GB2402555B - A method and system for adjusting a curvature of a load plate based on a target load - Google Patents

A method and system for adjusting a curvature of a load plate based on a target load

Info

Publication number
GB2402555B
GB2402555B GB0411673A GB0411673A GB2402555B GB 2402555 B GB2402555 B GB 2402555B GB 0411673 A GB0411673 A GB 0411673A GB 0411673 A GB0411673 A GB 0411673A GB 2402555 B GB2402555 B GB 2402555B
Authority
GB
United Kingdom
Prior art keywords
load
curvature
adjusting
plate based
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0411673A
Other versions
GB0411673D0 (en
GB2402555A (en
Inventor
Stephen Daniel Cromwell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of GB0411673D0 publication Critical patent/GB0411673D0/en
Publication of GB2402555A publication Critical patent/GB2402555A/en
Application granted granted Critical
Publication of GB2402555B publication Critical patent/GB2402555B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
GB0411673A 2003-06-06 2004-05-25 A method and system for adjusting a curvature of a load plate based on a target load Expired - Fee Related GB2402555B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/455,863 US20040247925A1 (en) 2003-06-06 2003-06-06 Method and system for adjusting a curvature of a load plate based on a target load

Publications (3)

Publication Number Publication Date
GB0411673D0 GB0411673D0 (en) 2004-06-30
GB2402555A GB2402555A (en) 2004-12-08
GB2402555B true GB2402555B (en) 2006-12-13

Family

ID=32682523

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0411673A Expired - Fee Related GB2402555B (en) 2003-06-06 2004-05-25 A method and system for adjusting a curvature of a load plate based on a target load

Country Status (3)

Country Link
US (1) US20040247925A1 (en)
JP (1) JP2004363609A (en)
GB (1) GB2402555B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7323358B1 (en) * 2003-08-13 2008-01-29 Hewlett-Packard Development Company, L.P. Method and system for sizing a load plate
DE102005033249B3 (en) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs
US7486516B2 (en) * 2005-08-11 2009-02-03 International Business Machines Corporation Mounting a heat sink in thermal contact with an electronic component
CN1941519B (en) * 2005-09-28 2010-06-02 富士康(昆山)电脑接插件有限公司 Electric connector assembly
US20070097648A1 (en) * 2005-11-01 2007-05-03 Kevin Xu Method and apparatus for establishing optimal thermal contact between opposing surfaces
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7777329B2 (en) * 2006-07-27 2010-08-17 International Business Machines Corporation Heatsink apparatus for applying a specified compressive force to an integrated circuit device
US7826229B2 (en) * 2006-10-27 2010-11-02 Hewlett-Packard Development Company, L.P. Component retention with distributed compression
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
CN102413663B (en) * 2011-07-26 2015-06-17 惠州市讯和数码科技有限公司 Manufacturing method of heat radiation device
US9818670B2 (en) * 2011-07-29 2017-11-14 Infinera Corporation Cooling device installation using a retainer assembly
US8693200B2 (en) * 2012-02-07 2014-04-08 International Business Machines Corporation Semiconductor device cooling module
US9831151B1 (en) 2016-08-03 2017-11-28 International Business Machines Corporation Heat sink for semiconductor modules
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
CN112004372B (en) * 2019-05-27 2023-03-17 酷码科技股份有限公司 Heat sink device
KR102651418B1 (en) * 2019-07-25 2024-03-27 삼성전자 주식회사 Electronic device including a shielding sheet and a heat radiation member
CN113135221B (en) * 2020-01-17 2022-12-06 上海海拉电子有限公司 Electronic power-assisted steering controller

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1192169A (en) * 1968-03-22 1970-05-20 Mitsubishi Electric Corp Semiconductor Device
SU991534A1 (en) * 1981-04-23 1983-01-23 Саранский Ордена Трудового Красного Знамени Завод "Электровыпрямитель" Securing device
JPH02214643A (en) * 1989-02-15 1990-08-27 Matsushita Electric Works Ltd Warping correction device for sheet-shaped material
US6654250B1 (en) * 2002-09-25 2003-11-25 International Business Machines Corporation Low-stress compressive heatsink structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT374706B (en) * 1982-06-07 1984-05-25 Haemmerle Ag METAL BENDING METHOD AND BENDING DEVICE FOR EXERCISING THE METHOD
US6378199B1 (en) * 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
JPH10294423A (en) * 1997-04-17 1998-11-04 Nec Corp Semiconductor device
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6477058B1 (en) * 2001-06-28 2002-11-05 Hewlett-Packard Company Integrated circuit device package including multiple stacked components
US6549418B1 (en) * 2001-09-26 2003-04-15 Hewlett Packard Development Company, L.P. Land grid array integrated circuit device module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1192169A (en) * 1968-03-22 1970-05-20 Mitsubishi Electric Corp Semiconductor Device
SU991534A1 (en) * 1981-04-23 1983-01-23 Саранский Ордена Трудового Красного Знамени Завод "Электровыпрямитель" Securing device
JPH02214643A (en) * 1989-02-15 1990-08-27 Matsushita Electric Works Ltd Warping correction device for sheet-shaped material
US6654250B1 (en) * 2002-09-25 2003-11-25 International Business Machines Corporation Low-stress compressive heatsink structure

Also Published As

Publication number Publication date
US20040247925A1 (en) 2004-12-09
GB0411673D0 (en) 2004-06-30
JP2004363609A (en) 2004-12-24
GB2402555A (en) 2004-12-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080525