GB1119115A - Apparatus for use in the metallic bonding of semiconductor components to supports - Google Patents

Apparatus for use in the metallic bonding of semiconductor components to supports

Info

Publication number
GB1119115A
GB1119115A GB32262/66A GB3226266A GB1119115A GB 1119115 A GB1119115 A GB 1119115A GB 32262/66 A GB32262/66 A GB 32262/66A GB 3226266 A GB3226266 A GB 3226266A GB 1119115 A GB1119115 A GB 1119115A
Authority
GB
United Kingdom
Prior art keywords
wafer
axis
mount
holder
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB32262/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB1119115A publication Critical patent/GB1119115A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB32262/66A 1965-07-16 1966-07-18 Apparatus for use in the metallic bonding of semiconductor components to supports Expired GB1119115A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES98233A DE1230916B (de) 1965-07-16 1965-07-16 Vorrichtung zum metallischen Warmverbinden von Halbleiterkoerpern mit metallischen Traegern

Publications (1)

Publication Number Publication Date
GB1119115A true GB1119115A (en) 1968-07-10

Family

ID=7521326

Family Applications (1)

Application Number Title Priority Date Filing Date
GB32262/66A Expired GB1119115A (en) 1965-07-16 1966-07-18 Apparatus for use in the metallic bonding of semiconductor components to supports

Country Status (4)

Country Link
US (1) US3439855A (enExample)
BE (1) BE682111A (enExample)
DE (1) DE1230916B (enExample)
GB (1) GB1119115A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696101A (en) * 1985-06-07 1987-09-29 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
US5715989A (en) * 1996-06-04 1998-02-10 Texas Instruments Incorporated Microelectronic wire bonding using friction welding process

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3197608A (en) * 1962-01-23 1965-07-27 Sylvania Electric Prod Method of manufacture of semiconductor devices
US3256465A (en) * 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds

Also Published As

Publication number Publication date
BE682111A (enExample) 1966-11-14
US3439855A (en) 1969-04-22
DE1230916B (de) 1966-12-22

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