganic materials 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 16
- 229910000531 Co alloy Inorganic materials 0.000 claims abstract description 11
- 239000010935 stainless steel Substances 0.000 claims abstract description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 14
- 238000005476 soldering Methods 0.000 abstract description 10
- 229910052742 iron Inorganic materials 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半導体装置などの電子部品に用いられるリード
フレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead frame used for electronic components such as semiconductor devices.
（従来の技術）
樹脂封止型半導体装置におけるリードフレームは、鉄−
ニッケル合金材などの鉄系材又は銅材、銅合金材などの
銅系材が素材として用いられ、一般にステージ部に銀又
は金めつきを施し、内部リード部先端部には銀又は金め
つきを施して使用される。また、樹脂封止後プリント基
板等とのはんだ付は性を確保する目的でリードフレーム
の外部リード部に、錫めっき、はんだめっき、あるいは
はんだ浸漬処理が施されて製品化される。(Prior art) Lead frames in resin-sealed semiconductor devices are made of iron.
Iron-based materials such as nickel alloy materials, copper materials, copper-based materials such as copper alloy materials are used as materials, and generally the stage part is plated with silver or gold, and the tip of the internal lead part is plated with silver or gold. It is used after applying. Furthermore, after resin sealing, the external leads of the lead frame are subjected to tin plating, solder plating, or solder immersion treatment in order to ensure solderability with a printed circuit board or the like.
このリードフレームの材料コスト低減の為、鉄系材料か
らステンレス（以下ＳＵＳと示す）材への切替が考えら
れている。又、銅系材料は強度的な問題から同様にＳｕ
Ｓ材への切替が検討されている。In order to reduce the material cost of this lead frame, switching from iron-based materials to stainless steel (hereinafter referred to as SUS) material is being considered. In addition, due to strength problems, copper-based materials are also made of Su.
Switching to S material is being considered.
（発明が解決しようとする問題点）
リードフレーム素材として、Ｓ［ＩＳ材が鉄系および銅
系材料より望ましい点があるが、リードフレームは前記
のようにステージ部、内部リード部および外部リード部
に各種のめっき、あるいははんだ浸漬処理して使用され
る。しかしながら、前記のＳＯ３材から成るリードフレ
ームはめっき性およびはんだ付は性に問題がある。即ち
、
（１） ５ＩＪＳ材に直に純銀、又は純金めっきが施
しにくい。(Problems to be Solved by the Invention) As a lead frame material, S[IS material is preferable to iron-based and copper-based materials, but as mentioned above, the lead frame has a stage part, an internal lead part, and an external lead part. It is used after various plating or solder dipping treatments. However, the lead frame made of the SO3 material has problems in plating and soldering properties. That is, (1) It is difficult to directly plate pure silver or pure gold on 5IJS material.
（２）同様に、直にアルミニューム蒸着が施しにくい。(2) Similarly, it is difficult to apply aluminum vapor deposition directly.
（３１ＳＵＳ材ははんだ付は性において、他材料に比較
して劣る、
等の問題点がある。(31SUS material has problems such as inferior soldering properties compared to other materials.
なお、ＳＵＳ材リードフレームにニッケルめっきを施す
ことが提案されているが、はんだ付は性が劣るため強い
フラックスを使用したり、更にはその上に錫などのめっ
きが必要であり、また、上に金あるいは銀めっきを施し
た場合、ニッケルの拡散バリヤーとしての役割が劣るた
め金、銀中に拡（ＩＪｉシ易いという問題点がある。It has been proposed to apply nickel plating to the SUS lead frame, but since the soldering properties are poor, strong flux must be used, and furthermore, it is necessary to use tin or other plating on top of the nickel plating. When plated with gold or silver, there is a problem that nickel tends to spread into the gold or silver because the role of nickel as a diffusion barrier is poor.
