GB1227519A - - Google Patents

Info

Publication number
GB1227519A
GB1227519A GB1227519DA GB1227519A GB 1227519 A GB1227519 A GB 1227519A GB 1227519D A GB1227519D A GB 1227519DA GB 1227519 A GB1227519 A GB 1227519A
Authority
GB
United Kingdom
Prior art keywords
nickel
contacts
layers
sintering
aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1227519A publication Critical patent/GB1227519A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Chemically Coating (AREA)
GB1227519D 1968-10-18 1969-10-10 Expired GB1227519A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76871968A 1968-10-18 1968-10-18

Publications (1)

Publication Number Publication Date
GB1227519A true GB1227519A (https=) 1971-04-07

Family

ID=25083306

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1227519D Expired GB1227519A (https=) 1968-10-18 1969-10-10

Country Status (5)

Country Link
US (1) US3579375A (https=)
JP (1) JPS493025B1 (https=)
DE (1) DE1952499A1 (https=)
FR (1) FR2021025A1 (https=)
GB (1) GB1227519A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772077A (en) * 1971-04-06 1973-11-13 Ferranti Ltd Semiconductor devices
US3922385A (en) * 1973-07-02 1975-11-25 Gen Motors Corp Solderable multilayer contact for silicon semiconductor
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
DE2550512A1 (de) * 1975-11-11 1977-05-12 Bosch Gmbh Robert Verfahren zur herstellung einer metallisierung auf einem substrat
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4182781A (en) * 1977-09-21 1980-01-08 Texas Instruments Incorporated Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating
US4235648A (en) * 1979-04-05 1980-11-25 Motorola, Inc. Method for immersion plating very thin films of aluminum
US4407860A (en) * 1981-06-30 1983-10-04 International Business Machines Corporation Process for producing an improved quality electrolessly deposited nickel layer

Also Published As

Publication number Publication date
DE1952499A1 (de) 1970-10-15
US3579375A (en) 1971-05-18
FR2021025A1 (https=) 1970-07-17
JPS493025B1 (https=) 1974-01-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees