FR2021025A1 - - Google Patents
Info
- Publication number
- FR2021025A1 FR2021025A1 FR6935707A FR6935707A FR2021025A1 FR 2021025 A1 FR2021025 A1 FR 2021025A1 FR 6935707 A FR6935707 A FR 6935707A FR 6935707 A FR6935707 A FR 6935707A FR 2021025 A1 FR2021025 A1 FR 2021025A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US76871968A | 1968-10-18 | 1968-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2021025A1 true FR2021025A1 (https=) | 1970-07-17 |
Family
ID=25083306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR6935707A Withdrawn FR2021025A1 (https=) | 1968-10-18 | 1969-10-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3579375A (https=) |
| JP (1) | JPS493025B1 (https=) |
| DE (1) | DE1952499A1 (https=) |
| FR (1) | FR2021025A1 (https=) |
| GB (1) | GB1227519A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2331885A1 (fr) * | 1975-11-11 | 1977-06-10 | Bosch Gmbh Robert | Procede pour la realisation sur un substrat d'une metallisation |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3772077A (en) * | 1971-04-06 | 1973-11-13 | Ferranti Ltd | Semiconductor devices |
| US3922385A (en) * | 1973-07-02 | 1975-11-25 | Gen Motors Corp | Solderable multilayer contact for silicon semiconductor |
| US4022930A (en) * | 1975-05-30 | 1977-05-10 | Bell Telephone Laboratories, Incorporated | Multilevel metallization for integrated circuits |
| US4122215A (en) * | 1976-12-27 | 1978-10-24 | Bell Telephone Laboratories, Incorporated | Electroless deposition of nickel on a masked aluminum surface |
| US4182781A (en) * | 1977-09-21 | 1980-01-08 | Texas Instruments Incorporated | Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating |
| US4235648A (en) * | 1979-04-05 | 1980-11-25 | Motorola, Inc. | Method for immersion plating very thin films of aluminum |
| US4407860A (en) * | 1981-06-30 | 1983-10-04 | International Business Machines Corporation | Process for producing an improved quality electrolessly deposited nickel layer |
-
1968
- 1968-10-18 US US768719A patent/US3579375A/en not_active Expired - Lifetime
-
1969
- 1969-10-10 GB GB1227519D patent/GB1227519A/en not_active Expired
- 1969-10-15 JP JP44082500A patent/JPS493025B1/ja active Pending
- 1969-10-17 FR FR6935707A patent/FR2021025A1/fr not_active Withdrawn
- 1969-10-17 DE DE19691952499 patent/DE1952499A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2331885A1 (fr) * | 1975-11-11 | 1977-06-10 | Bosch Gmbh Robert | Procede pour la realisation sur un substrat d'une metallisation |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1952499A1 (de) | 1970-10-15 |
| GB1227519A (https=) | 1971-04-07 |
| US3579375A (en) | 1971-05-18 |
| JPS493025B1 (https=) | 1974-01-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |