GB1119277A - Improvements in or relating to sputtering apparatus - Google Patents

Improvements in or relating to sputtering apparatus

Info

Publication number
GB1119277A
GB1119277A GB31941/66A GB3194166A GB1119277A GB 1119277 A GB1119277 A GB 1119277A GB 31941/66 A GB31941/66 A GB 31941/66A GB 3194166 A GB3194166 A GB 3194166A GB 1119277 A GB1119277 A GB 1119277A
Authority
GB
United Kingdom
Prior art keywords
plasma
sputtering apparatus
anode
substrate
relating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB31941/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of GB1119277A publication Critical patent/GB1119277A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Abstract

In a sputtering apparatus having an anode 31, a sputtering source 41, and a substrate 51, in which a plasma is supported in e.g. argon by providing an electric discharge between a tungsten filament 11 and the anode, an additional starter electrode 13 is provided. The provision of the <PICT:1119277/C6-C7/1> starter electrode allows the plasma to be produced at a lower pressure. The substrate may be grounded or given an A.C. or D.C. bias. The filament 11 may be water cooled and provided with a shield 19. A coil 61 porvides a magnetic field to assist in forming the plasma.
GB31941/66A 1965-07-15 1966-07-15 Improvements in or relating to sputtering apparatus Expired GB1119277A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4281565 1965-07-15

Publications (1)

Publication Number Publication Date
GB1119277A true GB1119277A (en) 1968-07-10

Family

ID=12646430

Family Applications (1)

Application Number Title Priority Date Filing Date
GB31941/66A Expired GB1119277A (en) 1965-07-15 1966-07-15 Improvements in or relating to sputtering apparatus

Country Status (2)

Country Link
US (1) US3436332A (en)
GB (1) GB1119277A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141442A (en) * 1983-05-26 1984-12-19 Secr Defence Apparatus and method for the production of metallic coatings by ion-plating

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3507774A (en) * 1967-06-02 1970-04-21 Nat Res Corp Low energy sputtering apparatus for operation below one micron pressure
US5897753A (en) 1997-05-28 1999-04-27 Advanced Energy Industries, Inc. Continuous deposition of insulating material using multiple anodes alternated between positive and negative voltages
US6818103B1 (en) 1999-10-15 2004-11-16 Advanced Energy Industries, Inc. Method and apparatus for substrate biasing in multiple electrode sputtering systems
US20050040037A1 (en) * 2003-08-20 2005-02-24 Walton Scott G. Electron beam enhanced large area deposition system
USH2209H1 (en) * 2004-04-14 2008-02-05 The United States Of America As Represented By The Secretary Of The Navy Large area metallization pretreatment and surface activation system
US9793098B2 (en) 2012-09-14 2017-10-17 Vapor Technologies, Inc. Low pressure arc plasma immersion coating vapor deposition and ion treatment
US10056237B2 (en) 2012-09-14 2018-08-21 Vapor Technologies, Inc. Low pressure arc plasma immersion coating vapor deposition and ion treatment
US9412569B2 (en) 2012-09-14 2016-08-09 Vapor Technologies, Inc. Remote arc discharge plasma assisted processes
CN104046943B (en) * 2013-03-15 2018-06-05 蒸汽技术公司 Low-tension arc plasma immersion coat vapor deposits and ion processing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305473A (en) * 1964-08-20 1967-02-21 Cons Vacuum Corp Triode sputtering apparatus for depositing uniform coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141442A (en) * 1983-05-26 1984-12-19 Secr Defence Apparatus and method for the production of metallic coatings by ion-plating

Also Published As

Publication number Publication date
US3436332A (en) 1969-04-01

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