GB1244759A - Improvements in and relating to methods of manufacturing semiconductor devices - Google Patents

Improvements in and relating to methods of manufacturing semiconductor devices

Info

Publication number
GB1244759A
GB1244759A GB58828/68A GB5882868A GB1244759A GB 1244759 A GB1244759 A GB 1244759A GB 58828/68 A GB58828/68 A GB 58828/68A GB 5882868 A GB5882868 A GB 5882868A GB 1244759 A GB1244759 A GB 1244759A
Authority
GB
United Kingdom
Prior art keywords
semi
groove
etching
plug
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB58828/68A
Other languages
English (en)
Inventor
Maurice Greenlick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASSOCIATED SEMICONDUCTOR MFT
Original Assignee
ASSOCIATED SEMICONDUCTOR MFT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASSOCIATED SEMICONDUCTOR MFT filed Critical ASSOCIATED SEMICONDUCTOR MFT
Priority to GB58828/68A priority Critical patent/GB1244759A/en
Priority to NL6918363A priority patent/NL6918363A/xx
Priority to BE742883D priority patent/BE742883A/xx
Priority to FR6942894A priority patent/FR2025892A1/fr
Publication of GB1244759A publication Critical patent/GB1244759A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5221Crossover interconnections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/764Air gaps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB58828/68A 1968-12-11 1968-12-11 Improvements in and relating to methods of manufacturing semiconductor devices Expired GB1244759A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB58828/68A GB1244759A (en) 1968-12-11 1968-12-11 Improvements in and relating to methods of manufacturing semiconductor devices
NL6918363A NL6918363A (enExample) 1968-12-11 1969-12-06
BE742883D BE742883A (enExample) 1968-12-11 1969-12-09
FR6942894A FR2025892A1 (enExample) 1968-12-11 1969-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB58828/68A GB1244759A (en) 1968-12-11 1968-12-11 Improvements in and relating to methods of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
GB1244759A true GB1244759A (en) 1971-09-02

Family

ID=10482499

Family Applications (1)

Application Number Title Priority Date Filing Date
GB58828/68A Expired GB1244759A (en) 1968-12-11 1968-12-11 Improvements in and relating to methods of manufacturing semiconductor devices

Country Status (4)

Country Link
BE (1) BE742883A (enExample)
FR (1) FR2025892A1 (enExample)
GB (1) GB1244759A (enExample)
NL (1) NL6918363A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455448A (en) * 1992-09-03 1995-10-03 Sgs-Thomson Microelectronics, Inc. Bipolar, monolithic, high-power RF transistor with isolated top collector

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2106540A1 (de) * 1970-02-13 1971-08-19 Texas Instruments Inc Halbleiterschaltung und Verfahren zu ihrer Herstellung
FR2469804A1 (fr) * 1979-11-07 1981-05-22 Labo Electronique Physique Procede de realisation d'un dispositif semi-conducteur comprenant un assemblage de diodes en serie et dispositif en resultant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455448A (en) * 1992-09-03 1995-10-03 Sgs-Thomson Microelectronics, Inc. Bipolar, monolithic, high-power RF transistor with isolated top collector

Also Published As

Publication number Publication date
BE742883A (enExample) 1970-06-09
NL6918363A (enExample) 1970-06-15
FR2025892A1 (enExample) 1970-09-11

Similar Documents

Publication Publication Date Title
US3837907A (en) Multiple-level metallization for integrated circuits
US3740835A (en) Method of forming semiconductor device contacts
FR2097133A1 (enExample)
US3993515A (en) Method of forming raised electrical contacts on a semiconductor device
US3632436A (en) Contact system for semiconductor devices
GB1143148A (en) Air gap isolated semiconductor device
GB1206308A (en) Method of making semiconductor wafer
KR970000650B1 (ko) 멀티레벨 상호 접속라인처리 및 전이 방법
US3586922A (en) Multiple-layer metal structure and processing
GB878544A (en) Improvements in or relating to processes of manufacturing semi-conductor devices
GB1244759A (en) Improvements in and relating to methods of manufacturing semiconductor devices
GB1318770A (en) Methods of etching semiconductor bodies
GB1223704A (en) Semiconductor device
GB1179983A (en) Method of Fabricating Semiconductor Devices.
US3699010A (en) Beam lead plating process
US3615874A (en) Method for producing passivated pn junctions by ion beam implantation
GB1232126A (enExample)
US3364399A (en) Array of transistors having a layer of soft metal film for dividing
US3492546A (en) Contact for semiconductor device
JPS5445570A (en) Manufacture for semiconductor element
US3607148A (en) Solder preforms on a semiconductor wafer
US3505132A (en) Method of etching semiconductive devices having lead-containing elements
JPS5339873A (en) Etching method of silicon semiconductor substrate containing gold
US3716428A (en) Method of etching a metal which can be passivated
JPS54107273A (en) Production of field effect transistor