（問題点を解決するための手段）
ＳＵＳ材リードフレームについて、
（１） それに金、銀めっきを容易に施す、（２）
それへのアルミニューム蒸着を容易にする、（３）
それへのはんだ付は性を向上させる。(Means for solving the problem) Regarding the SUS material lead frame, (1) gold and silver plating can be easily applied to it, (2)
(3) facilitates aluminum deposition thereon;
Soldering to it improves the properties.
これらを目的としてＳＵＳ材リードフレームの表面処理
、より具体的には機能めっきにより鉄系材および銅系材
リードフレームと同等、あるいはそれ以上のボンディン
グ特性、はんだ付は性を有するＳＵＳ材リードフレーム
を得ることにある。For these purposes, we have created a SUS lead frame that has bonding properties and soldering properties equivalent to or better than those of iron-based and copper-based lead frames through surface treatment of the SUS lead frame, and more specifically, functional plating. It's about getting.
即ち、本発明はＳＵＳ材から成るリードフレームの表面
に、少なくともコバルトまたはコバルト合金めっきを施
したことを特徴とするリードフレームであり、更にこの
コバルトまたはコルト合金めっきしたリードフレームの
少なくとも内部リード部に、金めつき、銀めっき、又は
アルミニューム蒸着を施したリードフレームであり、更
に、コバルトまたはコバルト合金めっきしたリードフレ
ームの外部リード部に、錫、錫−鉛合金、錫−ニッケル
合金などのはんだ付けが容易な金属めっきを方缶したリ
ードフレームに関するものである。That is, the present invention is a lead frame made of SUS material, the surface of which is coated with at least cobalt or cobalt alloy, and furthermore, at least the inner lead portion of the lead frame plated with cobalt or colt alloy is coated with cobalt or cobalt alloy. , gold-plated, silver-plated, or aluminum vapor-deposited lead frame, and the outer lead part of the cobalt- or cobalt-alloy plated lead frame is soldered with tin, tin-lead alloy, tin-nickel alloy, etc. This invention relates to a lead frame coated with metal plating that is easy to attach.
（実施例）
以下本発明の好適な実施例を添付図面に基づいて詳細に
説明する。(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
第１図は樹脂封止型半導体装置に用いるＳＯＳ材リーす
フレームｌを示す。FIG. 1 shows an SOS material-lead frame l used for a resin-sealed semiconductor device.
図において、２はステージ部であり、コバルト、金ある
いは銀めっきが施されており、半導体素子が固定される
部位である。In the figure, reference numeral 2 denotes a stage portion, which is plated with cobalt, gold, or silver, and is a portion to which a semiconductor element is fixed.
３は、ステージ部２を囲んで設けられた内部リード部で
あり、これの先端にはコバルト、金あるいは銀めっき、
あるいはアルミニューム蒸着膜が施されており、ステー
ジ部２に搭載された半導体素子とワイヤーによって接続
される。3 is an internal lead part provided surrounding the stage part 2, the tip of which is plated with cobalt, gold or silver;
Alternatively, it is coated with an aluminum vapor-deposited film, and is connected to the semiconductor element mounted on the stage section 2 by a wire.
４は内部リード部３に続く外部リード部であり、コバル
ト、あるいは錫−鉛合金めっきなどが施されている。Reference numeral 4 denotes an outer lead portion following the inner lead portion 3, and is plated with cobalt or tin-lead alloy.
５はダムバーであり、樹脂の堰止めをする。5 is a dam bar, which dams the resin.
６は外枠である。6 is an outer frame.
図上破線で示すのは、樹脂モールド領域である。The area indicated by the broken line in the figure is the resin mold area.
第２図乃至第５図に示すものは、めっきの種類およびめ
っきの被着範囲を示す種々の実施例である。What is shown in FIGS. 2 to 5 are various examples showing the type of plating and the coverage area of the plating.
第２図に示すものは、リードフレーム１の全範囲に亘り
、コバルトめっき皮膜７が形成され、ステージ部２およ
び内部リード部３の一部に金あるいは銀めっき８が施さ
れて成る。In the structure shown in FIG. 2, a cobalt plating film 7 is formed over the entire range of the lead frame 1, and gold or silver plating 8 is applied to part of the stage section 2 and internal lead section 3.
