GB1126079A - A heat dissipator for an electric circuit component - Google Patents
A heat dissipator for an electric circuit componentInfo
- Publication number
- GB1126079A GB1126079A GB1577966A GB1577966A GB1126079A GB 1126079 A GB1126079 A GB 1126079A GB 1577966 A GB1577966 A GB 1577966A GB 1577966 A GB1577966 A GB 1577966A GB 1126079 A GB1126079 A GB 1126079A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plate
- wires
- wire
- undulations
- coils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 abstract 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR12342A FR1439195A (fr) | 1965-04-07 | 1965-04-07 | Dissipateur de chaleur pour composants électroniques divers, notamment pour transistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1126079A true GB1126079A (en) | 1968-09-05 |
Family
ID=8575877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1577966A Expired GB1126079A (en) | 1965-04-07 | 1966-04-07 | A heat dissipator for an electric circuit component |
Country Status (6)
| Country | Link |
|---|---|
| BE (1) | BE679248A (enrdf_load_stackoverflow) |
| DE (1) | DE1564562C3 (enrdf_load_stackoverflow) |
| ES (1) | ES325322A1 (enrdf_load_stackoverflow) |
| FR (1) | FR1439195A (enrdf_load_stackoverflow) |
| GB (1) | GB1126079A (enrdf_load_stackoverflow) |
| NL (1) | NL6604678A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4915858U (enrdf_load_stackoverflow) * | 1972-05-12 | 1974-02-09 | ||
| US4993482A (en) * | 1990-01-09 | 1991-02-19 | Microelectronics And Computer Technology Corporation | Coiled spring heat transfer element |
| US5195576A (en) * | 1990-02-28 | 1993-03-23 | Hitachi, Ltd. | Lsi cooling apparatus and computer cooling apparatus |
-
1965
- 1965-04-07 FR FR12342A patent/FR1439195A/fr not_active Expired
-
1966
- 1966-04-07 NL NL6604678A patent/NL6604678A/xx unknown
- 1966-04-07 BE BE679248D patent/BE679248A/xx unknown
- 1966-04-07 ES ES0325322A patent/ES325322A1/es not_active Expired
- 1966-04-07 DE DE19661564562 patent/DE1564562C3/de not_active Expired
- 1966-04-07 GB GB1577966A patent/GB1126079A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4915858U (enrdf_load_stackoverflow) * | 1972-05-12 | 1974-02-09 | ||
| US4993482A (en) * | 1990-01-09 | 1991-02-19 | Microelectronics And Computer Technology Corporation | Coiled spring heat transfer element |
| US5195576A (en) * | 1990-02-28 | 1993-03-23 | Hitachi, Ltd. | Lsi cooling apparatus and computer cooling apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1564562C3 (de) | 1974-04-18 |
| DE1564562B2 (de) | 1973-09-13 |
| BE679248A (enrdf_load_stackoverflow) | 1966-09-16 |
| FR1439195A (fr) | 1966-05-20 |
| NL6604678A (enrdf_load_stackoverflow) | 1966-10-10 |
| DE1564562A1 (de) | 1970-10-15 |
| ES325322A1 (es) | 1967-01-01 |
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