GB1192169A - Semiconductor Device - Google Patents

Semiconductor Device

Info

Publication number
GB1192169A
GB1192169A GB1502869A GB1502869A GB1192169A GB 1192169 A GB1192169 A GB 1192169A GB 1502869 A GB1502869 A GB 1502869A GB 1502869 A GB1502869 A GB 1502869A GB 1192169 A GB1192169 A GB 1192169A
Authority
GB
United Kingdom
Prior art keywords
pressure
devices
plates
march
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1502869A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB1192169A publication Critical patent/GB1192169A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,192,169. Semi-conductor devices. MITSUBISHI DENKI K.K. 21 March, 1969 [22 March, 1968], No. 15028/69. Heading H1K. At least one of a pair of pressure plates 26, 28 between which one or more semi-conductor devices 10, 12 are supported under pressure comprises, in its unloaded state, Fig. 3, a segment of a sphere of a resilient material, e.g. spring steel. Pressure is applied between the plates 26, 28 at a number of peripheral points so as to increase the radius of curvature of the or each resilient plate 26, 28, preferably to infinity as shown in Fig. 1, thereby to exert pressure on the devices 10, 12. In the form shown the pressure is transmitted to the devices 10, 12 by heat sinks 14, 16, 18 which may be internally cooled by liquid or may carry cooling fins. The devices 10, 12 may be diodes, transistors or thyristors. Preferably both pressure plates 26, 28 are of the type shown in Fig. 3, but one may alternatively be rigid and flat.
GB1502869A 1968-03-22 1969-03-21 Semiconductor Device Expired GB1192169A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1871168 1968-03-22

Publications (1)

Publication Number Publication Date
GB1192169A true GB1192169A (en) 1970-05-20

Family

ID=11979221

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1502869A Expired GB1192169A (en) 1968-03-22 1969-03-21 Semiconductor Device

Country Status (3)

Country Link
DE (1) DE1914398A1 (en)
FR (1) FR2004508A1 (en)
GB (1) GB1192169A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
US4611869A (en) * 1980-12-05 1986-09-16 Compagnie Internationale Pour L'informatique Cii Honeywell Bull (Societe Anonyme) Clamping device
US4642671A (en) * 1982-07-29 1987-02-10 Lucas Industries Public Limited Company Semi-conductor assembly
GB2402555A (en) * 2003-06-06 2004-12-08 Hewlett Packard Development Co Load plate for an electronic circuit assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686541A (en) * 1971-07-19 1972-08-22 Gen Electric A flexible resilient member for applying a clamping force to thyristor units
US4628219A (en) * 1985-09-13 1986-12-09 Sundstrand Corporation Rectifier assembly for mounting in a rotor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4611869A (en) * 1980-12-05 1986-09-16 Compagnie Internationale Pour L'informatique Cii Honeywell Bull (Societe Anonyme) Clamping device
US4642671A (en) * 1982-07-29 1987-02-10 Lucas Industries Public Limited Company Semi-conductor assembly
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
GB2402555A (en) * 2003-06-06 2004-12-08 Hewlett Packard Development Co Load plate for an electronic circuit assembly
GB2402555B (en) * 2003-06-06 2006-12-13 Hewlett Packard Development Co A method and system for adjusting a curvature of a load plate based on a target load

Also Published As

Publication number Publication date
DE1914398A1 (en) 1969-10-02
FR2004508A1 (en) 1969-11-28

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years