第３図に示すものは、リードフレーム１の全範囲に亘り
、コバルトめっき皮膜７が形成され、ステージ部２およ
び内部リード部３の一部に銀あるいは金のめっき皮膜８
が施されている。そして、外部リード部４上に、錫−鉛
合金めっき皮膜９が形成されて成る。In the case shown in FIG. 3, a cobalt plating film 7 is formed over the entire range of the lead frame 1, and a silver or gold plating film 8 is formed on a part of the stage section 2 and internal lead section 3.
is applied. Then, a tin-lead alloy plating film 9 is formed on the external lead portion 4.
第４図に示すものは、リードフレームｌの全体に亘って
コバルトめっき皮膜７が形成され、内部リード部３の先
端に、アルミニューム蒸着膜１０が施されて成っている
。In the device shown in FIG. 4, a cobalt plating film 7 is formed over the entire lead frame 1, and an aluminum vapor-deposited film 10 is applied to the tip of the internal lead portion 3.
第５図に示すものは、リードフレーム１の全体に亘って
同様にコバルトめっき皮膜７が形成され、その上に更に
銀あるいは金めつき皮膜８が全体に亘って施されて成っ
ている。In the structure shown in FIG. 5, a cobalt plating film 7 is similarly formed over the entire lead frame 1, and a silver or gold plating film 8 is further applied over the entire lead frame 1.
本発明は、要するにめっき性およびはんだ付は性が劣る
ＳＵＳ材リードフレームにコバルトまたはコバルト合金
めっき皮膜を下地として形成させこの皮膜上に各種の全
屈皮膜を施したＳＵＳ材リードフレームである。In short, the present invention is an SUS material lead frame in which a cobalt or cobalt alloy plating film is formed as a base on a SUS material lead frame which has poor plating and soldering properties, and various full-flex coatings are applied on this film.
実施例１
塩酸 １２０ｇ／β塩化ニッ
ケル・６水和物 ２５０ｇ／ １浴温
５０℃上記ワット浴により５ＵＳ４
１０（１３％Ｃｒ含有）素材リードフレームの全体に電
流密度５．０Δ／ｄｎ（で３０秒間通電してニッケルめ
っき０．０５μｍを施したのち、更に下記のコバルトめ
っき浴により電流密度（電圧６ｖ）７Ａ／ｄｒ＋？で３
０秒間通電しコバルトめっきを０．０５μｍ施した。Example 1 Hydrochloric acid 120g/β-nickel chloride hexahydrate 250g/1 bath temperature
5US4 by Watts bath above 50℃
10 (containing 13% Cr) material, the entire lead frame was energized for 30 seconds at a current density of 5.0Δ/dn (nickel plating of 0.05 μm), and then further coated with the following cobalt plating bath at a current density (voltage of 6 V). 3 at 7A/dr+?
Electricity was applied for 0 seconds, and cobalt plating was applied to a thickness of 0.05 μm.
塩化コバルト ３００ｇ／ １塩酸
１２０ｇ／ ｊ２次にこのコ
バルト下地めっき上に、ステージ部および内部リード部
には銅ストライクめっきを部分めっきし、さらにその上
に部分銀めっきを施したリードフレーム。Cobalt chloride 300g/1 hydrochloric acid
120g/j2 Next, on top of this cobalt underplating, the stage portion and internal lead portions are partially plated with copper strike plating, and furthermore, a lead frame is partially plated with silver.
