FR2004508A1 - - Google Patents
Info
- Publication number
- FR2004508A1 FR2004508A1 FR6908127A FR6908127A FR2004508A1 FR 2004508 A1 FR2004508 A1 FR 2004508A1 FR 6908127 A FR6908127 A FR 6908127A FR 6908127 A FR6908127 A FR 6908127A FR 2004508 A1 FR2004508 A1 FR 2004508A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1871168 | 1968-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2004508A1 true FR2004508A1 (en) | 1969-11-28 |
Family
ID=11979221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6908127A Pending FR2004508A1 (en) | 1968-03-22 | 1969-03-20 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1914398A1 (en) |
FR (1) | FR2004508A1 (en) |
GB (1) | GB1192169A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495845A1 (en) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | CLAMPING DEVICE BETWEEN THE OVERLAPPED ELEMENTS OF ALIGNED GROUPS, IN PARTICULAR FOR THE ELECTRICAL CONNECTION OF CONDUCTIVE ELEMENTS |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686541A (en) * | 1971-07-19 | 1972-08-22 | Gen Electric | A flexible resilient member for applying a clamping force to thyristor units |
EP0100626A3 (en) * | 1982-07-29 | 1985-11-06 | LUCAS INDUSTRIES public limited company | Semi-conductor assembly |
GB2135119A (en) * | 1983-01-19 | 1984-08-22 | Westinghouse Electric Corp | Self-aligning, self-loading semiconductor clamp |
US4628219A (en) * | 1985-09-13 | 1986-12-09 | Sundstrand Corporation | Rectifier assembly for mounting in a rotor |
US20040247925A1 (en) * | 2003-06-06 | 2004-12-09 | Cromwell Stephen Daniel | Method and system for adjusting a curvature of a load plate based on a target load |
-
1969
- 1969-03-20 FR FR6908127A patent/FR2004508A1/fr active Pending
- 1969-03-21 DE DE19691914398 patent/DE1914398A1/en active Pending
- 1969-03-21 GB GB1502869A patent/GB1192169A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495845A1 (en) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | CLAMPING DEVICE BETWEEN THE OVERLAPPED ELEMENTS OF ALIGNED GROUPS, IN PARTICULAR FOR THE ELECTRICAL CONNECTION OF CONDUCTIVE ELEMENTS |
EP0055640A1 (en) * | 1980-12-05 | 1982-07-07 | Bull S.A. | Clamping device for stacked elements of aligned groups, particularly for the electrical connection of conducting elements |
Also Published As
Publication number | Publication date |
---|---|
GB1192169A (en) | 1970-05-20 |
DE1914398A1 (en) | 1969-10-02 |