GB971957A - Improvements in or relating to thermo-electric devices - Google Patents

Improvements in or relating to thermo-electric devices

Info

Publication number
GB971957A
GB971957A GB48482/62A GB4848262A GB971957A GB 971957 A GB971957 A GB 971957A GB 48482/62 A GB48482/62 A GB 48482/62A GB 4848262 A GB4848262 A GB 4848262A GB 971957 A GB971957 A GB 971957A
Authority
GB
United Kingdom
Prior art keywords
thermo
electric devices
relating
devices
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB48482/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB971957A publication Critical patent/GB971957A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Jigs For Machine Tools (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)

Abstract

971,957. Semi-conductor devices. SIEMENSSCHUCKERWERKE A.G. Dec. 21, 1962 [Dec. 21, 1961], No. 48482/62. Drawings to Specification. Heading H1K. Like ends of a plurality of thermo-electric devices are separated from a heat-exchanger by a mica wafer provided with apertures which contain adhesive to bond the devices to the heat-exchanger. The invention is used to join heat exchangers to the " hot " and " cold " ends of a Peltier device, the mica wafers being about 25 Ám thick.
GB48482/62A 1961-12-21 1962-12-21 Improvements in or relating to thermo-electric devices Expired GB971957A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES39902U DE1850462U (en) 1961-12-21 1961-12-21 INSULATING WASHER FOR THERMOCOUPLES.

Publications (1)

Publication Number Publication Date
GB971957A true GB971957A (en) 1964-10-07

Family

ID=33013206

Family Applications (1)

Application Number Title Priority Date Filing Date
GB48482/62A Expired GB971957A (en) 1961-12-21 1962-12-21 Improvements in or relating to thermo-electric devices

Country Status (3)

Country Link
DE (1) DE1850462U (en)
FR (1) FR1380434A (en)
GB (1) GB971957A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3531330A (en) * 1966-10-27 1970-09-29 Thore M Elfving Thermoelectric assemblies

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL298908A (en) * 1963-10-07
DE1639503B1 (en) * 1965-07-02 1970-06-04 Siemens Ag Method of making a thermal battery

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3531330A (en) * 1966-10-27 1970-09-29 Thore M Elfving Thermoelectric assemblies

Also Published As

Publication number Publication date
FR1380434A (en) 1964-12-04
DE1850462U (en) 1962-04-26

Similar Documents

Publication Publication Date Title
GB1183185A (en) Apparatus for Controlling the Temperature of a Living Body
FR1288835A (en) Surface heat exchange process between fluids on the one hand and granular or powdery materials on the other hand
GB971957A (en) Improvements in or relating to thermo-electric devices
FR1344299A (en) Device improving the use of radiant heat
CA967291A (en) Thermal fatigue-free semiconductor device
GB981419A (en) Improvements in or relating to thermoelectric devices
GB1070630A (en) Semiconductor thermoelectric liquid cooler
GB849550A (en) Improvements in or relating to the heat treatment of silicon
GB996174A (en) Improvements in and relating to semi-conductor thermo-electric devices
Klein Thermodynamics of thermoelectric refrigeration
KOTANCHIK et al. Description of test facilities used to develop manned spacecraft
OPPENHEIM Theoretical consideration of aerothermochemical transport phenomena, including heat and mass transfer, detonation waves and laminar flames
COSTELLO Approximation methods of solving the heat conduction equation are based on consideration of two problems, the convective fin and the plane semi-infinite solid under transient heating
Jain Heat transfer by laminar natural-convection flow of viscoelastic fluids between parallel walls
GB910063A (en) Semi-conductor devices
GB966416A (en) Improvements in or relating to semiconductors
AU4592564A (en) Improvements in or relating to devices for suppresing the thermal backflow from a heat - exchanger to the cooling stage of a cooling device equipped especially with a thermo - electric cooling element
TILTON Fluid flow and heat transfer at cryogenic temperatures, including problem of single phase and two phase flow
MALEVSKII et al. Influence of a linear distribution of heat flux on the efficiency of a thermoelectric generator(Hot junctions nonuniform heating influence on thermoelectric generator efficiency, taking into account temperature dependence of thermoelement materials properties)
MADEJSKI Effect of friction pressure on the temperature distribution in laminar channel flow
GB1104118A (en) Thermal transfer device
BOTTA Heat transfer problems in hypersonic boundaries
GB936939A (en) Improvements in or relating to thermoelectric devices
GEBHART Analysis of the heat conduction and vapor condensation between a fluid and its enclosing surface under conditions of weightlessness
WEBSTER Discussion of the advances made in high- temperature thermal protection systems