実施例２
実施例１と同一のコバルトめっき浴を用い、５ＵＳ３０
４ （１８％Ｃｒ含有）素材リードフレーム全体にコバ
ルトめっき皮膜を０．０５μｍ施したのち、ステージ部
および内部リード部には銅ストライクめっきを部分めっ
きし、さらに部分銀めっきを施し、外部リード部のみに
錫−鉛合金めっきを施したリードフレーム。Example 2 Using the same cobalt plating bath as in Example 1, 5US30
4 (Contains 18% Cr) Material After applying a cobalt plating film of 0.05 μm to the entire lead frame, the stage part and internal lead parts are partially plated with copper strike plating, and then partially silver plating is applied, and only the external lead part is plated. Lead frame with tin-lead alloy plating.
実施例３
実施例２と同一のめっき浴を用い、５ＵＳ３０４素材リ
一ドフレーム全体にコバルトめっき皮膜を０．０５μｍ
施したのち、内部リード部にのみ（他の部分はマスキン
グ）アルミニューム蒸着皮膜を施したリードフレーム。Example 3 Using the same plating bath as in Example 2, a cobalt plating film of 0.05 μm was applied to the entire lead frame made of 5US304 material.
A lead frame with an aluminum evaporation film applied only to the internal leads (other parts are masked).
実施例４
実施例２と同一の操作において５ＩＪＳ４１０素材リ一
ドフレーム全体にコバルトめっき皮膜を０．０５μｍ施
したのち、全体に純金めっきを施したリードフレーム。Example 4 A lead frame in which a 0.05 μm cobalt plating film was applied to the entire 5IJS410 material lead frame in the same manner as in Example 2, and then pure gold plating was applied to the entire lead frame.
実施例５
塩化コバルト ３００ｇ／ Ｉ！塩化
ニッケル １２０ｇ／β塩酸
１２０ｇ／ ｉｔ浴温
５０℃上記のコバルト合金めっき
液を用い、５ｕｓ４１０素材リ一ドフレーム全体に電流
密度７ Ａ ／ ｄ ｔｒｉ（電圧６Ｖ）で３０秒間め
っきした。得られたコバルト合金めっき皮膜は０．０５
μｍであった。このものにステージ部および内部リード
部には銅ストライクめっきを部分めっきし、さらにその
上に部分銀めっきを施したリードフレーム。Example 5 Cobalt chloride 300g/I! Nickel chloride 120g/β hydrochloric acid
120g/it bath temperature
Using the above cobalt alloy plating solution at 50°C, the entire 5us410 material lead frame was plated for 30 seconds at a current density of 7 A/dtri (voltage 6V). The obtained cobalt alloy plating film was 0.05
It was μm. This is a lead frame in which the stage part and internal lead parts are partially plated with copper strike plating, and then partially plated with silver.
（発明の効果）
ＳＵＳ材リードフレームはめっき性、およびはんだ付は
性の点で鉄系材および銅系材より著しく劣っていたが、
本発明によるコバルトまたはコバルト合金めっきを施す
ことにより、めっき性は鉄−ニソケル合金材程度にまで
向上した。更に外部リード部ははんだ付は性の良い表面
処理が容易に施せるようになった。これらの結果、ＳＯ
５材リーすフレーＪ、が他の素材のリードフレームより
強度およびコストの点で優れたものとなった。(Effects of the invention) SUS lead frames were significantly inferior to iron-based and copper-based materials in terms of plating and soldering properties;
By applying cobalt or cobalt alloy plating according to the present invention, the plating properties were improved to the same level as iron-nisokel alloy materials. Furthermore, the external lead part can now be easily surface-treated to improve soldering properties. As a result of these, S.O.
The 5-material lead frame J is superior to lead frames made of other materials in terms of strength and cost.
以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多くの改変を施し得るのは
もちろんのことである。Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. It is.
