JPS493025B1 - - Google Patents

Info

Publication number
JPS493025B1
JPS493025B1 JP44082500A JP8250069A JPS493025B1 JP S493025 B1 JPS493025 B1 JP S493025B1 JP 44082500 A JP44082500 A JP 44082500A JP 8250069 A JP8250069 A JP 8250069A JP S493025 B1 JPS493025 B1 JP S493025B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44082500A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS493025B1 publication Critical patent/JPS493025B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Chemically Coating (AREA)
JP44082500A 1968-10-18 1969-10-15 Pending JPS493025B1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76871968A 1968-10-18 1968-10-18

Publications (1)

Publication Number Publication Date
JPS493025B1 true JPS493025B1 (https=) 1974-01-24

Family

ID=25083306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44082500A Pending JPS493025B1 (https=) 1968-10-18 1969-10-15

Country Status (5)

Country Link
US (1) US3579375A (https=)
JP (1) JPS493025B1 (https=)
DE (1) DE1952499A1 (https=)
FR (1) FR2021025A1 (https=)
GB (1) GB1227519A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772077A (en) * 1971-04-06 1973-11-13 Ferranti Ltd Semiconductor devices
US3922385A (en) * 1973-07-02 1975-11-25 Gen Motors Corp Solderable multilayer contact for silicon semiconductor
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
DE2550512A1 (de) * 1975-11-11 1977-05-12 Bosch Gmbh Robert Verfahren zur herstellung einer metallisierung auf einem substrat
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4182781A (en) * 1977-09-21 1980-01-08 Texas Instruments Incorporated Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating
US4235648A (en) * 1979-04-05 1980-11-25 Motorola, Inc. Method for immersion plating very thin films of aluminum
US4407860A (en) * 1981-06-30 1983-10-04 International Business Machines Corporation Process for producing an improved quality electrolessly deposited nickel layer

Also Published As

Publication number Publication date
DE1952499A1 (de) 1970-10-15
GB1227519A (https=) 1971-04-07
US3579375A (en) 1971-05-18
FR2021025A1 (https=) 1970-07-17

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