GB1226864A - - Google Patents
Info
- Publication number
- GB1226864A GB1226864A GB1226864DA GB1226864A GB 1226864 A GB1226864 A GB 1226864A GB 1226864D A GB1226864D A GB 1226864DA GB 1226864 A GB1226864 A GB 1226864A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bars
- bus
- rectifiers
- rectifier
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Rectifiers (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
1,226,864. Semi-conductor devices. SIEMENS A.G. 2 April, 1968 [3 April, 1967], No. 15835/68. Heading H1K. Two semi-conductor rectifiers are located in seats 11, 21 on respective first and second busbars 1, 2 while the free electrodes of each rectifier are connected by conductors 31 to a common terminal 52 supported by electrically insulating spacers 41, 42 between the bus-bars. Each rectifier may be individually housed as shown, and pressed into an aperture in the corresponding bus-bar, surrounded by the locating walls 11, 21 respectively. Soldering may also be used to attach the rectifiers to the bus-bars. In the embodiment shown three pairs of diode rectifiers are situated between a single pair of bus-bars 1, 2, but each pair of bus-bars may be associated with a single pair of devices, the bars being shaped so as to facilitate assembly of several such pairs of bars together.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0109156 | 1967-04-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1226864A true GB1226864A (en) | 1971-03-31 |
Family
ID=7529322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1226864D Expired GB1226864A (en) | 1967-04-03 | 1968-04-02 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1614478A1 (en) |
FR (1) | FR1588451A (en) |
GB (1) | GB1226864A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113711704A (en) * | 2019-03-13 | 2021-11-26 | 法雷奥电机设备公司 | Electronic system and electrical assembly |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2446541A1 (en) * | 1979-01-12 | 1980-08-08 | Sev Alternateurs | Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin |
FR2453500A1 (en) * | 1979-04-04 | 1980-10-31 | Sev Alternateurs | Semiconductor rectifier for motor vehicle alternator - has diodes soldered to sockets on support plate, with extended contact cross=section |
US4546409A (en) * | 1982-04-02 | 1985-10-08 | Mitsubishi Denki Kabushiki Kaisha | Device for cooling semiconductor elements |
-
1967
- 1967-04-03 DE DE19671614478 patent/DE1614478A1/en active Pending
-
1968
- 1968-04-02 FR FR1588451D patent/FR1588451A/fr not_active Expired
- 1968-04-02 GB GB1226864D patent/GB1226864A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113711704A (en) * | 2019-03-13 | 2021-11-26 | 法雷奥电机设备公司 | Electronic system and electrical assembly |
CN113711704B (en) * | 2019-03-13 | 2023-06-23 | 法雷奥电机设备公司 | Electronic system and electrical assembly |
US11955870B2 (en) | 2019-03-13 | 2024-04-09 | Valeo Equipements Electriques Moteur | Electronic system and electrical assembly |
Also Published As
Publication number | Publication date |
---|---|
FR1588451A (en) | 1970-04-17 |
DE1614478A1 (en) | 1970-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |