GB2402555A - Load plate for an electronic circuit assembly - Google Patents

Load plate for an electronic circuit assembly Download PDF

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Publication number
GB2402555A
GB2402555A GB0411673A GB0411673A GB2402555A GB 2402555 A GB2402555 A GB 2402555A GB 0411673 A GB0411673 A GB 0411673A GB 0411673 A GB0411673 A GB 0411673A GB 2402555 A GB2402555 A GB 2402555A
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United Kingdom
Prior art keywords
load
plate
load plate
assembly
curvature
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Granted
Application number
GB0411673A
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GB0411673D0 (en
GB2402555B (en
Inventor
Stephen Daniel Cromwell
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Publication of GB0411673D0 publication Critical patent/GB0411673D0/en
Publication of GB2402555A publication Critical patent/GB2402555A/en
Application granted granted Critical
Publication of GB2402555B publication Critical patent/GB2402555B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A method of making a load plate (101) for an attach hardware assembly of a circuit assembly includes adjusting a curvature of the load plate (101) based on a target load to be applied by the attach hardware. The method may use a sample run before the full production run. Adjustable tooling may be used for shaping the curvature. A heat treatment step may be applied. The plate may be used to load an assembly comprising an application-specific integrated circuit 106, heat sink 104, EMI gasket and frame 111,112 on a circuit board 107.

Description

TITLE
A Method and System for Adjusting a Curvature of a Load Plate Based on a Target Load
BACKGROUND
10001] An Application-Specific Integrated Circuit (ASIC) is a microchip designed for a special application. The ASIC is designed to process information or complete tasks in a manner specific to the intended application. For example, ASICs are used in such diverse applications as auto emission control, environmental monitoring, and personal digital assistants (PDAs). ASICs are contrasted with general integrated circuits that can be used to perform different tasks for different applications. Examples of general integrated circuits include the microprocessor and the random access memory chips in a typical personal computer.
100021 An ASIC can be mass-produced for a special application or can be custom manufactured for a particular customer application. Custom production is typically performed using components from a "building block" library of ASIC components. Each ASIC includes a number of input/output (DO) leads that allow the ASIC to be connected to a larger circuit and receive the signals and data with which the ASIC works. These I/O leads are typically arranged in an array known as a Land Grid Array (LGA). The ASIC is usually attached to a circuit board, such as a printed circuit board (PCB). Leads or a socket on the circuit board make contact with the I/0 leads of the LGA and connect the ASIC to the larger circuit of which it is a part.
3] The ever growing I/O count in today's large ASICs requires a very high clamping load to secure the ASIC to the circuit board and ensure continuous electrical contact between the ASIC and the circuit on the PCB. Clamping loads in the range of 400 to 700 pounds are becoming common. As noted, a socket may be provided on the PCB into which the ASIC is clamped.
[00041 The load necessary to secure the ASIC to the PCB is produced by the hardware used to attach the ASIC to the circuit board. This hardware is frequently referred to as the "attach hardware." The attach hardware includes a bolster plate and a load plate. The load plate is a rigid plate that is typically made of steel and is sometimes referred to as a spring plate. The bolster plate is similar.
100051 The ASIC assembly is sandwiched between the load plate and the bolster plate. Load studs connect the load plate and bolster plate, and a load screw is tightened to push the load plate and bolster plate apart causing the load plate to flex and generate the desired clamping force to the ASIC and circuit board.
[0006J Because the clamping load required is so high, the force can cause the PCB and/or the bolster plate to bow or deflect. This will impede the operation and performance of the socket or other connection between the ASIC and the PCB. Consequently, the bow of the bolster plate must be minimized. In some applications, this requires minimizing the load applied. On the other hand, the socket or connection between the ASIC and PCB requires a certain minimum load to be reliable. The result is that the load is constrained from above and below. The load must be sufficient to provide a reliable connection in the socket or between the ASIC and PCB, but must not be strong enough to cause a significant bow in the bolster plate or circuit board.
SUMMARY
[00071 A method of making a load plate for an attach hardware assembly of a circuit assembly includes adjusting a curvature of the load plate based on a target load to be applied by the attach hardware.
BRIEF DESCRIPTION OF THE DRAWINGS
8] The accompanying drawings illustrate various embodiments of the present invention and are a part of the specification. The illustrated embodiments are merely examples of the present invention and do not limit the scope of the invention.
[00091 Fig. I is an exploded view of an ASIC assembly including an attach hardware assembly designed to provide a desired load according to an embodiment of the present invention.
l0010l Fig. 2 is an illustration of the ASIC assembly of Fig. 1 when assembled.
1] Fig. 3a illustrates a load plate at a starting, uncompressed shape.
[00121 Fig. 3b illustrates a load plate at a deflected, working shape.
3] Fig. 4 is a flowchart illustrating a method of controlling the load applied by an attach hardware assembly according to another embodiment of the present invention.
4] Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements.
DETAILED DESCRIPTION
5] The present specification describes a method and system for controlling the curvature of the load plate in the attach hardware of an ASIC assembly so as to produce the desired target load at the target deflection when the attach hardware is in place. The curvature and, consequently, the spring rate of the load plate are chosen so that the deflection of the load plate when put in service produces the target load.
l0016l Fig. 1 illustrates an ASIC assembly (100) including an attach hardware assembly. As shown in Fig. 1, a typical ASIC assembly includes an ASIC (106) that is electrically connected to a circuit board (107), for example a printed circuit board. Typically, the ASIC (106) is connected to the circuit board (107) using a socket (105). An insulator (108) is disposed below the circuit board (107) to insulate the circuit board (107) from the attach hardware assembly which will be described below.
10017] A heat sink (104) is typically included in the assembly to dissipate heat generated by the ASIC (106). An ASIC (106) will generate heat as it operates and, if this heat is not dissipated, can cause damage to the ASIC (106) or other components of the assembly (100). An Electro Magnetic Interference (EMI) gasket (111) and EMI frame (112) are also positioned between the heat sink (104) and the circuit board (107). A thermstrate (113) is positioned between the heat sink (104) and the ASIC (106) to enhance the thermal interface and improve thermal conduction from the ASIC (106) to the heat sing (104).
[00181 As described above, the ASIC (106) and circuit board (107) are held together with an assembly of attach hardware. Among other things, the attach hardware includes a load plate (101) and a bolster plate (109). Load studs (103) are also part of the attach hardware and run between the load plate (101) and the bolster plate (109).
9] As shown in Fig. 1, the load plate (101) has a curvature, for example, the load plate ( 101) has a cylindrical curvature. This curvature of the load plate (101) allows the load plate (101) to act as a spring, with a resulting spring rate, to apply a load to the ASIC assembly (100).
100201 Another component of the attach hardware is the load screw (102). The load screw (102) is designed to cause a deflection of the load plate (101) that decreases the curvature of the load plate (101) and causes the load plate (101) to apply the target load to the assembly (100). The load screw (102) is screwed through a threaded hole in the load plate (101). The load screw (102) is driven through the load plate (101) until the end of the load screw (102) contacts the heat sink (104). Continuing the drive the load screw (102) against the heat sink (104) will cause the load screw (102) to applying an upward force on the load plate (101) that deflects the load plate (101) reducing the curvature of the load plate (101).
The comers of the load plate (101) are held in place relative to the assembly (100) by the load studs (103). Thus, the center of the load plate (101) is deflected upward against the curvature of the load plate (101). Consequently, the load plate (101) applies a load to the assembly (100) that is determined by the spring rate and deflection of the load plate (101).
1] The circuit board (107), the socket (105), the ASIC (106) and the thermal interface material (113) are sandwiched between the bolster plate (109) and the heat sink ( 104) under the load created by deflection of the load plate (101). As shown in Fig. 1, the heat sinlc (104), ASIC (106), socket (105), circuit board (107) and insulator (108) are all sandwiched between the load plate (101) and the bolster plate (109) to complete the ASIC assembly (100).
2] Assembly of the ASIC assembly (100) is performed as follows. The bolster plate (109) and EMI Frame (112) are attached to the circuit board (107) via the load studs (103). The socket (105) and ASIC (106) are placed onto the circuit board (107). Then, the heat sink (104) is lowered down onto the ASIC (106) over the load studs (103). The load plate assembly (101, 102) is shuttled onto the load studs (103) and the load screw (102) is driven through the load plate (101) to contact the heat sink (104). The assembled unit is illustrated in Fig. 2. However, in Fig. 2, the load screw (102) is not fully inserted. The load screw (102) is tightened until the head ofthe load screw (102) is brought into contact with the load plate (101) or a washer and applies pressure to deflect the load plate (101), which deflects the load plate to the target deflection.
[00231 This specification disclosed a process by which spring rate variation in the load plate (101) is significantly reduced by geometric compensation. As will be appreciated, if the spring rate of the load plate (101) varies during the manufacture of ASIC assemblies, the load applied in any given assembly will also vary accordingly. This may lead to inconsistent product reliability and/or failure of specific assemblies that experience a load outside the acceptable working range.
[00241 As described above, the load in the ASIC assembly comes from compressing or deflecting a cylindrically curved load plate from a starting height to a specific compressed height. Fig. 3a illustrates a load plate (101) with a starting height or curvature (S) which is the shape of the load plate (101) after production and with no force exerted on the plate (101) by a load screw. Fig. 3b illustrates a load plate (101) that is in service and deflected to a working height (D), which is less than (S). The load plate (101) will naturally resist this deflection and apply the desired load to the assembly.
[00251 To deliver the high loads required and survive the resulting stress, the load plate is often fabricated out of stainless steel and then heat-treated and tempered to achieve very high yield stresses. After forming and heat-treating, the load plate is compressed to just beyond the target deflection to eliminate first-cycle plastic yield. This results in a part that can be reused with the consistent results. This is referred to as sizing the part.
[00261 Ideally, each load plate produced through this process will follow the same force deflection curve. However, in reality, the load produced by an individual load plate in use is a function of the change in height or the deflection of the plate from a free state to an installed state multiplied by the spring rate of the plate at that working height. The spring rate is a function of the geometry of the load plate (e.g. the thickness of the plate or plates used to form the load plate) and the material from which the load plate is formed.
l0027l As noted above, it is desirable to minimize variation in the load applied by the load plates in different ASIC assemblies to promote consistency and product reliability.
Since the installed or deflected height of a load plate is constant, the variation in the resulting applied load arises from the starting height (plate curvature) and the spring rate variation. As s noted, spring rate depends on plate thickness and plate material. Thus, load variation can result from variation in the thickness or material composition of the load plate and its response to the application process (e.g., heat- treating and tempering).
10028] The load variation from both of these variables can be eliminated by appropriately adjusting the starting height or curvature of the load plate so that a target load is achieved at the installed or deflected height of the load plate. Variation in material composition, material thickness and response to the fabrication process can be introduced with each new lot of load plate material, e.g., stainless steel, that comes into the load plate manufacturing process. Typically, the variation in material composition and thickness within a single lot is negligible.
10029] Fig. 4 illustrates an exemplary method that can be use under the principles disclosed herein to eliminate these variables from the applied load of the plate when the load plate is placed in service. As shown in Fig. 4, the method includes adjusting the starting height or curvature of the load plate to produce the desired working load.
[00301 With each new lot of material (determination 130), a sample run of the load plates is made and measured (step 131). The starting height (S. Fig. 3a) or curvature of the plate and any change in height as the plate goes through the heat treating and sizing processes is tracked (step 132).
1] Then, measuring the deflection required to achieve the target load a new starting height for this lot of material can be determined (step 133). The tooling that shapes the curvature in the fabrication process is designed to be adjustable and the starting height is adjusted to match the material used and the desired working load.
2] A full production run can then be initiation (134). Consequently, the fabrication method is adjusted to minimize any variation in the working characteristics of the load plates produced from different material lots.
3] Previously, variation in the working load of load plates produced in different production runs has been significant and has decreased product consistency and reliability. The load tolerance due just to the standard thickness variation of +/- .002" is +/- 41.5 Ibs at a target load of 330 Ibs or about +/-12 % of the load. Further, the starting height of the finished plate varies by as much as. 025" as a new lot of material responds to the heat treating and sizing. At a spring rate of around 1700 Ibs/in, the resulting load variation is +/- 21 Ibs.
10034] Most of the combined +/- 62 Ibs tolerance in the final load can be eliminated by adjusting the part height to match the material properties as outlined in this disclosure. Consequently, load plates produced according to the methods described herein will promote product consistency and reliability.
[00351 The preceding description has been presented only to illustrate and describe embodiments of invention. It is not intended to be exhaustive or to limit the invention to any precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be defined by the following claims.

Claims (10)

  1. WHAT IS CLAIMED IS: I. A method of making a load plate (101) for an attach
    hardware assembly of a circuit assembly, said method comprising adjusting a curvature of said load plate (101) based on a target load to be applied by said attach hardware.
  2. 2. The method of claim 1, wherein adjusting said curvature of said load plate (101) based on said target load, further comprises adjusting said curvature based on a material thickness and material composition of a material from which said load plate ( 101) is being made.
  3. 3. The method of claim 1, further comprising, for each new material lot being used to make load plates (101), performing a test run of load plate (101) production.
  4. 4. The method of claim 3, further comprising: measuring a starting height of at least one load plate (101) of said test run as a measure of curvature; and tracking changes to said starting height through fabrication of said at least one load plate (101).
  5. 5. The method of claim 4, wherein said fabrication comprises heattreating the load plate (101).
  6. 6. The method of claim 4, further comprising adjusting an original starting height for production of load plates ( 101) based on said changes tracked in said test run and said target load.
  7. 7. The method of claim 6, further comprising initiating a full production run of load plates ( 101) to use up said material lot.
  8. 8. A method of making a circuit assembly, said method comprising: making an electrical connection between a circuit to a circuit board (107); determining a target value for a load to be applied with an attach hardware assembly to secure the connection between said circuit and circuit board (107); adjusting a curvature of a load plate (101) of said attach hardware assembly based on a target load to be applied by said attach hardware.
  9. 9. The method of claim 8, further comprising applying a load with said attach hardware assembly to secure the connection between said circuit and said circuit board (107).
  10. 10. The method of claim 8, wherein said making an electrical connection comprises connecting an Application Specific Integrated Circuit ( 106) in a socket ( 105) of a circuit board (107).
GB0411673A 2003-06-06 2004-05-25 A method and system for adjusting a curvature of a load plate based on a target load Expired - Fee Related GB2402555B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/455,863 US20040247925A1 (en) 2003-06-06 2003-06-06 Method and system for adjusting a curvature of a load plate based on a target load

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GB0411673D0 GB0411673D0 (en) 2004-06-30
GB2402555A true GB2402555A (en) 2004-12-08
GB2402555B GB2402555B (en) 2006-12-13

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JP (1) JP2004363609A (en)
GB (1) GB2402555B (en)

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DE102005033249B3 (en) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs
EP1952682A2 (en) * 2005-11-01 2008-08-06 Nanoconduction Inc. Method and apparatus for establishing optimal thermal contact between opposing surfaces
CN102413663A (en) * 2011-07-26 2012-04-11 惠州鑫长风电子有限公司 Manufacturing method of heat radiation device

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US7323358B1 (en) * 2003-08-13 2008-01-29 Hewlett-Packard Development Company, L.P. Method and system for sizing a load plate
US7486516B2 (en) * 2005-08-11 2009-02-03 International Business Machines Corporation Mounting a heat sink in thermal contact with an electronic component
CN1941519B (en) * 2005-09-28 2010-06-02 富士康(昆山)电脑接插件有限公司 Electric connector assembly
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7777329B2 (en) * 2006-07-27 2010-08-17 International Business Machines Corporation Heatsink apparatus for applying a specified compressive force to an integrated circuit device
US7826229B2 (en) * 2006-10-27 2010-11-02 Hewlett-Packard Development Company, L.P. Component retention with distributed compression
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
US9818670B2 (en) * 2011-07-29 2017-11-14 Infinera Corporation Cooling device installation using a retainer assembly
US8693200B2 (en) * 2012-02-07 2014-04-08 International Business Machines Corporation Semiconductor device cooling module
US9831151B1 (en) 2016-08-03 2017-11-28 International Business Machines Corporation Heat sink for semiconductor modules
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
CN112004372B (en) * 2019-05-27 2023-03-17 酷码科技股份有限公司 Heat sink device
KR102651418B1 (en) * 2019-07-25 2024-03-27 삼성전자 주식회사 Electronic device including a shielding sheet and a heat radiation member
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DE102005033249B3 (en) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs
US7391617B2 (en) 2005-07-15 2008-06-24 Fujitsu Siemens Computers Gmbh Cooling arrangement for a computer system
EP1952682A2 (en) * 2005-11-01 2008-08-06 Nanoconduction Inc. Method and apparatus for establishing optimal thermal contact between opposing surfaces
EP1952682A4 (en) * 2005-11-01 2010-01-06 Nanoconduction Inc Method and apparatus for establishing optimal thermal contact between opposing surfaces
CN102413663A (en) * 2011-07-26 2012-04-11 惠州鑫长风电子有限公司 Manufacturing method of heat radiation device

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GB0411673D0 (en) 2004-06-30
JP2004363609A (en) 2004-12-24
GB2402555B (en) 2006-12-13
US20040247925A1 (en) 2004-12-09

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