GB1058050A - Masking apparatus - Google Patents
Masking apparatusInfo
- Publication number
- GB1058050A GB1058050A GB4381665A GB4381665A GB1058050A GB 1058050 A GB1058050 A GB 1058050A GB 4381665 A GB4381665 A GB 4381665A GB 4381665 A GB4381665 A GB 4381665A GB 1058050 A GB1058050 A GB 1058050A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plate
- substrate
- moved
- frame
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
<PICT:1058050/C6-C7/1> In the vapour deposition of a metal or dielectric material on a substrate which is moved on a frame through a series of vacuum chambers separated by seals, the frame is moved intermittently by a reciprocating slide, Fig.3 (not shown), and the substrate 47 is supported in a hole 50 in a plate 22 by lugs 51 on a plate 46. A mask 14 is carried by a support 48 and is moved vertically through the hole in the plate 22 to allow it to be clamped against the substrate, and inclined guides 37 position the substrate correctly. The subtrate is heated before or during coating by a plate 15. To form a capacitance-resistance network, Au or Cr is deposited on the base, then a Ni-Cr alloy, followed by Al, silicon monoxide and Al.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4381665A GB1058050A (en) | 1965-10-15 | 1965-10-15 | Masking apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4381665A GB1058050A (en) | 1965-10-15 | 1965-10-15 | Masking apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1058050A true GB1058050A (en) | 1967-02-08 |
Family
ID=10430415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4381665A Expired GB1058050A (en) | 1965-10-15 | 1965-10-15 | Masking apparatus |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1058050A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3747558A (en) * | 1972-11-03 | 1973-07-24 | Us Air Force | Cross-mounted mask changer with thickness monitoring |
WO2013026493A1 (en) * | 2011-08-25 | 2013-02-28 | Applied Materials, Inc. | Corner cut mask |
-
1965
- 1965-10-15 GB GB4381665A patent/GB1058050A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3747558A (en) * | 1972-11-03 | 1973-07-24 | Us Air Force | Cross-mounted mask changer with thickness monitoring |
WO2013026493A1 (en) * | 2011-08-25 | 2013-02-28 | Applied Materials, Inc. | Corner cut mask |
CN103781935A (en) * | 2011-08-25 | 2014-05-07 | 应用材料公司 | Corner cut mask |
JP2014529011A (en) * | 2011-08-25 | 2014-10-30 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Mask structure, apparatus and method for depositing a layer on a rectangular substrate |
CN103781935B (en) * | 2011-08-25 | 2017-07-11 | 应用材料公司 | To sedimentary in the mask structure on substrate, device and method |
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