FR2021025A1 - - Google Patents

Info

Publication number
FR2021025A1
FR2021025A1 FR6935707A FR6935707A FR2021025A1 FR 2021025 A1 FR2021025 A1 FR 2021025A1 FR 6935707 A FR6935707 A FR 6935707A FR 6935707 A FR6935707 A FR 6935707A FR 2021025 A1 FR2021025 A1 FR 2021025A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6935707A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2021025A1 publication Critical patent/FR2021025A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
FR6935707A 1968-10-18 1969-10-17 Withdrawn FR2021025A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76871968A 1968-10-18 1968-10-18

Publications (1)

Publication Number Publication Date
FR2021025A1 true FR2021025A1 (https=) 1970-07-17

Family

ID=25083306

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6935707A Withdrawn FR2021025A1 (https=) 1968-10-18 1969-10-17

Country Status (5)

Country Link
US (1) US3579375A (https=)
JP (1) JPS493025B1 (https=)
DE (1) DE1952499A1 (https=)
FR (1) FR2021025A1 (https=)
GB (1) GB1227519A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2331885A1 (fr) * 1975-11-11 1977-06-10 Bosch Gmbh Robert Procede pour la realisation sur un substrat d'une metallisation

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772077A (en) * 1971-04-06 1973-11-13 Ferranti Ltd Semiconductor devices
US3922385A (en) * 1973-07-02 1975-11-25 Gen Motors Corp Solderable multilayer contact for silicon semiconductor
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4182781A (en) * 1977-09-21 1980-01-08 Texas Instruments Incorporated Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating
US4235648A (en) * 1979-04-05 1980-11-25 Motorola, Inc. Method for immersion plating very thin films of aluminum
US4407860A (en) * 1981-06-30 1983-10-04 International Business Machines Corporation Process for producing an improved quality electrolessly deposited nickel layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2331885A1 (fr) * 1975-11-11 1977-06-10 Bosch Gmbh Robert Procede pour la realisation sur un substrat d'une metallisation

Also Published As

Publication number Publication date
DE1952499A1 (de) 1970-10-15
GB1227519A (https=) 1971-04-07
US3579375A (en) 1971-05-18
JPS493025B1 (https=) 1974-01-24

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Legal Events

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