第１図はリードフレームの説明図、第２図乃至第５図は
めっき種類およびその被着範囲を示す種々の実施例を示
す断面説明図である。
１・・・リードフレーム、 ２・・・ステージ部、
３・・・内部リード部、 ４・・・外部リード部、 ５
・・・ダムバー、 ６・・・外枠、７・・・コバルトめ
っき皮膜、
８・・・銀（又は金）めっき皮膜、
９・・・錫−鉛合金めっき皮膜、
ｌＯ・・・アルミニューム蒸着皮膜。FIG. 1 is an explanatory diagram of a lead frame, and FIGS. 2 to 5 are cross-sectional explanatory diagrams showing various embodiments showing the types of plating and the coating range thereof. 1... Lead frame, 2... Stage section,
3... Internal lead part, 4... External lead part, 5
... Dam bar, 6 ... Outer frame, 7 ... Cobalt plating film, 8 ... Silver (or gold) plating film, 9 ... Tin-lead alloy plating film, lO ... Aluminum vapor deposition membrane.
Claims (1)
なくともコバルトまたはコバルト合金めっきを施したこ
とを特徴とするリードフレーム。 ２、特許請求の範囲第１項記載のリードフレームの少な
くとも内部リード部に金めっき、銀めっき、又はアルミ
ニューム蒸着を施したリードフレーム。 ３、特許請求の範囲第１項記載のリードフレームの外部
リード部に、錫、錫−鉛合金、錫−ニッケル合金などの
はんだ付けが容易な金属めっきを施したリードフレーム
。[Claims] 1. A lead frame made of a stainless steel material, the surface of which is coated with at least cobalt or cobalt alloy plating. 2. A lead frame in which at least the internal lead portion of the lead frame according to claim 1 is plated with gold, silver, or vapor-deposited with aluminum. 3. A lead frame in which the external lead portion of the lead frame according to claim 1 is plated with a metal that is easy to solder, such as tin, tin-lead alloy, tin-nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4779486A JPS62204557A (en) | 1986-03-05 | 1986-03-05 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4779486A JPS62204557A (en) | 1986-03-05 | 1986-03-05 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204557A true JPS62204557A (en) | 1987-09-09 |
Family
ID=12785276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4779486A Pending JPS62204557A (en) | 1986-03-05 | 1986-03-05 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204557A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006131977A (en) * | 2004-11-09 | 2006-05-25 | Jst Mfg Co Ltd | Plated contact and plating method for contact |
| WO2009090849A1 (en) * | 2008-01-17 | 2009-07-23 | Applied Nanoparticle Laboratory Corporation | Method of wire bonding and structure including mounted electronic part |
| JP2011127225A (en) * | 2011-01-31 | 2011-06-30 | Furukawa Electric Co Ltd:The | Silver-coated stainless wire for movable contact and switch using the same |
| JP5416136B2 (en) * | 2008-12-26 | 2014-02-12 | 株式会社応用ナノ粒子研究所 | Wire bonding method, electronic component, light emitting electronic component, composite light emitting electronic component, and light emitting device |
| JP2014051685A (en) * | 2012-09-04 | 2014-03-20 | Nistec:Kk | Metal component |
| JP2015004114A (en) * | 2013-06-24 | 2015-01-08 | オリエンタル鍍金株式会社 | Production method of plating material and plating material |
-
1986
- 1986-03-05 JP JP4779486A patent/JPS62204557A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006131977A (en) * | 2004-11-09 | 2006-05-25 | Jst Mfg Co Ltd | Plated contact and plating method for contact |
| WO2009090849A1 (en) * | 2008-01-17 | 2009-07-23 | Applied Nanoparticle Laboratory Corporation | Method of wire bonding and structure including mounted electronic part |
| JP5416136B2 (en) * | 2008-12-26 | 2014-02-12 | 株式会社応用ナノ粒子研究所 | Wire bonding method, electronic component, light emitting electronic component, composite light emitting electronic component, and light emitting device |
| JP2011127225A (en) * | 2011-01-31 | 2011-06-30 | Furukawa Electric Co Ltd:The | Silver-coated stainless wire for movable contact and switch using the same |
| JP2014051685A (en) * | 2012-09-04 | 2014-03-20 | Nistec:Kk | Metal component |
| JP2015004114A (en) * | 2013-06-24 | 2015-01-08 | オリエンタル鍍金株式会社 | Production method of plating material and plating material |
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